JP5559118B2 - 半導体不揮発性メモリ - Google Patents
半導体不揮発性メモリ Download PDFInfo
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- JP5559118B2 JP5559118B2 JP2011207301A JP2011207301A JP5559118B2 JP 5559118 B2 JP5559118 B2 JP 5559118B2 JP 2011207301 A JP2011207301 A JP 2011207301A JP 2011207301 A JP2011207301 A JP 2011207301A JP 5559118 B2 JP5559118 B2 JP 5559118B2
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- 230000015654 memory Effects 0.000 title claims description 131
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 238000009792 diffusion process Methods 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 16
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 95
- 229920005591 polysilicon Polymers 0.000 description 95
- 238000010586 diagram Methods 0.000 description 30
- 125000006850 spacer group Chemical group 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 230000000295 complement effect Effects 0.000 description 5
- 239000002784 hot electron Substances 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/10—EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
Description
Claims (6)
- 論理工程において形成される不揮発性半導体メモリ・セル(1500)であり:
アクティブ領域(315)を含む第1導電型の基板;
前記アクティブ領域上に完全に形成されたセレクト・ゲート(313−1);
前記基板の表面の第1領域上のアクティブ領域において部分的に形成され、前記論理工程の最小ゲート長のルールよりも長い第1ゲート(1118−1);
前記基板の表面の第2領域上のアクティブ領域において部分的に形成された第2ゲートであり、前記第1領域及び前記第2領域は第1距離で離されており、前記第1ゲートと実質的に同じ長さである、第2ゲート(1118−2);
前記基板上に形成され、前記第1ゲートと前記第2ゲートとの間に充填された電荷貯蔵層(314);
前記アクティブ領域における前記第1ゲート及び前記第2ゲートの第1の側に形成された、前記第1導電型の反対の第2導電型である第1拡散領域(311−3);
前記アクティブ領域における前記第1ゲート及び前記第2ゲートの第1の側と反対の第2の側に形成された、前記第2導電型の第2拡散領域(311−2);及び
前記アクティブ領域における前記セレクト・ゲートの前記第1拡散領域の側と反対側に形成された第3拡散領域(311−1);
を有し、
前記電荷貯蔵層は、前記第1ゲート及び前記第2ゲートの長さよりも短い長さを有する、不揮発性半導体メモリ・セル。 - 前記電荷貯蔵層の下に、N--注入領域が部分的に重なっている、請求項1に記載の不揮発性メモリ・セル。
- 前記アクティブ領域の表面に形成された前記電荷貯蔵層は、前記セレクト・ゲート、前記第1ゲート及び前記第2ゲートの間をさらに充填する、請求項1に記載の不揮発性メモリ・セル。
- 第1導電型の基板;
前記基板上の複数のアクティブ領域;及び
複数のメモリ・セル;
を含む不揮発性メモリ・アレイであり、
各メモリ・セルは、該複数のアクティブ領域の1つのアクティブ領域(315)上に形成され:
前記1つのアクティブ領域上に完全に形成されたセレクト・ゲート(313−1);
該セレクト・ゲートの第1の側において前記アクティブ領域上に部分的に形成された第1ゲートであり、前記セレクト・ゲート及び該第1ゲートは、第1距離で離れており、前記論理工程の最小ゲート長のルールよりも長い、第1ゲート(1118−1);
前記セレクト・ゲートの第1の側において前記1つのアクティブ領域上に部分的に形成された第2ゲートであり、該第2ゲート及び前記セレクト・ゲートは、前記第1距離で離れており、前記第1ゲート及び前記第2ゲートは第2距離で離れており、前記第1ゲートと実質的に同じ長さである、第2ゲート(1118−2);
前記第1ゲートと前記第2ゲートとの間に形成された電荷貯蔵層(314);
前記アクティブ領域における前記第1ゲート及び前記第2ゲートの第1の側に形成された、前記第1導電型の反対の第2導電型である第1拡散領域(311−3);
前記アクティブ領域における前記第1ゲート及び前記第2ゲートの第1の側と反対の第2の側に形成された、前記第2導電型の第2拡散領域(311−2);及び
前記アクティブ領域における前記セレクト・ゲートの前記第1拡散領域の側と反対側に形成された第3拡散領域(311−1);
を含み、
前記複数のメモリ・セルの第1拡散領域は、互いに電気接続され、前記複数のメモリ・セルの第2拡散領域は、互いに電気接続され、
各メモリ・セルの各電荷貯蔵層は、前記第1ゲート及び前記第2ゲートの長さよりも短い長さを有する、不揮発性メモリ・アレイ。 - 各メモリ・セルの各電荷貯蔵層の下に、N--注入領域が部分的に重なっている、請求項4に記載の不揮発性メモリ・アレイ。
- 前記アクティブ領域の表面に形成された各メモリ・セルの各電荷貯蔵層は、前記セレクト・ゲート、前記第1ゲート及び前記第2ゲートの間をさらに充填する、請求項4に記載の不揮発性メモリ・アレイ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38655810P | 2010-09-26 | 2010-09-26 | |
US61/386,558 | 2010-09-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012069950A JP2012069950A (ja) | 2012-04-05 |
JP5559118B2 true JP5559118B2 (ja) | 2014-07-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011207301A Active JP5559118B2 (ja) | 2010-09-26 | 2011-09-22 | 半導体不揮発性メモリ |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2434535A3 (ja) |
JP (1) | JP5559118B2 (ja) |
TW (1) | TWI453807B (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4647175B2 (ja) * | 2002-04-18 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
US7098502B2 (en) * | 2003-11-10 | 2006-08-29 | Freescale Semiconductor, Inc. | Transistor having three electrically isolated electrodes and method of formation |
JP2007157854A (ja) * | 2005-12-01 | 2007-06-21 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
JP2008277544A (ja) * | 2007-04-27 | 2008-11-13 | Toshiba Corp | 半導体記憶装置 |
JP5442235B2 (ja) * | 2008-11-06 | 2014-03-12 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
JP2011023637A (ja) * | 2009-07-17 | 2011-02-03 | Toshiba Corp | 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法 |
-
2011
- 2011-09-22 JP JP2011207301A patent/JP5559118B2/ja active Active
- 2011-09-23 EP EP11182469.4A patent/EP2434535A3/en not_active Withdrawn
- 2011-09-23 TW TW100134406A patent/TWI453807B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201234432A (en) | 2012-08-16 |
TWI453807B (zh) | 2014-09-21 |
EP2434535A3 (en) | 2015-07-01 |
JP2012069950A (ja) | 2012-04-05 |
EP2434535A2 (en) | 2012-03-28 |
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