KR101213375B1 - 처리액 혼합 장치, 기판 처리 장치, 처리액 혼합 방법 및 컴퓨터 판독 가능한 기억 매체 - Google Patents

처리액 혼합 장치, 기판 처리 장치, 처리액 혼합 방법 및 컴퓨터 판독 가능한 기억 매체 Download PDF

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KR101213375B1
KR101213375B1 KR1020090002201A KR20090002201A KR101213375B1 KR 101213375 B1 KR101213375 B1 KR 101213375B1 KR 1020090002201 A KR1020090002201 A KR 1020090002201A KR 20090002201 A KR20090002201 A KR 20090002201A KR 101213375 B1 KR101213375 B1 KR 101213375B1
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supply
flow rate
raw material
flow
mixing tank
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Korean (ko)
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KR20090080476A (ko
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게이고 사타케
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/80—Mixing plants; Combinations of mixers
    • B01F33/84—Mixing plants with mixing receptacles receiving material dispensed from several component receptacles, e.g. paint tins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/20—Measuring; Control or regulation
    • B01F35/22—Control or regulation
    • B01F35/221—Control or regulation of operational parameters, e.g. level of material in the mixer, temperature or pressure
    • B01F35/2211—Amount of delivered fluid during a period
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/88—Forming a predetermined ratio of the substances to be mixed by feeding the materials batchwise
    • B01F35/883—Forming a predetermined ratio of the substances to be mixed by feeding the materials batchwise using flow rate controls for feeding the substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
    • B01F2101/58—Mixing semiconducting materials, e.g. during semiconductor or wafer manufacturing processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87652—With means to promote mixing or combining of plural fluids
    • Y10T137/8766—With selectively operated flow control means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control
    • Y10T137/87684—Valve in each inlet

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Accessories For Mixers (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020090002201A 2008-01-21 2009-01-12 처리액 혼합 장치, 기판 처리 장치, 처리액 혼합 방법 및 컴퓨터 판독 가능한 기억 매체 Active KR101213375B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-010950 2008-01-21
JP2008010950A JP5043696B2 (ja) 2008-01-21 2008-01-21 処理液混合装置、基板処理装置および処理液混合方法並びに記憶媒体

Publications (2)

Publication Number Publication Date
KR20090080476A KR20090080476A (ko) 2009-07-24
KR101213375B1 true KR101213375B1 (ko) 2012-12-17

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KR1020090002201A Active KR101213375B1 (ko) 2008-01-21 2009-01-12 처리액 혼합 장치, 기판 처리 장치, 처리액 혼합 방법 및 컴퓨터 판독 가능한 기억 매체

Country Status (5)

Country Link
US (1) US8104948B2 (enExample)
JP (1) JP5043696B2 (enExample)
KR (1) KR101213375B1 (enExample)
DE (1) DE102009000293A1 (enExample)
TW (1) TWI385026B (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102151678A (zh) * 2010-12-06 2011-08-17 深圳市华星光电技术有限公司 供液系统及供液方法
US9896980B2 (en) * 2011-07-26 2018-02-20 Paccar Inc Exhaust aftertreatment supplying a reducing agent
JP6352143B2 (ja) 2013-11-13 2018-07-04 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6367069B2 (ja) 2013-11-25 2018-08-01 東京エレクトロン株式会社 混合装置、基板処理装置および混合方法
JP6371716B2 (ja) * 2014-04-01 2018-08-08 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記録したコンピュータ読み取り可能な記録媒体
KR102357784B1 (ko) * 2014-06-09 2022-02-04 가부시키가이샤 에바라 세이사꾸쇼 세정 약액 공급장치 및 세정 약액 공급 방법
JP6339954B2 (ja) * 2014-06-09 2018-06-06 株式会社荏原製作所 洗浄薬液供給装置、洗浄薬液供給方法、及び洗浄ユニット
US10340159B2 (en) * 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
JP6505416B2 (ja) * 2014-11-04 2019-04-24 芝浦メカトロニクス株式会社 計量装置、計量システム、処理装置、および計量方法
JP6486986B2 (ja) 2017-04-03 2019-03-20 株式会社荏原製作所 液体供給装置及び液体供給方法
JP6776208B2 (ja) * 2017-09-28 2020-10-28 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6726330B2 (ja) * 2019-03-27 2020-07-22 芝浦メカトロニクス株式会社 計量装置、計量システム、処理装置、および計量方法
US11247184B2 (en) 2019-12-30 2022-02-15 Marathon Petroleum Company Lp Methods and systems for spillback control of in-line mixing of hydrocarbon liquids
CA3103416C (en) 2019-12-30 2022-01-25 Marathon Petroleum Company Lp Methods and systems for inline mixing of hydrocarbon liquids
US11607654B2 (en) 2019-12-30 2023-03-21 Marathon Petroleum Company Lp Methods and systems for in-line mixing of hydrocarbon liquids
US11559774B2 (en) 2019-12-30 2023-01-24 Marathon Petroleum Company Lp Methods and systems for operating a pump at an efficiency point
JP6802405B2 (ja) * 2020-04-14 2020-12-16 芝浦メカトロニクス株式会社 計量装置、計量システム、処理装置、および計量方法
US20220243573A1 (en) * 2021-01-29 2022-08-04 Downhole Chemical Solutions, Llc Systems and methods for subdividing chemical flow for well completion operations
US12012883B2 (en) 2021-03-16 2024-06-18 Marathon Petroleum Company Lp Systems and methods for backhaul transportation of liquefied gas and CO2 using liquefied gas carriers
US11578638B2 (en) 2021-03-16 2023-02-14 Marathon Petroleum Company Lp Scalable greenhouse gas capture systems and methods
US11655940B2 (en) 2021-03-16 2023-05-23 Marathon Petroleum Company Lp Systems and methods for transporting fuel and carbon dioxide in a dual fluid vessel
US11578836B2 (en) 2021-03-16 2023-02-14 Marathon Petroleum Company Lp Scalable greenhouse gas capture systems and methods
US11447877B1 (en) 2021-08-26 2022-09-20 Marathon Petroleum Company Lp Assemblies and methods for monitoring cathodic protection of structures
US12043905B2 (en) 2021-08-26 2024-07-23 Marathon Petroleum Company Lp Electrode watering assemblies and methods for maintaining cathodic monitoring of structures
US12129559B2 (en) 2021-08-26 2024-10-29 Marathon Petroleum Company Lp Test station assemblies for monitoring cathodic protection of structures and related methods
US12180597B2 (en) 2021-08-26 2024-12-31 Marathon Petroleum Company Lp Test station assemblies for monitoring cathodic protection of structures and related methods
US11686070B1 (en) 2022-05-04 2023-06-27 Marathon Petroleum Company Lp Systems, methods, and controllers to enhance heavy equipment warning
US12012082B1 (en) 2022-12-30 2024-06-18 Marathon Petroleum Company Lp Systems and methods for a hydraulic vent interlock
US12043361B1 (en) 2023-02-18 2024-07-23 Marathon Petroleum Company Lp Exhaust handling systems for marine vessels and related methods
US12006014B1 (en) 2023-02-18 2024-06-11 Marathon Petroleum Company Lp Exhaust vent hoods for marine vessels and related methods
US12297965B2 (en) 2023-08-09 2025-05-13 Marathon Petroleum Company Lp Systems and methods for mixing hydrogen with natural gas
US20250095359A1 (en) 2023-09-18 2025-03-20 Marathon Petroleum Company Lp Systems and methods to determine vegetation encroachment along a right-of-way
KR102844262B1 (ko) 2024-01-29 2025-08-11 엘에스이 주식회사 기판 세정 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2979066A (en) * 1956-09-17 1961-04-11 Proctor Silex Corp Color control of liquids
US4403866A (en) * 1982-05-07 1983-09-13 E. I. Du Pont De Nemours And Company Process for making paints
US4823987A (en) * 1986-04-28 1989-04-25 Ryco Graphic Manufacturing, Inc. Liquid mixing system and method
CH674319A5 (enExample) * 1988-03-22 1990-05-31 Miteco Ag
US5409310A (en) * 1993-09-30 1995-04-25 Semitool, Inc. Semiconductor processor liquid spray system with additive blending
BR9800361A (pt) * 1998-02-13 2000-09-26 Renner Du Pont Tintas Automoti Processo continuo e automatico para a produção de tintas automotivas e outros
US6554162B2 (en) * 2001-05-24 2003-04-29 Chemand Corporation System and method for accurately blending fluids
JP2003275569A (ja) * 2002-03-19 2003-09-30 Shibaura Mechatronics Corp 処理液の混合装置、混合方法及び基板処理装置
JP4417642B2 (ja) * 2003-03-17 2010-02-17 芝浦メカトロニクス株式会社 処理液の製造装置、製造方法及び基板の処理装置
KR100500475B1 (ko) * 2003-11-10 2005-07-12 삼성전자주식회사 케미컬 혼합장치
JP2005183791A (ja) * 2003-12-22 2005-07-07 Dainippon Screen Mfg Co Ltd 基板処理方法及びその装置
KR100598913B1 (ko) * 2004-09-02 2006-07-10 세메스 주식회사 약액 혼합 공급 장치 및 그 방법
JP2007168862A (ja) * 2005-12-22 2007-07-05 Cosmo Oil Co Ltd 燃料給油装置及び燃料給油プログラム

Also Published As

Publication number Publication date
KR20090080476A (ko) 2009-07-24
DE102009000293A1 (de) 2009-07-30
TWI385026B (zh) 2013-02-11
US8104948B2 (en) 2012-01-31
US20090188565A1 (en) 2009-07-30
JP5043696B2 (ja) 2012-10-10
TW200946219A (en) 2009-11-16
JP2009172459A (ja) 2009-08-06

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