TW200739843A - Substrate cooling device, substrate cooling method, and computer readable storage medium - Google Patents
Substrate cooling device, substrate cooling method, and computer readable storage mediumInfo
- Publication number
- TW200739843A TW200739843A TW095147439A TW95147439A TW200739843A TW 200739843 A TW200739843 A TW 200739843A TW 095147439 A TW095147439 A TW 095147439A TW 95147439 A TW95147439 A TW 95147439A TW 200739843 A TW200739843 A TW 200739843A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate cooling
- substrate
- storage medium
- computer readable
- readable storage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Tunnel Furnaces (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006015251A JP4537324B2 (ja) | 2006-01-24 | 2006-01-24 | 基板冷却装置、基板冷却方法、制御プログラム、コンピュータ読取可能な記憶媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200739843A true TW200739843A (en) | 2007-10-16 |
TWI325168B TWI325168B (ja) | 2010-05-21 |
Family
ID=38455307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095147439A TW200739843A (en) | 2006-01-24 | 2006-12-18 | Substrate cooling device, substrate cooling method, and computer readable storage medium |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4537324B2 (ja) |
KR (1) | KR101299763B1 (ja) |
CN (1) | CN100521078C (ja) |
TW (1) | TW200739843A (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4542577B2 (ja) * | 2007-09-19 | 2010-09-15 | 東京エレクトロン株式会社 | 常圧乾燥装置及び基板処理装置及び基板処理方法 |
JP2009158792A (ja) * | 2007-12-27 | 2009-07-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
KR100921523B1 (ko) * | 2008-05-30 | 2009-10-12 | 세메스 주식회사 | 평판 디스플레이 제조에 사용되는 기판 처리 장치 및 방법 |
JP4675401B2 (ja) * | 2008-08-29 | 2011-04-20 | 東京エレクトロン株式会社 | 基板搬送装置 |
JP5635378B2 (ja) * | 2010-11-30 | 2014-12-03 | 日東電工株式会社 | 半導体ウエハ搬送方法および半導体ウエハ搬送装置 |
KR101105387B1 (ko) * | 2010-12-13 | 2012-01-16 | 주식회사 에스아이이 | 기판 건조장치 |
CN102651303B (zh) * | 2011-05-09 | 2014-12-10 | 京东方科技集团股份有限公司 | 基板温度管控系统及方法 |
JP2013098300A (ja) * | 2011-10-31 | 2013-05-20 | Tokyo Electron Ltd | 熱処理装置および熱処理方法 |
JP6964005B2 (ja) * | 2018-01-09 | 2021-11-10 | 東京エレクトロン株式会社 | 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体 |
CN108842143A (zh) * | 2018-07-09 | 2018-11-20 | 上海新昇半导体科技有限公司 | 外延炉冷却系统及冷却方法 |
WO2020148877A1 (ja) * | 2019-01-17 | 2020-07-23 | 住友電工ウインテック株式会社 | 導体軟化処理装置及び導体軟化処理方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0715873B2 (ja) * | 1983-11-30 | 1995-02-22 | 株式会社東芝 | レジストパターン形成方法 |
JPS6119131A (ja) * | 1984-07-06 | 1986-01-28 | Toshiba Corp | レジスト処理装置 |
JPS6428918A (en) * | 1987-07-24 | 1989-01-31 | Mitsubishi Electric Corp | Resist baking device |
JP3872535B2 (ja) * | 1996-03-14 | 2007-01-24 | 株式会社オーク製作所 | ワークの電荷の消去中和装置 |
DE19983950T1 (de) * | 1999-04-27 | 2002-08-01 | Mitsubishi Electric Corp | Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium |
JP3416078B2 (ja) * | 1999-06-09 | 2003-06-16 | 東京エレクトロン株式会社 | 基板処理装置 |
TW449802B (en) * | 1999-07-19 | 2001-08-11 | Tokyo Electron Ltd | Method and apparatus of substrate treatment |
JP4380966B2 (ja) * | 2002-05-20 | 2009-12-09 | 富士フイルム株式会社 | 感光層転写方法および装置 |
JP2004299850A (ja) * | 2003-03-31 | 2004-10-28 | Dainippon Printing Co Ltd | 処理方法及び処理装置 |
-
2006
- 2006-01-24 JP JP2006015251A patent/JP4537324B2/ja not_active Expired - Fee Related
- 2006-12-18 TW TW095147439A patent/TW200739843A/zh not_active IP Right Cessation
-
2007
- 2007-01-24 CN CNB2007100043562A patent/CN100521078C/zh not_active Expired - Fee Related
- 2007-01-24 KR KR1020070007599A patent/KR101299763B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN100521078C (zh) | 2009-07-29 |
CN101009210A (zh) | 2007-08-01 |
KR101299763B1 (ko) | 2013-08-23 |
JP2007200994A (ja) | 2007-08-09 |
TWI325168B (ja) | 2010-05-21 |
JP4537324B2 (ja) | 2010-09-01 |
KR20070077793A (ko) | 2007-07-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |