CN110588178B - 一种高密度压电打印头的集成制造方法 - Google Patents
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- 238000007639 printing Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000002346 layers by function Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 10
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 10
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims abstract description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 10
- 230000010354 integration Effects 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000004528 spin coating Methods 0.000 claims abstract description 5
- 238000012546 transfer Methods 0.000 claims abstract description 5
- 238000002360 preparation method Methods 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000003980 solgel method Methods 0.000 claims description 3
- 238000009987 spinning Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 65
- 239000010408 film Substances 0.000 description 51
- 239000010409 thin film Substances 0.000 description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- KQNKJJBFUFKYFX-UHFFFAOYSA-N acetic acid;trihydrate Chemical compound O.O.O.CC(O)=O KQNKJJBFUFKYFX-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
- WXKDNDQLOWPOBY-UHFFFAOYSA-N zirconium(4+);tetranitrate;pentahydrate Chemical compound O.O.O.O.O.[Zr+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O WXKDNDQLOWPOBY-UHFFFAOYSA-N 0.000 description 1
Images
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
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- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
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- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
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Abstract
一种高密度压电打印头的集成制造方法,先键合振动板与喷嘴板,然后制备PZT压电薄膜图形化功能层,释放并拾取PZT压电薄膜图形化功能层,最后完成PZT压电薄膜图形化功能层的转移,在已完成键合的振动板上表面涂覆或旋涂有机粘结材料,将PDMS拾取的PZT压电薄膜图形化功能层完成对准进行黏合,完成PZT压电薄膜图形化功能层的转移,得到高密度压电打印头;本发明PZT薄膜与振动板的集成在打印头结构部分键合完成后再进行,避免了键合过程对PZT压电薄膜性能的影响,既可以保证所需求的键合强度,也能保持PZT压电薄膜良好的压电性能。
Description
技术领域
本发明属于打印头集成制造技术领域,具体涉及一种高密度压电打印头的集成制造方法。
背景技术
压电式打印技术由于具备喷头使用寿命长、打印材料类型广以及适合开发高密度打印头等优点,压电式打印技术已被广泛的应用。随着科学技术的发展,打印行业对打印的效率与分辨率要求不断提高,因此制备高密度的压电打印头已经成为行业的迫切需求。高密度压电打印头由锆钛酸铅(PZT)压电薄膜、振动板(可以包括部分流道和腔室)、流道板以及喷嘴板几个部分组成(为了描述更简单,后续说明中进行结构简化去掉流道板),其中PZT压电薄膜的制备极其依赖于衬底,在压电打印头的制造过程中需要直接在振动板上完成PZT压电薄膜的原位制造,再将带有PZT压电薄膜的振动板与喷嘴板键合(键合即是将两片表面清洁、原子级平整的同质或异质半导体材料经表面清洗和活化处理,在一定条件下键合成为一体的技术),完成打印头的一体化集成。其中PZT压电薄膜与振动板的集成构成打印头的驱动单元,驱动单元产生打印头工作时所需的驱动力以及腔室变形量,因此PZT压电薄膜压电性能的强弱直接影响着打印头驱动单元的工作效果。
PZT压电材料为典型的钙钛矿型结构,其组份多用PbZr1-xTixO3(x在0-1之间)来描述,其中锆(Zr)钛(Ti)铅(Pb)原子的比例直接影响着PZT材料压电性能的强弱,而铅是一种易挥发的元素,在高温过程中极易挥发,形成铅原子缺位,影响PZT压电材料的晶体结构,因而使其压电性能显著下降。在打印头的制造过程中,采用键合工艺来完成带有PZT压电薄膜的振动板和喷嘴板的键合,为了提高键合强度,键合过程需要长时间保持高温高压,在该条件下PZT压电薄膜中的铅元素将大量挥发,使其压电性能下降,最终将减弱或丧失打印头的驱动性能。
发明内容
为了克服上述现有技术的缺点,本发明的目的在于提供了一种高密度压电打印头的集成制造方法,使得PZT薄膜与振动板的集成在打印头结构部分键合完成后再进行,避免了键合过程对PZT压电薄膜性能的影响,既可以保证所需求的键合强度,也能保持PZT压电薄膜良好的压电性能。
为了达到上述目的,本发明采取的技术方案为:
一种高密度压电打印头的集成制造方法,包括以下步骤:
第一步,键合振动板与喷嘴板:设计并完成打印头振动板与喷嘴板的制造,通过键合工艺完成振动板与喷嘴板的集成;
第二步,制备PZT压电薄膜图形化功能层:在衬底上制备下电极/PZT压电薄膜/上电极多层结构并完成其图形化,得到PZT压电薄膜图形化功能层;
第三步,释放并拾取PZT压电薄膜图形化功能层:在PZT压电薄膜图形化功能层上旋涂覆盖PDMS,加热固化;通过腐蚀衬底中的SiO2层,完成PZT压电薄膜图形化功能层的释放;将PDMS从衬底表面揭下,拾取起PZT压电薄膜图形化功能层;
第四步,完成PZT压电薄膜图形化功能层的转移:在已完成键合的振动板上表面涂覆或旋涂有机粘结材料,将PDMS拾取的PZT压电薄膜图形化功能层完成对准进行黏合,完成PZT压电薄膜图形化功能层的转移,得到高密度压电打印头。
所述的高密度压电打印头由PZT压电薄膜图形化功能层、振动板、喷嘴板组成,在此结构上能够继续添加流道板、加热板或其他辅助板进行多次键合或粘结。
所述的高密度压电打印头为阵列化结构,包括阵列化的PZT压电薄膜图形化功能层、阵列化的腔室、阵列化的流道、阵列化的喷嘴以及公用或部分公用的入墨和出墨流道。
所述的振动板与喷嘴板形状为方形或圆形。
所述的第二步中制备PZT压电薄膜图形化功能层的衬底使用玻璃片或氧化硅片。
所述的PZT压电薄膜的制备通过溶胶-凝胶法、磁控溅射法、丝网印刷法、减薄法或其他薄膜制备技术来完成。
所述的PZT压电薄膜的制备采用掺杂以及制备种晶层的方法来提其压电性能。
所述的第二步中对下电极/PZT压电薄膜/上电极的图形化,在制备PZT压电薄膜功能层过程中或PZT压电薄膜功能层制备完成后再进行。
所述的第四步中用于PZT压电薄膜图形化功能层和振动板黏合的有机粘结材料为环氧树脂胶。
本发明的有益效果为:
本发明实现了高密度压电打印头的集成制造,通过先完成打印头振动板与喷嘴板的键合,然后采用转印技术完成PZT薄膜与振动板的集成,可以很好的保持PZT压电薄膜的压电性能,同时,无压电结构的振动板与喷嘴板键合,也可以提高键合成功率和键合强度。本发明还可以将多种压电薄膜的制备方法应用于高密度打印头的制造之中,解除键合过程对压电薄膜制造的限制。
附图说明
图1为本发明单个振动板的横截面示意图。
图2为本发明单个喷嘴板的横截面示意图。
图3为本发明振动板与喷嘴板键合后单个流道的横截面示意图。
图4为本发明制备PZT压电薄膜的衬底横截面示意图。
图5为本发明制备的PZT压电薄膜的横截面示意图。
图6为本发明对PZT压电薄膜夹层结构图形化后的横截面示意图。
图7为本发明对PZT压电薄膜夹层结构图形化后的局部俯视图。
图8为本发明拾取PZT压电薄膜夹层结构的横截面示意图。
图9为本发明高密度打印头集成后单个打印头的横截面示意图。
具体实施方式
下面结合实施例和附图对本发明做详细描述。
一种高密度压电打印头的集成制造方法,包括以下步骤:
第一步,键合振动板与喷嘴板:在第一硅片1上通过光刻和干法刻蚀工艺制造打印头的振动板,如图1所示,其中压力腔2的厚度为t1,通过控制干法刻蚀步数或者采用SOI硅片可以调整t1的大小,以满足对不同厚度PZT压电薄膜的设计需求;在第二硅片3上通过光刻和干法刻蚀工艺制造打印头的喷嘴板,如图2所示,其中阻尼室5和喷嘴6可以通过反面对准套刻和双面干法刻蚀来加工完成;通过设计多层掩蔽进行干法刻蚀,可以制造出不同的限流部4的深度t2和阻尼室5的深度t3,以满足打印头流道的优化设计;再将振动板和喷嘴板放入氧化性溶液进行亲水处理,在其表面生成薄薄氧化层和羟基,将第一硅片1和第二硅片3进行对准,在一定温度和压力下完成键合,形成一个完整的打印头流道,如图3所示;
第二步,制备PZT压电薄膜图形化功能层:准备第三硅片7作为衬底,采用热氧法制备SiO2层8,通过磁控溅射工艺制备Ti/Pt作为下电极9,磁控溅射条件为加温400℃,真空度在10-4Pa以下,如图4所示;在制备有下电极9的衬底上制备PZT压电薄膜10,制备工艺以溶胶-凝胶法来进行说明,先以乙二醇独甲醚为溶剂,以三水醋酸铅、五水硝酸锆和钛酸四丁酯为溶质配制PZT溶胶,再进行旋涂制备PZT湿膜,之后通过干燥、热解和在600℃以上温度退火完成PZT干膜的制备,重复以上匀胶和热处理工艺,完成PZT压电薄膜10的制备;PZT压电薄膜10的厚度可以通过旋涂的层数以及调节溶液的黏度来进行控制,制备的PZT压电薄膜示意图如图5所示;在PZT压电薄膜10上通过剥离法制备图形化上电极11(Cr/Au);采用湿法腐蚀工艺图形化PZT压电薄膜10,腐蚀液配比为氢氟酸:盐酸:水=1:30:70;采用金属干法刻蚀工艺完成对下电极9的图形化,从而完成对PZT压电薄膜夹层结构的图形化,得到PZT压电薄膜图形化功能层,如图6和图7所示;
第三步,释放并拾取PZT压电薄膜图形化功能层:将PDMS的交联剂和本体按照1:10的质量比例混合配比,抽真空排气泡,然后旋涂在PZT压电薄膜图形化功能层上,60℃加热固化;采用稀释的氢氟酸溶液腐蚀SiO2层8,以完成对PZT压电薄膜图形化功能层的释放,然后通过PDMS 12拾取起PZT压电薄膜图形化功能层,如图8所示;
第四步,完成PZT压电薄膜图形化功能层的转移:在已完成键合的振动板上表面旋涂环氧树脂胶,厚度约1μm左右,将PDMS拾取的PZT压电薄膜图形化功能层转移到振动板上,完成对准黏合,固化后,得到高密度压电打印头,如图9所示。
上述方法实现了高密度打印头的集成制造,虽然实施例中附图以单个打印头的示意图来说明,但仅仅是为了更清楚的表述,高密度只需形成阵列即可。
本实施例中采用稀释氢氟酸腐蚀SiO2层以释放PZT压电薄膜图形化功能层,这一步骤的完成程度将决定了高密度打印头整体的集成效果,该步骤的重要影响参数有氢氟酸浓度、SiO2层厚度、腐蚀的面积、腐蚀温度以及时间,这几个参数相互影响,对于腐蚀不同的结构与尺寸需要提前优化。
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明实施例技术方案的范围。
Claims (9)
1.一种高密度压电打印头的集成制造方法,其特征在于,包括以下步骤:
第一步,键合振动板与喷嘴板:设计并完成打印头振动板与喷嘴板的制造,通过键合工艺完成振动板与喷嘴板的集成;
第二步,制备PZT压电薄膜图形化功能层:在衬底上制备下电极/PZT压电薄膜/上电极多层结构并完成其图形化,得到PZT压电薄膜图形化功能层;
第三步,释放并拾取PZT压电薄膜图形化功能层:在PZT压电薄膜图形化功能层上旋涂覆盖PDMS,加热固化;通过腐蚀衬底中的SiO2层,完成PZT压电薄膜图形化功能层的释放;将PDMS从衬底表面揭下,拾取起PZT压电薄膜图形化功能层;
第四步,完成PZT压电薄膜图形化功能层的转移:在已完成键合的振动板上表面涂覆或旋涂有机粘结材料,将PDMS拾取的PZT压电薄膜图形化功能层完成对准进行黏合,完成PZT压电薄膜图形化功能层的转移,得到高密度压电打印头。
2.根据权利要求1所述的一种高密度压电打印头的集成制造方法,其特征在于:所述的高密度压电打印头由PZT压电薄膜图形化功能层、振动板、喷嘴板组成,在此结构上能够继续添加流道板、加热板或其他辅助板进行多次键合或粘结。
3.根据权利要求1所述的一种高密度压电打印头的集成制造方法,其特征在于:所述的高密度压电打印头为阵列化结构,包括阵列化的PZT压电薄膜图形化功能层、阵列化的腔室、阵列化的流道、阵列化的喷嘴以及公用或部分公用的入墨和出墨流道。
4.根据权利要求1所述的一种高密度压电打印头的集成制造方法,其特征在于:所述的振动板与喷嘴板形状为方形或圆形。
5.根据权利要求1所述的一种高密度压电打印头的集成制造方法,其特征在于:所述的第二步中制备PZT压电薄膜图形化功能层的衬底使用玻璃片或氧化硅片。
6.根据权利要求1所述的一种高密度压电打印头的集成制造方法,其特征在于:所述的PZT压电薄膜的制备通过溶胶-凝胶法、磁控溅射法、丝网印刷法或减薄法来完成。
7.根据权利要求1所述的一种高密度压电打印头的集成制造方法,其特征在于:所述的PZT压电薄膜的制备采用掺杂以及制备种晶层的方法来提其压电性能。
8.根据权利要求1所述的一种高密度压电打印头的集成制造方法,其特征在于:所述的第二步中对下电极/PZT压电薄膜/上电极的图形化,在制备PZT压电薄膜功能层过程中或PZT压电薄膜功能层制备完成后再进行。
9.根据权利要求1所述的一种高密度压电打印头的集成制造方法,其特征在于:所述的第四步中用于PZT压电薄膜图形化功能层和振动板黏合的有机粘结材料为环氧树脂胶。
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