KR101010159B1 - 얇은 언더필 및 두꺼운 솔더 마스크를 가지는 플립-칩어셈블리 - Google Patents

얇은 언더필 및 두꺼운 솔더 마스크를 가지는 플립-칩어셈블리 Download PDF

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KR101010159B1
KR101010159B1 KR1020057018230A KR20057018230A KR101010159B1 KR 101010159 B1 KR101010159 B1 KR 101010159B1 KR 1020057018230 A KR1020057018230 A KR 1020057018230A KR 20057018230 A KR20057018230 A KR 20057018230A KR 101010159 B1 KR101010159 B1 KR 101010159B1
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flip chip
underfill material
underfill
active surface
delete delete
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Korean (ko)
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KR20050118694A (ko
Inventor
징 퀴
제니스 엠. 댄버
토마즈 엘. 클로소위아크
프라산나 쿨카니
나디아 얄라
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프리스케일 세미컨덕터, 인크.
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    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
KR1020057018230A 2003-03-28 2004-03-24 얇은 언더필 및 두꺼운 솔더 마스크를 가지는 플립-칩어셈블리 Expired - Lifetime KR101010159B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/402,631 2003-03-28
US10/402,631 US6774497B1 (en) 2003-03-28 2003-03-28 Flip-chip assembly with thin underfill and thick solder mask

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Publication Number Publication Date
KR20050118694A KR20050118694A (ko) 2005-12-19
KR101010159B1 true KR101010159B1 (ko) 2011-01-20

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US (1) US6774497B1 (enExample)
JP (1) JP4703556B2 (enExample)
KR (1) KR101010159B1 (enExample)
MY (1) MY136290A (enExample)
TW (1) TWI340442B (enExample)
WO (1) WO2004086845A2 (enExample)

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