JP5043696B2 - 処理液混合装置、基板処理装置および処理液混合方法並びに記憶媒体 - Google Patents

処理液混合装置、基板処理装置および処理液混合方法並びに記憶媒体 Download PDF

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Publication number
JP5043696B2
JP5043696B2 JP2008010950A JP2008010950A JP5043696B2 JP 5043696 B2 JP5043696 B2 JP 5043696B2 JP 2008010950 A JP2008010950 A JP 2008010950A JP 2008010950 A JP2008010950 A JP 2008010950A JP 5043696 B2 JP5043696 B2 JP 5043696B2
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Japan
Prior art keywords
supply
flow rate
raw material
mixing tank
flow path
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JP2008010950A
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English (en)
Japanese (ja)
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JP2009172459A5 (enExample
JP2009172459A (ja
Inventor
圭吾 佐竹
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008010950A priority Critical patent/JP5043696B2/ja
Priority to TW98100371A priority patent/TWI385026B/zh
Priority to KR1020090002201A priority patent/KR101213375B1/ko
Priority to DE200910000293 priority patent/DE102009000293A1/de
Priority to US12/357,083 priority patent/US8104948B2/en
Publication of JP2009172459A publication Critical patent/JP2009172459A/ja
Publication of JP2009172459A5 publication Critical patent/JP2009172459A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/80—Mixing plants; Combinations of mixers
    • B01F33/84—Mixing plants with mixing receptacles receiving material dispensed from several component receptacles, e.g. paint tins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/20—Measuring; Control or regulation
    • B01F35/22—Control or regulation
    • B01F35/221—Control or regulation of operational parameters, e.g. level of material in the mixer, temperature or pressure
    • B01F35/2211—Amount of delivered fluid during a period
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/88—Forming a predetermined ratio of the substances to be mixed by feeding the materials batchwise
    • B01F35/883—Forming a predetermined ratio of the substances to be mixed by feeding the materials batchwise using flow rate controls for feeding the substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
    • B01F2101/58—Mixing semiconducting materials, e.g. during semiconductor or wafer manufacturing processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87652—With means to promote mixing or combining of plural fluids
    • Y10T137/8766—With selectively operated flow control means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control
    • Y10T137/87684—Valve in each inlet

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Accessories For Mixers (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2008010950A 2008-01-21 2008-01-21 処理液混合装置、基板処理装置および処理液混合方法並びに記憶媒体 Active JP5043696B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008010950A JP5043696B2 (ja) 2008-01-21 2008-01-21 処理液混合装置、基板処理装置および処理液混合方法並びに記憶媒体
TW98100371A TWI385026B (zh) 2008-01-21 2009-01-07 處理液混合裝置、基板處理裝置及處理液混合方法與記憶媒體
KR1020090002201A KR101213375B1 (ko) 2008-01-21 2009-01-12 처리액 혼합 장치, 기판 처리 장치, 처리액 혼합 방법 및 컴퓨터 판독 가능한 기억 매체
DE200910000293 DE102009000293A1 (de) 2008-01-21 2009-01-19 Bearbeitungsflüssigkeitsmischvorrichtung und Verfahren, Substratbearbeitungsvorrichtung und Speichermedium
US12/357,083 US8104948B2 (en) 2008-01-21 2009-01-21 Processing liquid mixing apparatus and method, substrate processing apparatus, and storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008010950A JP5043696B2 (ja) 2008-01-21 2008-01-21 処理液混合装置、基板処理装置および処理液混合方法並びに記憶媒体

Publications (3)

Publication Number Publication Date
JP2009172459A JP2009172459A (ja) 2009-08-06
JP2009172459A5 JP2009172459A5 (enExample) 2009-11-05
JP5043696B2 true JP5043696B2 (ja) 2012-10-10

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JP2008010950A Active JP5043696B2 (ja) 2008-01-21 2008-01-21 処理液混合装置、基板処理装置および処理液混合方法並びに記憶媒体

Country Status (5)

Country Link
US (1) US8104948B2 (enExample)
JP (1) JP5043696B2 (enExample)
KR (1) KR101213375B1 (enExample)
DE (1) DE102009000293A1 (enExample)
TW (1) TWI385026B (enExample)

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CN102151678A (zh) * 2010-12-06 2011-08-17 深圳市华星光电技术有限公司 供液系统及供液方法
US9896980B2 (en) * 2011-07-26 2018-02-20 Paccar Inc Exhaust aftertreatment supplying a reducing agent
JP6352143B2 (ja) 2013-11-13 2018-07-04 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6367069B2 (ja) 2013-11-25 2018-08-01 東京エレクトロン株式会社 混合装置、基板処理装置および混合方法
JP6371716B2 (ja) * 2014-04-01 2018-08-08 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記録したコンピュータ読み取り可能な記録媒体
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JP6339954B2 (ja) * 2014-06-09 2018-06-06 株式会社荏原製作所 洗浄薬液供給装置、洗浄薬液供給方法、及び洗浄ユニット
US10340159B2 (en) * 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
JP6505416B2 (ja) * 2014-11-04 2019-04-24 芝浦メカトロニクス株式会社 計量装置、計量システム、処理装置、および計量方法
JP6486986B2 (ja) 2017-04-03 2019-03-20 株式会社荏原製作所 液体供給装置及び液体供給方法
JP6776208B2 (ja) * 2017-09-28 2020-10-28 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6726330B2 (ja) * 2019-03-27 2020-07-22 芝浦メカトロニクス株式会社 計量装置、計量システム、処理装置、および計量方法
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US20220243573A1 (en) * 2021-01-29 2022-08-04 Downhole Chemical Solutions, Llc Systems and methods for subdividing chemical flow for well completion operations
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US11447877B1 (en) 2021-08-26 2022-09-20 Marathon Petroleum Company Lp Assemblies and methods for monitoring cathodic protection of structures
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Also Published As

Publication number Publication date
KR20090080476A (ko) 2009-07-24
DE102009000293A1 (de) 2009-07-30
TWI385026B (zh) 2013-02-11
US8104948B2 (en) 2012-01-31
KR101213375B1 (ko) 2012-12-17
US20090188565A1 (en) 2009-07-30
TW200946219A (en) 2009-11-16
JP2009172459A (ja) 2009-08-06

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