CN101626218B - 驱动信号输出电路以及多芯片封装 - Google Patents

驱动信号输出电路以及多芯片封装 Download PDF

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Publication number
CN101626218B
CN101626218B CN2009101585420A CN200910158542A CN101626218B CN 101626218 B CN101626218 B CN 101626218B CN 2009101585420 A CN2009101585420 A CN 2009101585420A CN 200910158542 A CN200910158542 A CN 200910158542A CN 101626218 B CN101626218 B CN 101626218B
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CN
China
Prior art keywords
logic
input
signal
output circuit
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101585420A
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English (en)
Chinese (zh)
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CN101626218A (zh
Inventor
横尾聪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
System Solutions Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Sanyo Electric Co Ltd, Sanyo Semiconductor Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of CN101626218A publication Critical patent/CN101626218A/zh
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P8/00—Arrangements for controlling dynamo-electric motors rotating step by step
    • H02P8/12—Control or stabilisation of current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Control Of Stepping Motors (AREA)
CN2009101585420A 2008-07-10 2009-07-10 驱动信号输出电路以及多芯片封装 Expired - Fee Related CN101626218B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008180772 2008-07-10
JP2008180772A JP2010022137A (ja) 2008-07-10 2008-07-10 駆動信号出力回路およびマルチチップパッケージ
JP2008-180772 2008-07-10

Publications (2)

Publication Number Publication Date
CN101626218A CN101626218A (zh) 2010-01-13
CN101626218B true CN101626218B (zh) 2012-07-25

Family

ID=41504606

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101585420A Expired - Fee Related CN101626218B (zh) 2008-07-10 2009-07-10 驱动信号输出电路以及多芯片封装

Country Status (4)

Country Link
US (1) US7928771B2 (enExample)
JP (1) JP2010022137A (enExample)
KR (1) KR101056305B1 (enExample)
CN (1) CN101626218B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100969695B1 (ko) 2008-03-31 2010-07-14 르네사스 일렉트로닉스 가부시키가이샤 동작모드를 스위칭할 수 있는 반도체장치
KR101096267B1 (ko) 2010-03-31 2011-12-22 주식회사 하이닉스반도체 출력인에이블신호 생성회로를 포함하는 멀티칩 패키지 및 멀티칩 패키지의 데이터출력 제어방법
JP5808780B2 (ja) * 2013-09-09 2015-11-10 リンナイ株式会社 ステッピングモータの回路システムの異常検知装置
US10268613B2 (en) * 2016-02-23 2019-04-23 Lockheed Martin Corporation Redundant control system devoid of programmable devices
TWI677181B (zh) * 2018-11-08 2019-11-11 財團法人工業技術研究院 多軸線圈共接式音圈馬達驅動裝置
KR102695851B1 (ko) * 2023-12-22 2024-08-20 인터콘시스템스 주식회사 Bldc 모터 제어장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5471122A (en) * 1993-09-14 1995-11-28 Allegro Microsystems, Inc. DC-motor bridge driver with end-of-braking detector
CN1630182A (zh) * 2003-12-19 2005-06-22 松下电器产业株式会社 步进马达驱动装置和方法
US6943510B2 (en) * 2001-08-06 2005-09-13 Black & Decker Inc. Excitation circuit and control method for flux switching motor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170442A (ja) * 1988-12-22 1990-07-02 Mitsubishi Electric Corp 半導体集積回路装置
JP3365250B2 (ja) * 1997-04-28 2003-01-08 関西日本電気株式会社 ステッピングモータ駆動装置
JP3853066B2 (ja) * 1998-04-10 2006-12-06 株式会社リコー 半導体記憶装置
JP2006246642A (ja) 2005-03-04 2006-09-14 Sanyo Electric Co Ltd モータ制御回路及びモータ制御方法
JP2007074794A (ja) * 2005-09-06 2007-03-22 Rohm Co Ltd 過電流保護回路、負荷駆動装置、モータ駆動装置、電気機器、電源装置
JP4890138B2 (ja) * 2006-07-24 2012-03-07 ローム株式会社 モータの駆動回路および電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5471122A (en) * 1993-09-14 1995-11-28 Allegro Microsystems, Inc. DC-motor bridge driver with end-of-braking detector
US6943510B2 (en) * 2001-08-06 2005-09-13 Black & Decker Inc. Excitation circuit and control method for flux switching motor
CN1630182A (zh) * 2003-12-19 2005-06-22 松下电器产业株式会社 步进马达驱动装置和方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2006-246642A 2006.09.14

Also Published As

Publication number Publication date
KR20100007767A (ko) 2010-01-22
CN101626218A (zh) 2010-01-13
JP2010022137A (ja) 2010-01-28
US7928771B2 (en) 2011-04-19
US20100007381A1 (en) 2010-01-14
KR101056305B1 (ko) 2011-08-11

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Granted publication date: 20120725

Termination date: 20210710