JP4345808B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4345808B2 JP4345808B2 JP2006337835A JP2006337835A JP4345808B2 JP 4345808 B2 JP4345808 B2 JP 4345808B2 JP 2006337835 A JP2006337835 A JP 2006337835A JP 2006337835 A JP2006337835 A JP 2006337835A JP 4345808 B2 JP4345808 B2 JP 4345808B2
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Description
(1)チップの大形化に起因し、接着剤が均一に行き渡らない、
(2)接続用電極(バンプ)の微小化によりチップ間が狭くなる、
(3)接続用電極の数が多いため、接着剤がチップ間に入りにくくなる、
(4)接続用電極の数が多いと、接着剤がバンプに沿って流れ難くなり、不均一な充填のためボイドが発生する、
などの理由により、良好な接着剤充填が困難となる問題がある。
少なくとも前記第1の半導体ウエハについて、前記複数のチップ間を分離するスクライブ線上に溝を形成する工程と、
前記第1及び第2の半導体ウエハの少なくとも一方の表面に接着剤を塗布し、前記第1及び第2の半導体ウエハを相互に重ね合わせて加圧し、前記溝内に余剰の接着剤を収容する工程と、
前記第1及び第2の半導体ウエハの接続用電極間を接続する工程とを有することを特徴とする。
11、11A:シリコンウエハ
12:貫通電極(ポリシリコン電極)
13:半導体素子層
14:絶縁膜
15:バンプ
16:接着剤(接着剤層)
17:レジスト膜
18:インタポーザ基板
19:積層半導体素子
20:コントロールチップ
21:接続用バンプ
22:給電膜
23:チタン膜
24:銅膜
25:電気めっき錫膜
31:ニッケル膜
32:パッド電極
34:溝
Claims (3)
- 複数のチップと接続用電極とがそれぞれ形成された第1乃至第3の半導体ウエハを形成する工程と、
少なくとも前記第1及び第3の半導体ウエハについて、前記複数のチップ間を分離するスクライブ線上に溝を形成する工程と、
前記第1及び第2の半導体ウエハの少なくとも一方であって前記半導体ウエハ同士が対向する面に接着剤を塗布し、前記第1及び第2の半導体ウエハを相互に重ね合わせて加圧し、前記第1の半導体ウエハのスクライブ線上に形成した前記溝内に前記加圧した後の余剰の接着剤を収容する工程と、
前記第1及び第2の半導体ウエハの接続用電極間を接続する工程と、
前記第1又は第2の半導体ウエハの裏面を研磨し、該研磨した裏面に接続用電極を形成する工程と、
前記第3の半導体ウエハの表面と前記研磨した裏面の少なくとも一方に接着剤を塗布し、前記第3の半導体ウエハの表面と前記研磨した裏面とを相互に重ね合わせて加圧し、前記第3の半導体ウエハのスクライブ線上に形成した前記溝内に前記加圧した後の余剰の接着剤を収容する工程と、
前記第3の半導体ウエハの接続用電極と、前記研磨した裏面に形成された接続用電極とを接続する工程とを有することを特徴とする半導体装置の製造方法。 - 前記半導体ウエハの表面に接続用電極を形成する工程が、ドライフィルムを用いる電気めっき法により金属膜を堆積する工程を含む、請求項1に記載の半導体装置の製造方法。
- 前記溝を形成する工程が、ハーフカット・ダイシング工法によって行われる、請求項1又は2に記載の半導体装置の製造方法。
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US7871857B1 (en) * | 2008-09-29 | 2011-01-18 | Integrated Device Technology, Inc. | Methods of forming multi-chip semiconductor substrates |
KR100945800B1 (ko) * | 2008-12-09 | 2010-03-05 | 김영혜 | 이종 접합 웨이퍼 제조방법 |
JP5275192B2 (ja) | 2009-09-28 | 2013-08-28 | ローム株式会社 | 半導体装置の製造方法、半導体装置およびウエハ積層構造物 |
US8698322B2 (en) * | 2010-03-24 | 2014-04-15 | Oracle International Corporation | Adhesive-bonded substrates in a multi-chip module |
US9161448B2 (en) | 2010-03-29 | 2015-10-13 | Semprius, Inc. | Laser assisted transfer welding process |
JP5183708B2 (ja) * | 2010-09-21 | 2013-04-17 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
US8652935B2 (en) | 2010-12-16 | 2014-02-18 | Tessera, Inc. | Void-free wafer bonding using channels |
US8486758B2 (en) | 2010-12-20 | 2013-07-16 | Tessera, Inc. | Simultaneous wafer bonding and interconnect joining |
US9412727B2 (en) | 2011-09-20 | 2016-08-09 | Semprius, Inc. | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion |
JP2013211474A (ja) * | 2012-03-30 | 2013-10-10 | Olympus Corp | 基板および半導体装置 |
US20160020131A1 (en) | 2014-07-20 | 2016-01-21 | X-Celeprint Limited | Apparatus and methods for micro-transfer-printing |
US9704821B2 (en) | 2015-08-11 | 2017-07-11 | X-Celeprint Limited | Stamp with structured posts |
US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
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US10103069B2 (en) | 2016-04-01 | 2018-10-16 | X-Celeprint Limited | Pressure-activated electrical interconnection by micro-transfer printing |
US10222698B2 (en) | 2016-07-28 | 2019-03-05 | X-Celeprint Limited | Chiplets with wicking posts |
US11064609B2 (en) | 2016-08-04 | 2021-07-13 | X Display Company Technology Limited | Printable 3D electronic structure |
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US10796971B2 (en) | 2018-08-13 | 2020-10-06 | X Display Company Technology Limited | Pressure-activated electrical interconnection with additive repair |
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US10748793B1 (en) | 2019-02-13 | 2020-08-18 | X Display Company Technology Limited | Printing component arrays with different orientations |
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US6015652A (en) * | 1998-02-27 | 2000-01-18 | Lucent Technologies Inc. | Manufacture of flip-chip device |
JP3556503B2 (ja) * | 1999-01-20 | 2004-08-18 | 沖電気工業株式会社 | 樹脂封止型半導体装置の製造方法 |
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US6649445B1 (en) * | 2002-09-11 | 2003-11-18 | Motorola, Inc. | Wafer coating and singulation method |
US7301222B1 (en) * | 2003-02-12 | 2007-11-27 | National Semiconductor Corporation | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages |
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