KR101246638B1 - 플랫-탑 패드의 제조방법 - Google Patents

플랫-탑 패드의 제조방법 Download PDF

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Publication number
KR101246638B1
KR101246638B1 KR1020067008154A KR20067008154A KR101246638B1 KR 101246638 B1 KR101246638 B1 KR 101246638B1 KR 1020067008154 A KR1020067008154 A KR 1020067008154A KR 20067008154 A KR20067008154 A KR 20067008154A KR 101246638 B1 KR101246638 B1 KR 101246638B1
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South Korea
Prior art keywords
flat
composition
component
attachment
stencil
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Expired - Fee Related
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KR1020067008154A
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English (en)
Korean (ko)
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KR20060110871A (ko
Inventor
데브라 솔리즈
영 이
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다우 코닝 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/231—Configurations of stacked chips the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020067008154A 2003-10-28 2004-08-03 플랫-탑 패드의 제조방법 Expired - Fee Related KR101246638B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51510903P 2003-10-28 2003-10-28
US60/515,109 2003-10-28
PCT/US2004/025044 WO2005045903A2 (en) 2003-10-28 2004-08-03 Method for making a flat-top pad

Publications (2)

Publication Number Publication Date
KR20060110871A KR20060110871A (ko) 2006-10-25
KR101246638B1 true KR101246638B1 (ko) 2013-03-25

Family

ID=34572805

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067008154A Expired - Fee Related KR101246638B1 (ko) 2003-10-28 2004-08-03 플랫-탑 패드의 제조방법

Country Status (6)

Country Link
US (1) US7485202B2 (https=)
EP (1) EP1680811A2 (https=)
JP (2) JP2007510306A (https=)
KR (1) KR101246638B1 (https=)
TW (1) TW200523115A (https=)
WO (1) WO2005045903A2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7544539B2 (en) * 2005-12-29 2009-06-09 Asm Technology Singapore Pte Ltd. Forced heat transfer apparatus for heating stacked dice
JP2007258317A (ja) * 2006-03-22 2007-10-04 Shin Etsu Chem Co Ltd 半導体装置の製造方法
EP1954114A1 (en) * 2006-09-30 2008-08-06 Umicore AG & Co. KG Use of an adhesive composition for die-attaching high power semiconductors
US7834083B2 (en) * 2006-10-11 2010-11-16 Samsung Electro-Mechanics Co., Ltd. Nanocomposite composition comprising transparent nanoparticles
TWI456707B (zh) * 2008-01-28 2014-10-11 瑞薩電子股份有限公司 半導體裝置及其製造方法
DE102008024704A1 (de) * 2008-04-17 2009-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
JP2012104790A (ja) * 2010-10-12 2012-05-31 Elpida Memory Inc 半導体装置
JP5348147B2 (ja) * 2011-01-11 2013-11-20 信越化学工業株式会社 仮接着材組成物、及び薄型ウエハの製造方法
WO2012128875A1 (en) * 2011-03-22 2012-09-27 Dow Corning Corporation Thermal management within an led assembly
KR101381119B1 (ko) * 2012-12-28 2014-04-04 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
US9269647B2 (en) * 2014-05-29 2016-02-23 Samsung Electronics Co., Ltd. Semiconductor package having heat dissipating member
JP6620703B2 (ja) * 2016-08-16 2019-12-18 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法
WO2019130956A1 (ja) 2017-12-29 2019-07-04 ソニーセミコンダクタソリューションズ株式会社 発光モジュール、表示装置、および、それらの製造方法
EP4369393A1 (de) * 2022-11-10 2024-05-15 Siemens Aktiengesellschaft Halbleiteranordnung mit einem schaltbaren halbleiterelement und verfahren zur herstellung derselben

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0049379A1 (de) * 1980-10-04 1982-04-14 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Herstellung eines die Proliferationsrate von Leberzellen stimulierenden Faktors
US6089151A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Method and stencil for extruding material on a substrate
US6212767B1 (en) * 1999-08-31 2001-04-10 Micron Technology, Inc. Assembling a stacked die package
US6336974B1 (en) * 1997-08-05 2002-01-08 Micron Technology, Inc. Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2676182A (en) * 1950-09-13 1954-04-20 Dow Corning Copolymeric siloxanes and methods of preparing them
US3296291A (en) * 1962-07-02 1967-01-03 Gen Electric Reaction of silanes with unsaturated olefinic compounds
US3220972A (en) * 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3159601A (en) * 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
NL131800C (https=) * 1965-05-17
NL129346C (https=) * 1966-06-23
US3516946A (en) * 1967-09-29 1970-06-23 Gen Electric Platinum catalyst composition for hydrosilation reactions
US3814730A (en) * 1970-08-06 1974-06-04 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
US3989667A (en) * 1974-12-02 1976-11-02 Dow Corning Corporation Olefinic siloxanes as platinum inhibitors
US3989668A (en) * 1975-07-14 1976-11-02 Dow Corning Corporation Method of making a silicone elastomer and the elastomer prepared thereby
JPS591241B2 (ja) * 1978-06-30 1984-01-11 而至歯科工業株式会社 歯科用シリコ−ン組成物およびその使用法
JPS58222531A (ja) * 1982-06-18 1983-12-24 Hitachi Ltd ペレツトボンデイング方法
US4591622A (en) * 1984-10-29 1986-05-27 Dow Corning Corporation Silicone pressure-sensitive adhesive process and product thereof
US4584355A (en) * 1984-10-29 1986-04-22 Dow Corning Corporation Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-I
US4585836A (en) * 1984-10-29 1986-04-29 Dow Corning Corporation Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-II
US4584361A (en) * 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
US4784879A (en) * 1987-07-20 1988-11-15 Dow Corning Corporation Method for preparing a microencapsulated compound of a platinum group metal
JP2630993B2 (ja) 1988-06-23 1997-07-16 東レ・ダウコーニング・シリコーン株式会社 ヒドロシリル化反応用白金系触媒含有粒状物およびその製造方法
JPH0214244A (ja) * 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JPH0312940A (ja) * 1989-06-12 1991-01-21 Nec Corp ペレットのマウント方法
US5036117A (en) * 1989-11-03 1991-07-30 Dow Corning Corporation Heat-curable silicone compositions having improved bath life
JPH04222871A (ja) 1990-12-25 1992-08-12 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP3270489B2 (ja) 1991-01-30 2002-04-02 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
GB9103191D0 (en) * 1991-02-14 1991-04-03 Dow Corning Platinum complexes and use thereof
US5248715A (en) * 1992-07-30 1993-09-28 Dow Corning Corporation Self-adhering silicone rubber with low compression set
JP2816084B2 (ja) * 1992-10-26 1998-10-27 三洋電機株式会社 半田塗布方法、半導体装置の製造方法およびスキージ
US5548091A (en) * 1993-10-26 1996-08-20 Tessera, Inc. Semiconductor chip connection components with adhesives and methods for bonding to the chip
US5684060A (en) * 1996-04-09 1997-11-04 Minnesota Mining And Manufacturing Company Compositions containing inorganic, organic and organometallic palladium hydrogen scavengers
JP2925074B2 (ja) * 1996-11-08 1999-07-26 三星電子株式会社 Ｌｏｃ型半導体チップパッケージ及びその製造方法
EP0850997A3 (en) 1996-12-24 2001-03-14 Dow Corning Corporation Filled addition curable compositions having reduced gassing and increased shelf stability
JP3339808B2 (ja) * 1997-08-29 2002-10-28 株式会社三井ハイテック 半導体装置の製造方法及び半導体装置製造用マスク
JPH1178274A (ja) * 1997-09-10 1999-03-23 Mitsui High Tec Inc エラストマー塗布用マスク
US6034441A (en) * 1997-11-26 2000-03-07 Lucent Technologies, Inc. Overcast semiconductor package
WO2000005652A1 (en) 1998-07-24 2000-02-03 Sun Microsystems, Inc. Method and apparatus for achieving deterministic memory allocation response in a computer system
US6369185B1 (en) * 1999-03-31 2002-04-09 Dow Corning Toray Silicone Co., Ltd. Curable organopolysiloxane composition, cured products formed therefrom and unified articles
SG122743A1 (en) * 2001-08-21 2006-06-29 Micron Technology Inc Microelectronic devices and methods of manufacture
JP2003115501A (ja) * 2001-10-09 2003-04-18 Dow Corning Toray Silicone Co Ltd 架橋シリコーン系接着性シートおよび半導体装置
US6793759B2 (en) * 2001-10-09 2004-09-21 Dow Corning Corporation Method for creating adhesion during fabrication of electronic devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0049379A1 (de) * 1980-10-04 1982-04-14 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Herstellung eines die Proliferationsrate von Leberzellen stimulierenden Faktors
US6336974B1 (en) * 1997-08-05 2002-01-08 Micron Technology, Inc. Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
US6089151A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Method and stencil for extruding material on a substrate
US6212767B1 (en) * 1999-08-31 2001-04-10 Micron Technology, Inc. Assembling a stacked die package

Also Published As

Publication number Publication date
KR20060110871A (ko) 2006-10-25
JP2013051428A (ja) 2013-03-14
WO2005045903A3 (en) 2005-07-21
US20060254712A1 (en) 2006-11-16
TW200523115A (en) 2005-07-16
WO2005045903A2 (en) 2005-05-19
WO2005045903B1 (en) 2005-10-06
US7485202B2 (en) 2009-02-03
EP1680811A2 (en) 2006-07-19
JP2007510306A (ja) 2007-04-19

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