KR101224943B1 - 전계효과형 트랜지스터 및 그 제조방법 - Google Patents
전계효과형 트랜지스터 및 그 제조방법 Download PDFInfo
- Publication number
- KR101224943B1 KR101224943B1 KR1020090094184A KR20090094184A KR101224943B1 KR 101224943 B1 KR101224943 B1 KR 101224943B1 KR 1020090094184 A KR1020090094184 A KR 1020090094184A KR 20090094184 A KR20090094184 A KR 20090094184A KR 101224943 B1 KR101224943 B1 KR 101224943B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- oxynitride
- film
- nitrogen
- oxide semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
Landscapes
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2008-261878 | 2008-10-08 | ||
| JP2008261878A JP5430113B2 (ja) | 2008-10-08 | 2008-10-08 | 電界効果型トランジスタ及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100039806A KR20100039806A (ko) | 2010-04-16 |
| KR101224943B1 true KR101224943B1 (ko) | 2013-01-22 |
Family
ID=41445710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090094184A Expired - Fee Related KR101224943B1 (ko) | 2008-10-08 | 2009-10-05 | 전계효과형 트랜지스터 및 그 제조방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8164090B2 (enExample) |
| EP (1) | EP2175493B1 (enExample) |
| JP (1) | JP5430113B2 (enExample) |
| KR (1) | KR101224943B1 (enExample) |
| CN (1) | CN101719514B (enExample) |
| AT (1) | ATE555503T1 (enExample) |
Families Citing this family (111)
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|---|---|---|---|---|
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| WO2009117438A2 (en) * | 2008-03-20 | 2009-09-24 | Applied Materials, Inc. | Process to make metal oxide thin film transistor array with etch stopping layer |
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| CN110137355B (zh) * | 2019-05-15 | 2021-05-25 | 华东师范大学 | 一种改进亚阈值摆幅和开关比的有机薄膜晶体管及制备方法 |
| JP7209043B2 (ja) * | 2019-06-12 | 2023-01-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN112530978B (zh) * | 2020-12-01 | 2024-02-13 | 京东方科技集团股份有限公司 | 开关器件结构及其制备方法、薄膜晶体管膜层、显示面板 |
| CN114152857A (zh) * | 2021-12-07 | 2022-03-08 | 华东师范大学 | 一种二维材料场效应晶体管失效样品的制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070002251A1 (en) * | 2005-07-04 | 2007-01-04 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and method for manufacturing the same |
| KR20080053355A (ko) * | 2005-09-06 | 2008-06-12 | 캐논 가부시끼가이샤 | 아몰퍼스 산화물막을 채널층에 이용한 전계 효과트랜지스터, 아몰퍼스 산화물막을 채널층에 이용한 전계효과 트랜지스터의 제조 방법 및 아몰퍼스 산화물막의 제조방법 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3423896B2 (ja) * | 1999-03-25 | 2003-07-07 | 科学技術振興事業団 | 半導体デバイス |
| JP2003060576A (ja) | 2001-08-22 | 2003-02-28 | Nec Corp | 偏波スクランブラユニット及びこれを用いた多中継伝送システム |
| TWI221340B (en) * | 2003-05-30 | 2004-09-21 | Ind Tech Res Inst | Thin film transistor and method for fabricating thereof |
| KR101019337B1 (ko) * | 2004-03-12 | 2011-03-07 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
| CA2585190A1 (en) * | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| CN101057333B (zh) * | 2004-11-10 | 2011-11-16 | 佳能株式会社 | 发光器件 |
| EP1998374A3 (en) | 2005-09-29 | 2012-01-18 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
| KR101358954B1 (ko) * | 2005-11-15 | 2014-02-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 다이오드 및 액티브 매트릭스 표시장치 |
| JP5250929B2 (ja) | 2005-11-30 | 2013-07-31 | 凸版印刷株式会社 | トランジスタおよびその製造方法 |
| JP2007220818A (ja) * | 2006-02-15 | 2007-08-30 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタ及びその製法 |
| JP2007250982A (ja) * | 2006-03-17 | 2007-09-27 | Canon Inc | 酸化物半導体を用いた薄膜トランジスタ及び表示装置 |
| JP5110803B2 (ja) | 2006-03-17 | 2012-12-26 | キヤノン株式会社 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
| JP5016831B2 (ja) * | 2006-03-17 | 2012-09-05 | キヤノン株式会社 | 酸化物半導体薄膜トランジスタを用いた発光素子及びこれを用いた画像表示装置 |
| JP4404881B2 (ja) * | 2006-08-09 | 2010-01-27 | 日本電気株式会社 | 薄膜トランジスタアレイ、その製造方法及び液晶表示装置 |
| JP2008112909A (ja) | 2006-10-31 | 2008-05-15 | Kochi Prefecture Sangyo Shinko Center | 薄膜半導体装置及びその製造方法 |
| JP2008276212A (ja) | 2007-04-05 | 2008-11-13 | Fujifilm Corp | 有機電界発光表示装置 |
| WO2008133345A1 (en) | 2007-04-25 | 2008-11-06 | Canon Kabushiki Kaisha | Oxynitride semiconductor |
-
2008
- 2008-10-08 JP JP2008261878A patent/JP5430113B2/ja not_active Expired - Fee Related
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- 2009-09-29 CN CN2009102044658A patent/CN101719514B/zh not_active Expired - Fee Related
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070002251A1 (en) * | 2005-07-04 | 2007-01-04 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and method for manufacturing the same |
| KR20080053355A (ko) * | 2005-09-06 | 2008-06-12 | 캐논 가부시끼가이샤 | 아몰퍼스 산화물막을 채널층에 이용한 전계 효과트랜지스터, 아몰퍼스 산화물막을 채널층에 이용한 전계효과 트랜지스터의 제조 방법 및 아몰퍼스 산화물막의 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100039806A (ko) | 2010-04-16 |
| CN101719514B (zh) | 2012-06-27 |
| EP2175493A1 (en) | 2010-04-14 |
| US20100084655A1 (en) | 2010-04-08 |
| CN101719514A (zh) | 2010-06-02 |
| JP5430113B2 (ja) | 2014-02-26 |
| EP2175493B1 (en) | 2012-04-25 |
| JP2010093070A (ja) | 2010-04-22 |
| US8164090B2 (en) | 2012-04-24 |
| ATE555503T1 (de) | 2012-05-15 |
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