KR101056305B1 - 구동 신호 출력 회로 및 멀티 칩 패키지 - Google Patents

구동 신호 출력 회로 및 멀티 칩 패키지 Download PDF

Info

Publication number
KR101056305B1
KR101056305B1 KR1020090062600A KR20090062600A KR101056305B1 KR 101056305 B1 KR101056305 B1 KR 101056305B1 KR 1020090062600 A KR1020090062600 A KR 1020090062600A KR 20090062600 A KR20090062600 A KR 20090062600A KR 101056305 B1 KR101056305 B1 KR 101056305B1
Authority
KR
South Korea
Prior art keywords
signal
input
logic
input signal
nand gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020090062600A
Other languages
English (en)
Korean (ko)
Other versions
KR20100007767A (ko
Inventor
사토시 요쿠
Original Assignee
산요 세미컨덕터 컴퍼니 리미티드
산요덴키가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 산요 세미컨덕터 컴퍼니 리미티드, 산요덴키가부시키가이샤 filed Critical 산요 세미컨덕터 컴퍼니 리미티드
Publication of KR20100007767A publication Critical patent/KR20100007767A/ko
Application granted granted Critical
Publication of KR101056305B1 publication Critical patent/KR101056305B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02PCONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P8/00Arrangements for controlling dynamo-electric motors rotating step by step
    • H02P8/12Control or stabilisation of current
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Control Of Stepping Motors (AREA)
KR1020090062600A 2008-07-10 2009-07-09 구동 신호 출력 회로 및 멀티 칩 패키지 Expired - Fee Related KR101056305B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008180772A JP2010022137A (ja) 2008-07-10 2008-07-10 駆動信号出力回路およびマルチチップパッケージ
JPJP-P-2008-180772 2008-07-10

Publications (2)

Publication Number Publication Date
KR20100007767A KR20100007767A (ko) 2010-01-22
KR101056305B1 true KR101056305B1 (ko) 2011-08-11

Family

ID=41504606

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090062600A Expired - Fee Related KR101056305B1 (ko) 2008-07-10 2009-07-09 구동 신호 출력 회로 및 멀티 칩 패키지

Country Status (4)

Country Link
US (1) US7928771B2 (enExample)
JP (1) JP2010022137A (enExample)
KR (1) KR101056305B1 (enExample)
CN (1) CN101626218B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100969695B1 (ko) 2008-03-31 2010-07-14 르네사스 일렉트로닉스 가부시키가이샤 동작모드를 스위칭할 수 있는 반도체장치
KR101096267B1 (ko) 2010-03-31 2011-12-22 주식회사 하이닉스반도체 출력인에이블신호 생성회로를 포함하는 멀티칩 패키지 및 멀티칩 패키지의 데이터출력 제어방법
JP5808780B2 (ja) * 2013-09-09 2015-11-10 リンナイ株式会社 ステッピングモータの回路システムの異常検知装置
US10268613B2 (en) * 2016-02-23 2019-04-23 Lockheed Martin Corporation Redundant control system devoid of programmable devices
TWI677181B (zh) * 2018-11-08 2019-11-11 財團法人工業技術研究院 多軸線圈共接式音圈馬達驅動裝置
KR102695851B1 (ko) * 2023-12-22 2024-08-20 인터콘시스템스 주식회사 Bldc 모터 제어장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100331008B1 (ko) * 1997-04-28 2002-09-26 닛본 덴기 가부시끼가이샤 작은 시상수 재생 전류로를 갖는 스테핑 모터 구동 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170442A (ja) * 1988-12-22 1990-07-02 Mitsubishi Electric Corp 半導体集積回路装置
US5471122A (en) * 1993-09-14 1995-11-28 Allegro Microsystems, Inc. DC-motor bridge driver with end-of-braking detector
JP3853066B2 (ja) * 1998-04-10 2006-12-06 株式会社リコー 半導体記憶装置
US6943510B2 (en) * 2001-08-06 2005-09-13 Black & Decker Inc. Excitation circuit and control method for flux switching motor
JP3899071B2 (ja) * 2003-12-19 2007-03-28 松下電器産業株式会社 ステッピングモータ駆動装置、及びステッピングモータ駆動方法
JP2006246642A (ja) 2005-03-04 2006-09-14 Sanyo Electric Co Ltd モータ制御回路及びモータ制御方法
JP2007074794A (ja) * 2005-09-06 2007-03-22 Rohm Co Ltd 過電流保護回路、負荷駆動装置、モータ駆動装置、電気機器、電源装置
JP4890138B2 (ja) * 2006-07-24 2012-03-07 ローム株式会社 モータの駆動回路および電子機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100331008B1 (ko) * 1997-04-28 2002-09-26 닛본 덴기 가부시끼가이샤 작은 시상수 재생 전류로를 갖는 스테핑 모터 구동 장치

Also Published As

Publication number Publication date
KR20100007767A (ko) 2010-01-22
CN101626218A (zh) 2010-01-13
CN101626218B (zh) 2012-07-25
JP2010022137A (ja) 2010-01-28
US7928771B2 (en) 2011-04-19
US20100007381A1 (en) 2010-01-14

Similar Documents

Publication Publication Date Title
KR101056305B1 (ko) 구동 신호 출력 회로 및 멀티 칩 패키지
US5939930A (en) Interconnect structure for FPGA using a multiplexer
KR100810611B1 (ko) 반도체 장치의 레벨 쉬프팅 회로
KR100358868B1 (ko) 출력 버퍼 제어 회로
JP4004460B2 (ja) 半導体装置
JP2007074771A (ja) 電圧駆動型スイッチング回路、多相インバータ装置、および、電圧駆動型スイッチング制御方法
JPH11145815A (ja) 3値出力回路
WO2013145792A1 (ja) 電力変換装置
CN112104250B (zh) 半导体模块及半导体封装件
US5442218A (en) CMOS power fet driver including multiple power MOSFET transistors connected in parallel, each carrying an equivalent portion of the total driver current
JP2008277449A (ja) 半導体装置
JPH1197998A (ja) 出力回路
JP2007534244A (ja) 出力段システム
US11387753B2 (en) Semiconductor integrated circuit, semiconductor integrated circuit device, and motor-drive control system
JP4115973B2 (ja) 半導体装置および制御方法
JP3685027B2 (ja) 半導体集積回路装置
WO2025084402A1 (ja) 電力変換装置
JP4842663B2 (ja) 汎用ドライバ回路
JPS61288517A (ja) 半導体集積回路装置
JP2017112294A (ja) 半導体装置及びモータドライバ
JPH07263632A (ja) 半導体集積回路の駆動方法および半導体集積回路
JP2004166061A (ja) 負荷制御回路
JP2894277B2 (ja) バスドライバ
JP2025153349A (ja) 半導体装置
JPH01177219A (ja) マスタ・スライス型半導体集積回路装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20140805

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20140805

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000