KR101101550B1 - 솔더 볼 및 반도체 패키지 - Google Patents

솔더 볼 및 반도체 패키지 Download PDF

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Publication number
KR101101550B1
KR101101550B1 KR1020090086585A KR20090086585A KR101101550B1 KR 101101550 B1 KR101101550 B1 KR 101101550B1 KR 1020090086585 A KR1020090086585 A KR 1020090086585A KR 20090086585 A KR20090086585 A KR 20090086585A KR 101101550 B1 KR101101550 B1 KR 101101550B1
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KR
South Korea
Prior art keywords
semiconductor chip
underfill
substrate
core
solder ball
Prior art date
Application number
KR1020090086585A
Other languages
English (en)
Korean (ko)
Other versions
KR20110028939A (ko
Inventor
김운천
심현섭
임순규
김진구
도재천
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020090086585A priority Critical patent/KR101101550B1/ko
Priority to JP2009272223A priority patent/JP5159750B2/ja
Publication of KR20110028939A publication Critical patent/KR20110028939A/ko
Application granted granted Critical
Publication of KR101101550B1 publication Critical patent/KR101101550B1/ko
Priority to JP2012024479A priority patent/JP2012089898A/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR1020090086585A 2009-09-14 2009-09-14 솔더 볼 및 반도체 패키지 KR101101550B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020090086585A KR101101550B1 (ko) 2009-09-14 2009-09-14 솔더 볼 및 반도체 패키지
JP2009272223A JP5159750B2 (ja) 2009-09-14 2009-11-30 半田ボール及び半導体パッケージ
JP2012024479A JP2012089898A (ja) 2009-09-14 2012-02-07 半田ボール及び半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090086585A KR101101550B1 (ko) 2009-09-14 2009-09-14 솔더 볼 및 반도체 패키지

Publications (2)

Publication Number Publication Date
KR20110028939A KR20110028939A (ko) 2011-03-22
KR101101550B1 true KR101101550B1 (ko) 2012-01-02

Family

ID=43934981

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090086585A KR101101550B1 (ko) 2009-09-14 2009-09-14 솔더 볼 및 반도체 패키지

Country Status (2)

Country Link
JP (2) JP5159750B2 (ja)
KR (1) KR101101550B1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101101550B1 (ko) * 2009-09-14 2012-01-02 삼성전기주식회사 솔더 볼 및 반도체 패키지
KR102026227B1 (ko) * 2012-12-13 2019-11-04 엘지이노텍 주식회사 패키지 온 패키지형 반도체 패키지 및 그 제조방법
KR102134019B1 (ko) 2013-11-25 2020-07-14 에스케이하이닉스 주식회사 볼 랜드를 포함하는 기판 및 반도체 패키지와, 그 제조방법
CN115513147B (zh) * 2022-11-24 2023-03-24 河北北芯半导体科技有限公司 一种部分填充底填料的倒装芯片封装结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970017898A (ko) * 1995-09-30 1997-04-30 김광호 칩 온 글래스(Chip On Glass) 접합방법
KR20060097308A (ko) * 2005-03-05 2006-09-14 삼성전자주식회사 실장용 솔더를 구비하는 반도체 패키지
JP2007115857A (ja) * 2005-10-20 2007-05-10 Nippon Steel Chem Co Ltd マイクロボール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176139A (ja) * 1986-01-29 1987-08-01 Fuji Xerox Co Ltd 異方導電材料およびこれを用いた半導体装置の実装方法
JP2546262B2 (ja) * 1987-03-25 1996-10-23 日立化成工業株式会社 回路の接続部材およびその製造方法
US5761048A (en) * 1996-04-16 1998-06-02 Lsi Logic Corp. Conductive polymer ball attachment for grid array semiconductor packages
JP2003158440A (ja) * 2001-11-19 2003-05-30 Daishinku Corp 接合部材および当該接合部材を用いた圧電振動デバイスおよび圧電振動デバイスの製造方法
JP2004247358A (ja) * 2003-02-10 2004-09-02 Sony Corp 半導体装置と、その製造方法と、それに用いるはんだボール
JP3924552B2 (ja) * 2003-06-16 2007-06-06 シャープ株式会社 導電性ボールおよびそれを用いた電子部品の外部電極形成方法
JP4137112B2 (ja) * 2005-10-20 2008-08-20 日本テキサス・インスツルメンツ株式会社 電子部品の製造方法
JP4791244B2 (ja) * 2006-05-11 2011-10-12 新光電気工業株式会社 電子部品内蔵基板及びその製造方法
KR101101550B1 (ko) * 2009-09-14 2012-01-02 삼성전기주식회사 솔더 볼 및 반도체 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970017898A (ko) * 1995-09-30 1997-04-30 김광호 칩 온 글래스(Chip On Glass) 접합방법
KR20060097308A (ko) * 2005-03-05 2006-09-14 삼성전자주식회사 실장용 솔더를 구비하는 반도체 패키지
JP2007115857A (ja) * 2005-10-20 2007-05-10 Nippon Steel Chem Co Ltd マイクロボール

Also Published As

Publication number Publication date
JP5159750B2 (ja) 2013-03-13
JP2012089898A (ja) 2012-05-10
KR20110028939A (ko) 2011-03-22
JP2011061175A (ja) 2011-03-24

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