KR101114703B1 - 3개의 전기적으로 분리된 전극을 구비한 트랜지스터 및 그형성 방법 - Google Patents
3개의 전기적으로 분리된 전극을 구비한 트랜지스터 및 그형성 방법 Download PDFInfo
- Publication number
- KR101114703B1 KR101114703B1 KR1020067009072A KR20067009072A KR101114703B1 KR 101114703 B1 KR101114703 B1 KR 101114703B1 KR 1020067009072 A KR1020067009072 A KR 1020067009072A KR 20067009072 A KR20067009072 A KR 20067009072A KR 101114703 B1 KR101114703 B1 KR 101114703B1
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- South Korea
- Prior art keywords
- gate
- gate structure
- layer
- transistor
- sidewall
- Prior art date
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- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/6891—Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode
- H10D30/6893—Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode wherein the floating gate has multiple non-connected parts, e.g. multi-particle floating gate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/05—Making the transistor
- H10B12/056—Making the transistor the transistor being a FinFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/36—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the transistor being a FinFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0411—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having floating gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0413—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having charge-trapping gate insulators, e.g. MNOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/031—Manufacture or treatment of data-storage electrodes
- H10D64/035—Manufacture or treatment of data-storage electrodes comprising conductor-insulator-conductor-insulator-semiconductor structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/031—Manufacture or treatment of data-storage electrodes
- H10D64/037—Manufacture or treatment of data-storage electrodes comprising charge-trapping insulators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/705,317 US7098502B2 (en) | 2003-11-10 | 2003-11-10 | Transistor having three electrically isolated electrodes and method of formation |
| US10/705,317 | 2003-11-10 | ||
| PCT/US2004/034810 WO2005048299A2 (en) | 2003-11-10 | 2004-10-20 | Transistor having three electronically isolated electrodes and method of formation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060123141A KR20060123141A (ko) | 2006-12-01 |
| KR101114703B1 true KR101114703B1 (ko) | 2012-02-29 |
Family
ID=34552331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067009072A Expired - Fee Related KR101114703B1 (ko) | 2003-11-10 | 2004-10-20 | 3개의 전기적으로 분리된 전극을 구비한 트랜지스터 및 그형성 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7098502B2 (enExample) |
| EP (1) | EP1702367A2 (enExample) |
| JP (1) | JP2007511090A (enExample) |
| KR (1) | KR101114703B1 (enExample) |
| CN (1) | CN100433363C (enExample) |
| TW (1) | TWI360863B (enExample) |
| WO (1) | WO2005048299A2 (enExample) |
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- 2003-11-10 US US10/705,317 patent/US7098502B2/en not_active Expired - Fee Related
-
2004
- 2004-10-20 EP EP04795910A patent/EP1702367A2/en not_active Withdrawn
- 2004-10-20 KR KR1020067009072A patent/KR101114703B1/ko not_active Expired - Fee Related
- 2004-10-20 WO PCT/US2004/034810 patent/WO2005048299A2/en not_active Ceased
- 2004-10-20 JP JP2006539531A patent/JP2007511090A/ja active Pending
- 2004-10-20 CN CNB2004800297385A patent/CN100433363C/zh not_active Expired - Fee Related
- 2004-11-01 TW TW093133254A patent/TWI360863B/zh not_active IP Right Cessation
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| US20030042531A1 (en) * | 2001-09-04 | 2003-03-06 | Lee Jong Ho | Flash memory element and manufacturing method thereof |
| US6816414B1 (en) * | 2003-07-31 | 2004-11-09 | Freescale Semiconductor, Inc. | Nonvolatile memory and method of making same |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1702367A2 (en) | 2006-09-20 |
| TWI360863B (en) | 2012-03-21 |
| US7098502B2 (en) | 2006-08-29 |
| CN1868067A (zh) | 2006-11-22 |
| WO2005048299A2 (en) | 2005-05-26 |
| JP2007511090A (ja) | 2007-04-26 |
| US20050098822A1 (en) | 2005-05-12 |
| WO2005048299A3 (en) | 2005-11-17 |
| CN100433363C (zh) | 2008-11-12 |
| TW200527599A (en) | 2005-08-16 |
| KR20060123141A (ko) | 2006-12-01 |
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