KR101274794B1 - 고체촬상소자, 고체촬상장치 및 그 제조방법 - Google Patents
고체촬상소자, 고체촬상장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR101274794B1 KR101274794B1 KR1020090101455A KR20090101455A KR101274794B1 KR 101274794 B1 KR101274794 B1 KR 101274794B1 KR 1020090101455 A KR1020090101455 A KR 1020090101455A KR 20090101455 A KR20090101455 A KR 20090101455A KR 101274794 B1 KR101274794 B1 KR 101274794B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive
- region
- semiconductor layer
- planar semiconductor
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/151—Geometry or disposition of pixel elements, address lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| WOPCT/JP2008/069321 | 2008-10-24 | ||
| PCT/JP2008/069321 WO2010046994A1 (ja) | 2008-10-24 | 2008-10-24 | 固体撮像素子、固体撮像装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100045944A KR20100045944A (ko) | 2010-05-04 |
| KR101274794B1 true KR101274794B1 (ko) | 2013-06-13 |
Family
ID=41506530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090101455A Expired - Fee Related KR101274794B1 (ko) | 2008-10-24 | 2009-10-23 | 고체촬상소자, 고체촬상장치 및 그 제조방법 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP2180516A3 (enExample) |
| JP (1) | JP5311666B2 (enExample) |
| KR (1) | KR101274794B1 (enExample) |
| CN (1) | CN101728410B (enExample) |
| SG (1) | SG161176A1 (enExample) |
| TW (1) | TWI538182B (enExample) |
| WO (2) | WO2010046994A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202010016472U1 (de) | 2009-12-15 | 2011-03-24 | Isensee, Gerrit Ragnar Ulrich Friedrich, Maspalomas | Modul zur Simulation einer belegten Sitzkontaktmatte in Fahrzeugen |
| JP2024069731A (ja) * | 2021-03-17 | 2024-05-22 | ソニーセミコンダクタソリューションズ株式会社 | 光電変換素子及び撮像装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697416A (ja) * | 1992-09-14 | 1994-04-08 | Toshiba Corp | 固体撮像装置及びその製造方法 |
| KR19990030904A (ko) * | 1997-10-07 | 1999-05-06 | 윤종용 | 전하 결합형 고체 촬상소자 및 그 제조 방법 |
| JP2000196060A (ja) | 1998-12-24 | 2000-07-14 | Nec Corp | 固体撮像装置およびその製造方法 |
| KR100690884B1 (ko) * | 2005-04-28 | 2007-03-09 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59129463A (ja) * | 1983-01-14 | 1984-07-25 | Nec Corp | 固体撮像装置 |
| JPH01168059A (ja) * | 1987-12-24 | 1989-07-03 | Fuji Photo Film Co Ltd | 固体撮像素子 |
| JP2517375B2 (ja) * | 1988-12-19 | 1996-07-24 | 三菱電機株式会社 | 固体撮像装置および該装置に用いられる電荷転送装置ならびにその製造方法 |
| JPH02278874A (ja) * | 1989-04-20 | 1990-11-15 | Hitachi Ltd | 固体撮像素子及びその製造方法 |
| JPH02304976A (ja) * | 1989-05-19 | 1990-12-18 | Nec Corp | 固体撮像素子 |
| JPH03161970A (ja) * | 1989-11-21 | 1991-07-11 | Toshiba Corp | 固体撮像装置 |
| JP2719027B2 (ja) * | 1990-04-02 | 1998-02-25 | 松下電子工業株式会社 | 電荷転送素子の製造方法 |
| JPH06252375A (ja) * | 1993-03-01 | 1994-09-09 | Hitachi Ltd | 固体撮像装置 |
| JPH06268189A (ja) * | 1993-03-15 | 1994-09-22 | Toshiba Corp | 固体撮像装置 |
| JPH10107249A (ja) * | 1996-09-27 | 1998-04-24 | Sony Corp | 固体撮像素子の製造方法 |
| JPH10189936A (ja) * | 1996-12-26 | 1998-07-21 | Sony Corp | 固体撮像素子及びその製造方法 |
| JP3152300B2 (ja) | 1998-09-17 | 2001-04-03 | 日本電気株式会社 | 固体撮像素子及びその製造方法 |
| JP2001308309A (ja) * | 2000-04-26 | 2001-11-02 | Sony Corp | 固体撮像素子及びその製造方法 |
| EP1341235A3 (en) * | 2002-02-28 | 2006-05-10 | Canon Kabushiki Kaisha | Image pickup apparatus |
| JP2008112831A (ja) * | 2006-10-30 | 2008-05-15 | Fujifilm Corp | 固体撮像素子及びこれを備えた撮像装置 |
| JP5114968B2 (ja) * | 2007-02-20 | 2013-01-09 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
-
2008
- 2008-10-24 WO PCT/JP2008/069321 patent/WO2010046994A1/ja not_active Ceased
-
2009
- 2009-10-16 SG SG200906919-6A patent/SG161176A1/en unknown
- 2009-10-21 TW TW098135560A patent/TWI538182B/zh active
- 2009-10-23 JP JP2009244179A patent/JP5311666B2/ja not_active Expired - Fee Related
- 2009-10-23 EP EP09173948.2A patent/EP2180516A3/en not_active Withdrawn
- 2009-10-23 KR KR1020090101455A patent/KR101274794B1/ko not_active Expired - Fee Related
- 2009-10-26 WO PCT/JP2009/068320 patent/WO2010047412A1/ja not_active Ceased
- 2009-10-26 CN CN2009101806404A patent/CN101728410B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697416A (ja) * | 1992-09-14 | 1994-04-08 | Toshiba Corp | 固体撮像装置及びその製造方法 |
| KR19990030904A (ko) * | 1997-10-07 | 1999-05-06 | 윤종용 | 전하 결합형 고체 촬상소자 및 그 제조 방법 |
| JP2000196060A (ja) | 1998-12-24 | 2000-07-14 | Nec Corp | 固体撮像装置およびその製造方法 |
| KR100690884B1 (ko) * | 2005-04-28 | 2007-03-09 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010046994A1 (ja) | 2010-04-29 |
| JP2010103540A (ja) | 2010-05-06 |
| SG161176A1 (en) | 2010-05-27 |
| CN101728410B (zh) | 2013-10-30 |
| WO2010047412A1 (ja) | 2010-04-29 |
| KR20100045944A (ko) | 2010-05-04 |
| JP5311666B2 (ja) | 2013-10-09 |
| TW201017875A (en) | 2010-05-01 |
| EP2180516A3 (en) | 2013-10-23 |
| CN101728410A (zh) | 2010-06-09 |
| EP2180516A2 (en) | 2010-04-28 |
| TWI538182B (zh) | 2016-06-11 |
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