KR100983910B1 - 필름 박리 방법 및 필름 박리 장치 - Google Patents

필름 박리 방법 및 필름 박리 장치 Download PDF

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Publication number
KR100983910B1
KR100983910B1 KR1020087010639A KR20087010639A KR100983910B1 KR 100983910 B1 KR100983910 B1 KR 100983910B1 KR 1020087010639 A KR1020087010639 A KR 1020087010639A KR 20087010639 A KR20087010639 A KR 20087010639A KR 100983910 B1 KR100983910 B1 KR 100983910B1
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South Korea
Prior art keywords
wafer
film
peeling
groove
grinding
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Expired - Fee Related
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KR1020087010639A
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English (en)
Korean (ko)
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KR20080066759A (ko
Inventor
마사키 가나자와
Original Assignee
도쿄 세이미츄 코퍼레이션 리미티드
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Priority claimed from JP2005320636A external-priority patent/JP4817805B2/ja
Application filed by 도쿄 세이미츄 코퍼레이션 리미티드 filed Critical 도쿄 세이미츄 코퍼레이션 리미티드
Publication of KR20080066759A publication Critical patent/KR20080066759A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49819—Disassembling with conveying of work or disassembled work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49822—Disassembling by applying force
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53683—Spreading parts apart or separating them from face to face engagement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020087010639A 2005-11-04 2006-07-05 필름 박리 방법 및 필름 박리 장치 Expired - Fee Related KR100983910B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00320636 2005-11-04
JP2005320636A JP4817805B2 (ja) 2004-11-25 2005-11-04 フィルム剥離方法およびフィルム剥離装置
PCT/JP2006/313807 WO2007052387A1 (ja) 2005-11-04 2006-07-05 フィルム剥離方法およびフィルム剥離装置

Publications (2)

Publication Number Publication Date
KR20080066759A KR20080066759A (ko) 2008-07-16
KR100983910B1 true KR100983910B1 (ko) 2010-09-28

Family

ID=38005548

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087010639A Expired - Fee Related KR100983910B1 (ko) 2005-11-04 2006-07-05 필름 박리 방법 및 필름 박리 장치

Country Status (5)

Country Link
US (1) US8052824B2 (https=)
EP (1) EP1947688A4 (https=)
KR (1) KR100983910B1 (https=)
TW (1) TW200719394A (https=)
WO (1) WO2007052387A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5381821B2 (ja) 2010-03-10 2014-01-08 三菱電機株式会社 保護テープ剥離方法および保護テープ剥離装置
KR101989484B1 (ko) 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
TWI585028B (zh) * 2013-01-30 2017-06-01 斯克林集團公司 剝離裝置及剝離方法
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR102128396B1 (ko) 2013-10-22 2020-07-01 삼성디스플레이 주식회사 필름 박리 장치
CN104609241B (zh) * 2015-01-08 2017-03-15 中国科学院生物物理研究所 超薄切片收集器
JP2018014458A (ja) * 2016-07-22 2018-01-25 株式会社ディスコ 円形基板の製造方法
JP6914587B2 (ja) * 2017-05-25 2021-08-04 株式会社ディスコ ウェーハの加工方法
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
CN107984875A (zh) * 2017-12-01 2018-05-04 常德金德新材料科技股份有限公司 一种纸张涂布机薄膜剥离装置
CN109509846B (zh) * 2019-01-15 2024-02-23 深圳市易天自动化设备股份有限公司 一种oled膜片自动撕膜装置及其撕膜工艺
JP7415395B2 (ja) * 2019-09-25 2024-01-17 オムロン株式会社 保護シート剥離装置および保護シート剥離方法
CN111142182B (zh) * 2020-01-08 2021-09-17 上海向隆电子科技有限公司 具保护膜的导光板的加工方法、加工设备及其导光板
DE102022134515A1 (de) * 2022-12-22 2024-06-27 Advanced Engineering Industrie Automation GmbH Vorrichtung und Verfahren zum Abziehen von Schutzfolien von plattenförmigen Gegenständen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331963A (ja) 1999-05-21 2000-11-30 Tokyo Seimitsu Co Ltd ウェーハフレームへのウェーハ取付方法と装置及びそれを組込んだ平面加工装置
JP2000353710A (ja) 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP2004311576A (ja) 2003-04-03 2004-11-04 Toshiba Corp 半導体装置の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855823A (ja) 1994-08-12 1996-02-27 Toshiba Corp 半導体素子の製造方法
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP3809733B2 (ja) * 1998-02-25 2006-08-16 セイコーエプソン株式会社 薄膜トランジスタの剥離方法
JP3515917B2 (ja) 1998-12-01 2004-04-05 シャープ株式会社 半導体装置の製造方法
JP4028195B2 (ja) 2001-08-31 2007-12-26 Ｔｄｋ株式会社 剥離フィルムの製造方法
JP4919139B2 (ja) 2001-09-27 2012-04-18 Ｔｄｋ株式会社 セラミックコンデンサを製造するための剥離フィルムの製造方法
JP3976541B2 (ja) * 2001-10-23 2007-09-19 富士通株式会社 半導体チップの剥離方法及び装置
JP2004047823A (ja) 2002-07-12 2004-02-12 Tokyo Seimitsu Co Ltd ダイシングテープ貼付装置およびバックグラインド・ダイシングテープ貼付システム
JP4318471B2 (ja) 2003-03-05 2009-08-26 日東電工株式会社 保護テープの貼付・剥離方法
JP4519413B2 (ja) 2003-04-09 2010-08-04 リンテック株式会社 テープの貼付方法および貼付装置
JP2005045023A (ja) * 2003-07-22 2005-02-17 Toshiba Corp 半導体装置の製造方法および半導体製造装置
JP2006100413A (ja) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd フィルム貼付方法およびフィルム貼付装置
JP4565977B2 (ja) * 2004-11-25 2010-10-20 株式会社東京精密 フィルム剥離方法およびフィルム剥離装置
JP4442410B2 (ja) * 2004-12-15 2010-03-31 セイコーエプソン株式会社 異常診断システム
US8137417B2 (en) * 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331963A (ja) 1999-05-21 2000-11-30 Tokyo Seimitsu Co Ltd ウェーハフレームへのウェーハ取付方法と装置及びそれを組込んだ平面加工装置
JP2000353710A (ja) 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP2004311576A (ja) 2003-04-03 2004-11-04 Toshiba Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
EP1947688A1 (en) 2008-07-23
US20090107634A1 (en) 2009-04-30
US8052824B2 (en) 2011-11-08
EP1947688A4 (en) 2010-10-27
TW200719394A (en) 2007-05-16
WO2007052387A1 (ja) 2007-05-10
KR20080066759A (ko) 2008-07-16
TWI309848B (https=) 2009-05-11

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