JP4653383B2 - パッケージ化半導体装置およびその製作方法 - Google Patents

パッケージ化半導体装置およびその製作方法 Download PDF

Info

Publication number
JP4653383B2
JP4653383B2 JP2003030887A JP2003030887A JP4653383B2 JP 4653383 B2 JP4653383 B2 JP 4653383B2 JP 2003030887 A JP2003030887 A JP 2003030887A JP 2003030887 A JP2003030887 A JP 2003030887A JP 4653383 B2 JP4653383 B2 JP 4653383B2
Authority
JP
Japan
Prior art keywords
heat spreader
die
semiconductor die
semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003030887A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003243565A5 (enExample
JP2003243565A (ja
Inventor
エイ． ガーバー、マーク
エム． オコナー、ショーン
エイ． トンプソン、トレント
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2003243565A publication Critical patent/JP2003243565A/ja
Publication of JP2003243565A5 publication Critical patent/JP2003243565A5/ja
Application granted granted Critical
Publication of JP4653383B2 publication Critical patent/JP4653383B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H10W90/00—
    • H10W40/778—
    • H10W70/682—
    • H10W72/075—
    • H10W72/551—
    • H10W72/951—
    • H10W72/952—
    • H10W74/00—
    • H10W74/10—
    • H10W90/28—
    • H10W90/288—
    • H10W90/732—
    • H10W90/752—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003030887A 2002-02-07 2003-02-07 パッケージ化半導体装置およびその製作方法 Expired - Fee Related JP4653383B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/072,167 US6858932B2 (en) 2002-02-07 2002-02-07 Packaged semiconductor device and method of formation
US10/072167 2002-02-07

Publications (3)

Publication Number Publication Date
JP2003243565A JP2003243565A (ja) 2003-08-29
JP2003243565A5 JP2003243565A5 (enExample) 2006-05-18
JP4653383B2 true JP4653383B2 (ja) 2011-03-16

Family

ID=27610553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003030887A Expired - Fee Related JP4653383B2 (ja) 2002-02-07 2003-02-07 パッケージ化半導体装置およびその製作方法

Country Status (5)

Country Link
US (1) US6858932B2 (enExample)
EP (1) EP1335426A3 (enExample)
JP (1) JP4653383B2 (enExample)
KR (1) KR100995478B1 (enExample)
CN (2) CN101150098B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6853070B2 (en) * 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
US6794748B1 (en) * 2003-04-22 2004-09-21 Intel Corporation Substrate-less microelectronic package
US7190068B2 (en) * 2004-06-25 2007-03-13 Intel Corporation Bottom heat spreader
US7071556B2 (en) * 2004-09-10 2006-07-04 Jinghui Mu Tape ball grid array package with electromagnetic interference protection and method for fabricating the package
US7786591B2 (en) 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
KR100700936B1 (ko) * 2006-01-25 2007-03-28 삼성전자주식회사 냉각 장치 및 이를 갖는 메모리 모듈
US9713258B2 (en) * 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
US20090039524A1 (en) * 2007-08-08 2009-02-12 Texas Instruments Incorporated Methods and apparatus to support an overhanging region of a stacked die
US8472190B2 (en) * 2010-09-24 2013-06-25 Ati Technologies Ulc Stacked semiconductor chip device with thermal management
TWI446495B (zh) * 2011-01-19 2014-07-21 旭德科技股份有限公司 封裝載板及其製作方法
US9070657B2 (en) 2013-10-08 2015-06-30 Freescale Semiconductor, Inc. Heat conductive substrate for integrated circuit package
KR20170001238A (ko) * 2015-06-26 2017-01-04 에스케이하이닉스 주식회사 계단형 기판을 포함하는 반도체 패키지
US10741534B2 (en) * 2018-09-28 2020-08-11 Intel Corporation Multi-die microelectronic device with integral heat spreader
US20240055292A1 (en) * 2022-08-15 2024-02-15 UTAC Headquarters Pte. Ltd. Semiconductor Device Carriers and Methods of Making and Using

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232651A (ja) * 1985-04-09 1986-10-16 Seiko Epson Corp 半導体実装方法
JP2660732B2 (ja) * 1989-01-09 1997-10-08 株式会社日立製作所 半導体装置
JPH0458539A (ja) * 1990-06-27 1992-02-25 Mitsubishi Electric Corp 混成集積回路装置
US5216278A (en) * 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5468994A (en) 1992-12-10 1995-11-21 Hewlett-Packard Company High pin count package for semiconductor device
JP2591499B2 (ja) * 1994-10-21 1997-03-19 日本電気株式会社 半導体装置
JP2636777B2 (ja) 1995-02-14 1997-07-30 日本電気株式会社 マイクロプロセッサ用半導体モジュール
TW373308B (en) * 1995-02-24 1999-11-01 Agere Systems Inc Thin packaging of multi-chip modules with enhanced thermal/power management
JPH0917919A (ja) 1995-06-29 1997-01-17 Fujitsu Ltd 半導体装置
US5844168A (en) 1995-08-01 1998-12-01 Minnesota Mining And Manufacturing Company Multi-layer interconnect sutructure for ball grid arrays
JPH0992748A (ja) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp 半導体素子用パッケージ
US6404049B1 (en) * 1995-11-28 2002-06-11 Hitachi, Ltd. Semiconductor device, manufacturing method thereof and mounting board
US5843808A (en) 1996-01-11 1998-12-01 Asat, Limited Structure and method for automated assembly of a tab grid array package
US5696031A (en) 1996-11-20 1997-12-09 Micron Technology, Inc. Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
KR100214549B1 (ko) * 1996-12-30 1999-08-02 구본준 버텀리드 반도체 패키지
US6008536A (en) * 1997-06-23 1999-12-28 Lsi Logic Corporation Grid array device package including advanced heat transfer mechanisms
US5919329A (en) 1997-10-14 1999-07-06 Gore Enterprise Holdings, Inc. Method for assembling an integrated circuit chip package having at least one semiconductor device
JPH11219984A (ja) 1997-11-06 1999-08-10 Sharp Corp 半導体装置パッケージおよびその製造方法ならびにそのための回路基板
JP3610769B2 (ja) * 1998-03-25 2005-01-19 イビデン株式会社 多層電子部品搭載用基板
JP2000077563A (ja) * 1998-08-31 2000-03-14 Sharp Corp 半導体装置およびその製造方法
JP2000174180A (ja) * 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
JP3512657B2 (ja) 1998-12-22 2004-03-31 シャープ株式会社 半導体装置
JP3344362B2 (ja) * 1999-05-07 2002-11-11 日本電気株式会社 フィルムキャリア型半導体装置
JP2000332160A (ja) * 1999-05-24 2000-11-30 Sumitomo Metal Electronics Devices Inc キャビティダウン型半導体パッケージ
JP3589109B2 (ja) * 1999-08-27 2004-11-17 日立電線株式会社 スティフナ付きｔａｂテープおよびｂｇａパッケージ
US6184580B1 (en) * 1999-09-10 2001-02-06 Siliconware Precision Industries Co., Ltd. Ball grid array package with conductive leads
TW429494B (en) * 1999-11-08 2001-04-11 Siliconware Precision Industries Co Ltd Quad flat non-leaded package
JP4253992B2 (ja) 2000-03-16 2009-04-15 株式会社デンソー 樹脂封止型半導体装置
JP2001267476A (ja) * 2000-03-17 2001-09-28 Aronshiya:Kk 半導体パッケージ用ヒートスプレッダの製造方法
TW466723B (en) * 2000-12-01 2001-12-01 Siliconware Precision Industries Co Ltd Super thin package having high heat-dissipation property

Also Published As

Publication number Publication date
EP1335426A3 (en) 2008-07-30
KR20030067542A (ko) 2003-08-14
KR100995478B1 (ko) 2010-11-22
JP2003243565A (ja) 2003-08-29
CN1319138C (zh) 2007-05-30
CN101150098A (zh) 2008-03-26
EP1335426A2 (en) 2003-08-13
US6858932B2 (en) 2005-02-22
US20030148554A1 (en) 2003-08-07
CN101150098B (zh) 2011-11-23
CN1437233A (zh) 2003-08-20

Similar Documents

Publication Publication Date Title
US10297573B2 (en) Three-dimensional package structure and the method to fabricate thereof
US6060778A (en) Ball grid array package
EP1374305B1 (en) Enhanced die-down ball grid array and method for making the same
KR100260997B1 (ko) 반도체패키지
US6566164B1 (en) Exposed copper strap in a semiconductor package
US7432583B2 (en) Leadless leadframe package substitute and stack package
US7928590B2 (en) Integrated circuit package with a heat dissipation device
KR100442880B1 (ko) 적층형 반도체 모듈 및 그 제조방법
US5910682A (en) Semiconductor chip stack package
US20160329308A1 (en) Wire bond support structure and microelectronic package including wire bonds therefrom
US20020093087A1 (en) Semiconductor package with stacked dies
US6857470B2 (en) Stacked chip package with heat transfer wires
JP4653383B2 (ja) パッケージ化半導体装置およびその製作方法
JP2005535103A (ja) 半導体パッケージ装置ならびに製作および試験方法
CN1937194A (zh) 制作叠层小片封装的方法
US6791166B1 (en) Stackable lead frame package using exposed internal lead traces
US20070164411A1 (en) Semiconductor package structure and fabrication method thereof
KR20020043395A (ko) 반도체 패키지
KR100788341B1 (ko) 칩 적층형 반도체 패키지
KR100437821B1 (ko) 반도체 패키지 및 그 제조방법
JPH08172142A (ja) 半導体パッケージ及びその製造方法並びに半導体装置
US20080179721A1 (en) Stacking of transfer carriers with aperture arrays as interconnection joints
CN100446231C (zh) 半导体封装结构及其制法
KR100399724B1 (ko) 반도체패키지
KR100356801B1 (ko) 적층형 칩 스케일 패키지 및 그 제조방법

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20040927

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060324

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080402

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080909

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081205

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090929

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091130

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20101124

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20101217

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131224

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees