KR101054238B1 - 웨이퍼 코팅 및 싱귤레이션 방법 - Google Patents

웨이퍼 코팅 및 싱귤레이션 방법 Download PDF

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Publication number
KR101054238B1
KR101054238B1 KR1020057004220A KR20057004220A KR101054238B1 KR 101054238 B1 KR101054238 B1 KR 101054238B1 KR 1020057004220 A KR1020057004220 A KR 1020057004220A KR 20057004220 A KR20057004220 A KR 20057004220A KR 101054238 B1 KR101054238 B1 KR 101054238B1
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South Korea
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wafer
integrated circuit
delete delete
underfill material
front side
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Expired - Fee Related
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KR1020057004220A
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English (en)
Korean (ko)
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KR20050054933A (ko
Inventor
징 콰이
제니스 댄버
토마스즈 클로소와크
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프리스케일 세미컨덕터, 인크.
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Wire Bonding (AREA)
KR1020057004220A 2002-09-11 2003-09-05 웨이퍼 코팅 및 싱귤레이션 방법 Expired - Fee Related KR101054238B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/241,265 2002-09-11
US10/241,265 US6649445B1 (en) 2002-09-11 2002-09-11 Wafer coating and singulation method
PCT/US2003/027964 WO2004034422A2 (en) 2002-09-11 2003-09-05 Wafer coating and singulation method

Publications (2)

Publication Number Publication Date
KR20050054933A KR20050054933A (ko) 2005-06-10
KR101054238B1 true KR101054238B1 (ko) 2011-08-08

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KR1020057004220A Expired - Fee Related KR101054238B1 (ko) 2002-09-11 2003-09-05 웨이퍼 코팅 및 싱귤레이션 방법

Country Status (6)

Country Link
US (1) US6649445B1 (enExample)
JP (1) JP2005538572A (enExample)
KR (1) KR101054238B1 (enExample)
CN (1) CN100416768C (enExample)
AU (1) AU2003296904A1 (enExample)
WO (1) WO2004034422A2 (enExample)

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US7423337B1 (en) 2002-08-19 2008-09-09 National Semiconductor Corporation Integrated circuit device package having a support coating for improved reliability during temperature cycling
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