KR100995478B1 - 패키지형 반도체 디바이스 및 그 형성 방법 - Google Patents

패키지형 반도체 디바이스 및 그 형성 방법 Download PDF

Info

Publication number
KR100995478B1
KR100995478B1 KR1020030007424A KR20030007424A KR100995478B1 KR 100995478 B1 KR100995478 B1 KR 100995478B1 KR 1020030007424 A KR1020030007424 A KR 1020030007424A KR 20030007424 A KR20030007424 A KR 20030007424A KR 100995478 B1 KR100995478 B1 KR 100995478B1
Authority
KR
South Korea
Prior art keywords
die
heat spreader
heat
top surface
packaged semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020030007424A
Other languages
English (en)
Korean (ko)
Other versions
KR20030067542A (ko
Inventor
저버마크에이.
오코너숀엠.
톰슨트렌트에이.
Original Assignee
프리스케일 세미컨덕터, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 프리스케일 세미컨덕터, 인크. filed Critical 프리스케일 세미컨덕터, 인크.
Publication of KR20030067542A publication Critical patent/KR20030067542A/ko
Application granted granted Critical
Publication of KR100995478B1 publication Critical patent/KR100995478B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/28—Configurations of stacked chips the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020030007424A 2002-02-07 2003-02-06 패키지형 반도체 디바이스 및 그 형성 방법 Expired - Fee Related KR100995478B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/072,167 2002-02-07
US10/072,167 US6858932B2 (en) 2002-02-07 2002-02-07 Packaged semiconductor device and method of formation

Publications (2)

Publication Number Publication Date
KR20030067542A KR20030067542A (ko) 2003-08-14
KR100995478B1 true KR100995478B1 (ko) 2010-11-22

Family

ID=27610553

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030007424A Expired - Fee Related KR100995478B1 (ko) 2002-02-07 2003-02-06 패키지형 반도체 디바이스 및 그 형성 방법

Country Status (5)

Country Link
US (1) US6858932B2 (enExample)
EP (1) EP1335426A3 (enExample)
JP (1) JP4653383B2 (enExample)
KR (1) KR100995478B1 (enExample)
CN (2) CN101150098B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6853070B2 (en) * 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
US6794748B1 (en) * 2003-04-22 2004-09-21 Intel Corporation Substrate-less microelectronic package
US7190068B2 (en) * 2004-06-25 2007-03-13 Intel Corporation Bottom heat spreader
US7071556B2 (en) * 2004-09-10 2006-07-04 Jinghui Mu Tape ball grid array package with electromagnetic interference protection and method for fabricating the package
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
KR100700936B1 (ko) * 2006-01-25 2007-03-28 삼성전자주식회사 냉각 장치 및 이를 갖는 메모리 모듈
US9713258B2 (en) * 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
US20090039524A1 (en) * 2007-08-08 2009-02-12 Texas Instruments Incorporated Methods and apparatus to support an overhanging region of a stacked die
US8472190B2 (en) * 2010-09-24 2013-06-25 Ati Technologies Ulc Stacked semiconductor chip device with thermal management
TWI446495B (zh) * 2011-01-19 2014-07-21 旭德科技股份有限公司 封裝載板及其製作方法
US9070657B2 (en) 2013-10-08 2015-06-30 Freescale Semiconductor, Inc. Heat conductive substrate for integrated circuit package
KR20170001238A (ko) * 2015-06-26 2017-01-04 에스케이하이닉스 주식회사 계단형 기판을 포함하는 반도체 패키지
US10741534B2 (en) * 2018-09-28 2020-08-11 Intel Corporation Multi-die microelectronic device with integral heat spreader
US20240055292A1 (en) * 2022-08-15 2024-02-15 UTAC Headquarters Pte. Ltd. Semiconductor Device Carriers and Methods of Making and Using

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332160A (ja) * 1999-05-24 2000-11-30 Sumitomo Metal Electronics Devices Inc キャビティダウン型半導体パッケージ
US6184580B1 (en) * 1999-09-10 2001-02-06 Siliconware Precision Industries Co., Ltd. Ball grid array package with conductive leads
JP2001068512A (ja) * 1999-08-27 2001-03-16 Hitachi Cable Ltd スティフナ付きｔａｂテープおよびｂｇａパッケージ
JP2001267469A (ja) 2000-03-16 2001-09-28 Denso Corp 樹脂封止型半導体装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232651A (ja) * 1985-04-09 1986-10-16 Seiko Epson Corp 半導体実装方法
JP2660732B2 (ja) * 1989-01-09 1997-10-08 株式会社日立製作所 半導体装置
JPH0458539A (ja) * 1990-06-27 1992-02-25 Mitsubishi Electric Corp 混成集積回路装置
US5216278A (en) * 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5468994A (en) 1992-12-10 1995-11-21 Hewlett-Packard Company High pin count package for semiconductor device
JP2591499B2 (ja) * 1994-10-21 1997-03-19 日本電気株式会社 半導体装置
JP2636777B2 (ja) 1995-02-14 1997-07-30 日本電気株式会社 マイクロプロセッサ用半導体モジュール
TW373308B (en) * 1995-02-24 1999-11-01 Agere Systems Inc Thin packaging of multi-chip modules with enhanced thermal/power management
JPH0917919A (ja) 1995-06-29 1997-01-17 Fujitsu Ltd 半導体装置
US5844168A (en) 1995-08-01 1998-12-01 Minnesota Mining And Manufacturing Company Multi-layer interconnect sutructure for ball grid arrays
JPH0992748A (ja) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp 半導体素子用パッケージ
US6404049B1 (en) * 1995-11-28 2002-06-11 Hitachi, Ltd. Semiconductor device, manufacturing method thereof and mounting board
US5843808A (en) 1996-01-11 1998-12-01 Asat, Limited Structure and method for automated assembly of a tab grid array package
US5696031A (en) 1996-11-20 1997-12-09 Micron Technology, Inc. Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
KR100214549B1 (ko) * 1996-12-30 1999-08-02 구본준 버텀리드 반도체 패키지
US6008536A (en) * 1997-06-23 1999-12-28 Lsi Logic Corporation Grid array device package including advanced heat transfer mechanisms
US5919329A (en) 1997-10-14 1999-07-06 Gore Enterprise Holdings, Inc. Method for assembling an integrated circuit chip package having at least one semiconductor device
JPH11219984A (ja) 1997-11-06 1999-08-10 Sharp Corp 半導体装置パッケージおよびその製造方法ならびにそのための回路基板
JP3610769B2 (ja) * 1998-03-25 2005-01-19 イビデン株式会社 多層電子部品搭載用基板
JP2000077563A (ja) * 1998-08-31 2000-03-14 Sharp Corp 半導体装置およびその製造方法
JP2000174180A (ja) * 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
JP3512657B2 (ja) 1998-12-22 2004-03-31 シャープ株式会社 半導体装置
JP3344362B2 (ja) * 1999-05-07 2002-11-11 日本電気株式会社 フィルムキャリア型半導体装置
TW429494B (en) * 1999-11-08 2001-04-11 Siliconware Precision Industries Co Ltd Quad flat non-leaded package
JP2001267476A (ja) * 2000-03-17 2001-09-28 Aronshiya:Kk 半導体パッケージ用ヒートスプレッダの製造方法
TW466723B (en) * 2000-12-01 2001-12-01 Siliconware Precision Industries Co Ltd Super thin package having high heat-dissipation property

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332160A (ja) * 1999-05-24 2000-11-30 Sumitomo Metal Electronics Devices Inc キャビティダウン型半導体パッケージ
JP2001068512A (ja) * 1999-08-27 2001-03-16 Hitachi Cable Ltd スティフナ付きｔａｂテープおよびｂｇａパッケージ
US6184580B1 (en) * 1999-09-10 2001-02-06 Siliconware Precision Industries Co., Ltd. Ball grid array package with conductive leads
JP2001267469A (ja) 2000-03-16 2001-09-28 Denso Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JP4653383B2 (ja) 2011-03-16
CN101150098A (zh) 2008-03-26
US6858932B2 (en) 2005-02-22
CN1319138C (zh) 2007-05-30
EP1335426A3 (en) 2008-07-30
US20030148554A1 (en) 2003-08-07
JP2003243565A (ja) 2003-08-29
CN101150098B (zh) 2011-11-23
CN1437233A (zh) 2003-08-20
EP1335426A2 (en) 2003-08-13
KR20030067542A (ko) 2003-08-14

Similar Documents

Publication Publication Date Title
KR100260997B1 (ko) 반도체패키지
US7960827B1 (en) Thermal via heat spreader package and method
USRE42653E1 (en) Semiconductor package with heat dissipating structure
US5991156A (en) Ball grid array integrated circuit package with high thermal conductivity
US5285352A (en) Pad array semiconductor device with thermal conductor and process for making the same
US9947641B2 (en) Wire bond support structure and microelectronic package including wire bonds therefrom
US5834839A (en) Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly
US7928590B2 (en) Integrated circuit package with a heat dissipation device
KR100698526B1 (ko) 방열층을 갖는 배선기판 및 그를 이용한 반도체 패키지
KR20050064144A (ko) 수직 실장된 반도체 칩 패키지를 갖는 반도체 모듈
KR100995478B1 (ko) 패키지형 반도체 디바이스 및 그 형성 방법
KR20050077866A (ko) 열방출형 반도체 패키지 및 그 제조방법
US6501164B1 (en) Multi-chip semiconductor package with heat dissipating structure
US6559537B1 (en) Ball grid array packages with thermally conductive containers
US20020189853A1 (en) BGA substrate with direct heat dissipating structure
US6750397B2 (en) Thermally enhanced semiconductor build-up package
WO2007147366A1 (en) Ic packages with internal heat dissipation structures
KR20020043395A (ko) 반도체 패키지
KR101089647B1 (ko) 단층 패키지 기판 및 그 제조방법
EP0676806B1 (en) Ball grid array intergrated circuit package with high thermal conductivity
KR100674411B1 (ko) 코어볼을 이용한 반도체 패키지 및 그 제조방법
KR100708050B1 (ko) 반도체패키지
KR20000011420U (ko) 적층형 반도체 패키지
KR20050104204A (ko) 스택 패키지
KR20030077784A (ko) 테이프 볼 그리드 어레이 패키지

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20131025

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20141028

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20151027

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20161027

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20171116

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20171116

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000