KR101113490B1 - 압전체, 압전체 소자, 및 압전체 소자를 이용한 액체 토출 헤드 및 액체 토출 장치 - Google Patents

압전체, 압전체 소자, 및 압전체 소자를 이용한 액체 토출 헤드 및 액체 토출 장치 Download PDF

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KR101113490B1
KR101113490B1 KR1020097003264A KR20097003264A KR101113490B1 KR 101113490 B1 KR101113490 B1 KR 101113490B1 KR 1020097003264 A KR1020097003264 A KR 1020097003264A KR 20097003264 A KR20097003264 A KR 20097003264A KR 101113490 B1 KR101113490 B1 KR 101113490B1
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South Korea
Prior art keywords
piezoelectric
film
domain
crystal
substrate
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Expired - Fee Related
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KR1020097003264A
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English (en)
Korean (ko)
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KR20090040440A (ko
Inventor
도시히로 이후꾸
겐이찌 다께다
데쯔로 후꾸이
히로시 후나꾸보
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020097003264A 2006-07-18 2007-07-13 압전체, 압전체 소자, 및 압전체 소자를 이용한 액체 토출 헤드 및 액체 토출 장치 Expired - Fee Related KR101113490B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2006-196114 2006-07-18
JP2006196114A JP5300184B2 (ja) 2006-07-18 2006-07-18 圧電体、圧電体素子、圧電体素子を用いた液体吐出ヘッド及び液体吐出装置
PCT/JP2007/064384 WO2008010583A1 (en) 2006-07-18 2007-07-13 Piezoelectric substance, piezoelectric element, and liquid discharge head and liquid discharge apparatus using piezoelectric element

Publications (2)

Publication Number Publication Date
KR20090040440A KR20090040440A (ko) 2009-04-24
KR101113490B1 true KR101113490B1 (ko) 2012-03-13

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KR1020097003264A Expired - Fee Related KR101113490B1 (ko) 2006-07-18 2007-07-13 압전체, 압전체 소자, 및 압전체 소자를 이용한 액체 토출 헤드 및 액체 토출 장치

Country Status (6)

Country Link
US (1) US7948154B2 (https=)
EP (1) EP2044245B1 (https=)
JP (1) JP5300184B2 (https=)
KR (1) KR101113490B1 (https=)
CN (1) CN101490316B (https=)
WO (1) WO2008010583A1 (https=)

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JP5355148B2 (ja) * 2008-03-19 2013-11-27 キヤノン株式会社 圧電材料
US8894765B1 (en) * 2009-11-13 2014-11-25 Trs Technologies, Inc. High polarization energy storage materials using oriented single crystals
JPWO2011077667A1 (ja) * 2009-12-24 2013-05-02 コニカミノルタホールディングス株式会社 圧電素子及びその製造方法
JP5854183B2 (ja) * 2010-03-02 2016-02-09 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外センサー
KR101145667B1 (ko) * 2010-03-23 2012-05-24 전자부품연구원 산처리 과정을 포함하는 강유전체 박막 형성방법
JP5743059B2 (ja) * 2011-01-19 2015-07-01 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外線センサー
CN102856177B (zh) * 2011-06-27 2015-01-28 中芯国际集成电路制造(北京)有限公司 半导体器件和用于制造半导体器件的方法
JP6246719B2 (ja) * 2011-10-18 2017-12-13 ダルハウジー ユニバーシティー 圧電材料及び特性制御方法
JP5808262B2 (ja) * 2012-01-23 2015-11-10 株式会社サイオクス 圧電体素子及び圧電体デバイス
CN104419895B (zh) * 2013-09-09 2016-11-16 中国科学院上海硅酸盐研究所 低温下制备具有高度(001)择优取向的钌酸锶薄膜的方法
JP6273829B2 (ja) 2013-09-13 2018-02-07 株式会社リコー 電気機械変換素子とその製造方法、及び電気機械変換素子を有する液滴吐出ヘッド、液滴吐出ヘッドを有する液滴吐出装置
JP6478023B2 (ja) 2014-03-18 2019-03-06 セイコーエプソン株式会社 圧電素子、圧電アクチュエーター装置、液体噴射ヘッド、液体噴射装置及び超音波測定装置
JP2017112281A (ja) 2015-12-17 2017-06-22 株式会社リコー 電気‐機械変換素子、液体吐出ヘッド、液体吐出装置、電気‐機械変換膜の製造方法、及び液体吐出ヘッドの製造方法
WO2018195339A1 (en) 2017-04-19 2018-10-25 Board Of Regents, The University Of Texas System Immune cells expressing engineered antigen receptors
CN107093664B (zh) * 2017-04-19 2019-05-14 北京大学 一种周期性正交极化的大应变压电陶瓷致动器及制备方法
JP7273421B2 (ja) 2018-02-21 2023-05-15 ボード オブ リージェンツ，ザ ユニバーシティ オブ テキサス システム ナチュラルキラー細胞の活性化および拡大のための方法ならびにその使用
CN108597875B (zh) * 2018-04-03 2020-10-30 湘潭大学 一种透明柔性全氧化物异质外延铁电薄膜及其制备方法
JP7298159B2 (ja) * 2019-01-11 2023-06-27 Tdk株式会社 圧電薄膜、圧電薄膜素子、圧電アクチュエータ、圧電センサ、ヘッドアセンブリ、ヘッドスタックアセンブリ、ハードディスクドライブ、プリンタヘッド、及びインクジェットプリンタ装置
CN110590356B (zh) * 2019-09-20 2021-09-10 清华大学深圳国际研究生院 钛酸锌陶瓷前驱体浆料和3d打印制备钛酸锌陶瓷的方法
CN110588178B (zh) * 2019-09-30 2021-05-14 西安交通大学 一种高密度压电打印头的集成制造方法
KR102474555B1 (ko) * 2020-07-02 2022-12-06 (주)아이블포토닉스 압전 단결정 소자, 이를 이용한 멤스 디바이스 및 그 제조방법
DE112021005944T5 (de) * 2021-01-12 2023-09-14 Murata Manufacturing Co., Ltd. Piezoelektrisches element
KR102923900B1 (ko) * 2023-08-16 2026-02-05 주식회사 아모센스 압전 엑츄에이터 및 이의 제조방법
CN120435940A (zh) * 2023-08-25 2025-08-05 日商爱伯压电对策股份有限公司 薄膜压电器件

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CN101490316B (zh) 2013-03-06
EP2044245A4 (en) 2012-09-12
EP2044245B1 (en) 2016-02-10
JP2008024532A (ja) 2008-02-07
CN101490316A (zh) 2009-07-22
WO2008010583A1 (en) 2008-01-24
US7948154B2 (en) 2011-05-24
EP2044245A1 (en) 2009-04-08
KR20090040440A (ko) 2009-04-24
US20090273257A1 (en) 2009-11-05
JP5300184B2 (ja) 2013-09-25

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