JP2007510306A - 平坦な上面を有するパッドの製造方法 - Google Patents

平坦な上面を有するパッドの製造方法 Download PDF

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Publication number
JP2007510306A
JP2007510306A JP2006537969A JP2006537969A JP2007510306A JP 2007510306 A JP2007510306 A JP 2007510306A JP 2006537969 A JP2006537969 A JP 2006537969A JP 2006537969 A JP2006537969 A JP 2006537969A JP 2007510306 A JP2007510306 A JP 2007510306A
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JP
Japan
Prior art keywords
top surface
composition
stencil
flat top
substrate
Prior art date
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Pending
Application number
JP2006537969A
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English (en)
Japanese (ja)
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JP2007510306A5 (https=
Inventor
ソリズ、デブラ
リー、ヨン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
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Dow Corning Corp
Dow Silicones Corp
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Publication date
Application filed by Dow Corning Corp, Dow Silicones Corp filed Critical Dow Corning Corp
Publication of JP2007510306A publication Critical patent/JP2007510306A/ja
Publication of JP2007510306A5 publication Critical patent/JP2007510306A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/231—Configurations of stacked chips the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2006537969A 2003-10-28 2004-08-03 平坦な上面を有するパッドの製造方法 Pending JP2007510306A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51510903P 2003-10-28 2003-10-28
PCT/US2004/025044 WO2005045903A2 (en) 2003-10-28 2004-08-03 Method for making a flat-top pad

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012231885A Division JP2013051428A (ja) 2003-10-28 2012-10-19 基板に組成物の平坦な上面を有する堆積物を塗布することを包含する方法

Publications (2)

Publication Number Publication Date
JP2007510306A true JP2007510306A (ja) 2007-04-19
JP2007510306A5 JP2007510306A5 (https=) 2010-09-02

Family

ID=34572805

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006537969A Pending JP2007510306A (ja) 2003-10-28 2004-08-03 平坦な上面を有するパッドの製造方法
JP2012231885A Pending JP2013051428A (ja) 2003-10-28 2012-10-19 基板に組成物の平坦な上面を有する堆積物を塗布することを包含する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012231885A Pending JP2013051428A (ja) 2003-10-28 2012-10-19 基板に組成物の平坦な上面を有する堆積物を塗布することを包含する方法

Country Status (6)

Country Link
US (1) US7485202B2 (https=)
EP (1) EP1680811A2 (https=)
JP (2) JP2007510306A (https=)
KR (1) KR101246638B1 (https=)
TW (1) TW200523115A (https=)
WO (1) WO2005045903A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206482A (ja) * 2008-01-28 2009-09-10 Renesas Technology Corp 半導体装置およびその製造方法
JP2012144616A (ja) * 2011-01-11 2012-08-02 Shin-Etsu Chemical Co Ltd 仮接着材組成物、及び薄型ウエハの製造方法
JP2014517440A (ja) * 2011-03-22 2014-07-17 ダウ コーニング コーポレーション Ｌｅｄアセンブリ内の熱管理方法
JP2018027997A (ja) * 2016-08-16 2018-02-22 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法

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US7544539B2 (en) * 2005-12-29 2009-06-09 Asm Technology Singapore Pte Ltd. Forced heat transfer apparatus for heating stacked dice
JP2007258317A (ja) * 2006-03-22 2007-10-04 Shin Etsu Chem Co Ltd 半導体装置の製造方法
EP1954114A1 (en) * 2006-09-30 2008-08-06 Umicore AG & Co. KG Use of an adhesive composition for die-attaching high power semiconductors
US7834083B2 (en) * 2006-10-11 2010-11-16 Samsung Electro-Mechanics Co., Ltd. Nanocomposite composition comprising transparent nanoparticles
DE102008024704A1 (de) * 2008-04-17 2009-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
JP2012104790A (ja) * 2010-10-12 2012-05-31 Elpida Memory Inc 半導体装置
KR101381119B1 (ko) * 2012-12-28 2014-04-04 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
US9269647B2 (en) * 2014-05-29 2016-02-23 Samsung Electronics Co., Ltd. Semiconductor package having heat dissipating member
WO2019130956A1 (ja) 2017-12-29 2019-07-04 ソニーセミコンダクタソリューションズ株式会社 発光モジュール、表示装置、および、それらの製造方法
EP4369393A1 (de) * 2022-11-10 2024-05-15 Siemens Aktiengesellschaft Halbleiteranordnung mit einem schaltbaren halbleiterelement und verfahren zur herstellung derselben

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JPH06196516A (ja) * 1992-10-26 1994-07-15 Sanyo Electric Co Ltd 半田塗布方法、半導体装置の製造方法およびスキージ
JPH10144703A (ja) * 1996-11-08 1998-05-29 Samsung Electron Co Ltd Ｌｏｃ型半導体チップパッケージ及びその製造方法
JPH1174289A (ja) * 1997-08-29 1999-03-16 Mitsui High Tec Inc 半導体装置の製造方法及び半導体装置製造用マスク
JPH1178274A (ja) * 1997-09-10 1999-03-23 Mitsui High Tec Inc エラストマー塗布用マスク

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JPS58222531A (ja) * 1982-06-18 1983-12-24 Hitachi Ltd ペレツトボンデイング方法
JPH0312940A (ja) * 1989-06-12 1991-01-21 Nec Corp ペレットのマウント方法
JPH06196516A (ja) * 1992-10-26 1994-07-15 Sanyo Electric Co Ltd 半田塗布方法、半導体装置の製造方法およびスキージ
JPH10144703A (ja) * 1996-11-08 1998-05-29 Samsung Electron Co Ltd Ｌｏｃ型半導体チップパッケージ及びその製造方法
JPH1174289A (ja) * 1997-08-29 1999-03-16 Mitsui High Tec Inc 半導体装置の製造方法及び半導体装置製造用マスク
JPH1178274A (ja) * 1997-09-10 1999-03-23 Mitsui High Tec Inc エラストマー塗布用マスク

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206482A (ja) * 2008-01-28 2009-09-10 Renesas Technology Corp 半導体装置およびその製造方法
JP2012144616A (ja) * 2011-01-11 2012-08-02 Shin-Etsu Chemical Co Ltd 仮接着材組成物、及び薄型ウエハの製造方法
JP2014517440A (ja) * 2011-03-22 2014-07-17 ダウ コーニング コーポレーション Ｌｅｄアセンブリ内の熱管理方法
JP2018027997A (ja) * 2016-08-16 2018-02-22 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法

Also Published As

Publication number Publication date
KR20060110871A (ko) 2006-10-25
JP2013051428A (ja) 2013-03-14
WO2005045903A3 (en) 2005-07-21
US20060254712A1 (en) 2006-11-16
TW200523115A (en) 2005-07-16
WO2005045903A2 (en) 2005-05-19
WO2005045903B1 (en) 2005-10-06
US7485202B2 (en) 2009-02-03
EP1680811A2 (en) 2006-07-19
KR101246638B1 (ko) 2013-03-25

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