TWI309848B - - Google Patents

Download PDF

Info

Publication number
TWI309848B
TWI309848B TW095124566A TW95124566A TWI309848B TW I309848 B TWI309848 B TW I309848B TW 095124566 A TW095124566 A TW 095124566A TW 95124566 A TW95124566 A TW 95124566A TW I309848 B TWI309848 B TW I309848B
Authority
TW
Taiwan
Prior art keywords
wafer
film
peeling
tape
groove
Prior art date
Application number
TW095124566A
Other languages
English (en)
Chinese (zh)
Other versions
TW200719394A (en
Inventor
Masaki Kanazawa
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005320636A external-priority patent/JP4817805B2/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200719394A publication Critical patent/TW200719394A/zh
Application granted granted Critical
Publication of TWI309848B publication Critical patent/TWI309848B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49819—Disassembling with conveying of work or disassembled work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49822—Disassembling by applying force
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53683—Spreading parts apart or separating them from face to face engagement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095124566A 2005-11-04 2006-07-05 Method and device for peeling off film TW200719394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005320636A JP4817805B2 (ja) 2004-11-25 2005-11-04 フィルム剥離方法およびフィルム剥離装置

Publications (2)

Publication Number Publication Date
TW200719394A TW200719394A (en) 2007-05-16
TWI309848B true TWI309848B (https=) 2009-05-11

Family

ID=38005548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124566A TW200719394A (en) 2005-11-04 2006-07-05 Method and device for peeling off film

Country Status (5)

Country Link
US (1) US8052824B2 (https=)
EP (1) EP1947688A4 (https=)
KR (1) KR100983910B1 (https=)
TW (1) TW200719394A (https=)
WO (1) WO2007052387A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5381821B2 (ja) 2010-03-10 2014-01-08 三菱電機株式会社 保護テープ剥離方法および保護テープ剥離装置
KR101989484B1 (ko) 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
TWI585028B (zh) * 2013-01-30 2017-06-01 斯克林集團公司 剝離裝置及剝離方法
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR102128396B1 (ko) 2013-10-22 2020-07-01 삼성디스플레이 주식회사 필름 박리 장치
CN104609241B (zh) * 2015-01-08 2017-03-15 中国科学院生物物理研究所 超薄切片收集器
JP2018014458A (ja) * 2016-07-22 2018-01-25 株式会社ディスコ 円形基板の製造方法
JP6914587B2 (ja) * 2017-05-25 2021-08-04 株式会社ディスコ ウェーハの加工方法
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
CN107984875A (zh) * 2017-12-01 2018-05-04 常德金德新材料科技股份有限公司 一种纸张涂布机薄膜剥离装置
CN109509846B (zh) * 2019-01-15 2024-02-23 深圳市易天自动化设备股份有限公司 一种oled膜片自动撕膜装置及其撕膜工艺
JP7415395B2 (ja) * 2019-09-25 2024-01-17 オムロン株式会社 保護シート剥離装置および保護シート剥離方法
CN111142182B (zh) * 2020-01-08 2021-09-17 上海向隆电子科技有限公司 具保护膜的导光板的加工方法、加工设备及其导光板
DE102022134515A1 (de) * 2022-12-22 2024-06-27 Advanced Engineering Industrie Automation GmbH Vorrichtung und Verfahren zum Abziehen von Schutzfolien von plattenförmigen Gegenständen

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855823A (ja) 1994-08-12 1996-02-27 Toshiba Corp 半導体素子の製造方法
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP3809733B2 (ja) * 1998-02-25 2006-08-16 セイコーエプソン株式会社 薄膜トランジスタの剥離方法
JP3515917B2 (ja) 1998-12-01 2004-04-05 シャープ株式会社 半導体装置の製造方法
JP2000331963A (ja) 1999-05-21 2000-11-30 Tokyo Seimitsu Co Ltd ウェーハフレームへのウェーハ取付方法と装置及びそれを組込んだ平面加工装置
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP4028195B2 (ja) 2001-08-31 2007-12-26 Ｔｄｋ株式会社 剥離フィルムの製造方法
JP4919139B2 (ja) 2001-09-27 2012-04-18 Ｔｄｋ株式会社 セラミックコンデンサを製造するための剥離フィルムの製造方法
JP3976541B2 (ja) * 2001-10-23 2007-09-19 富士通株式会社 半導体チップの剥離方法及び装置
JP2004047823A (ja) 2002-07-12 2004-02-12 Tokyo Seimitsu Co Ltd ダイシングテープ貼付装置およびバックグラインド・ダイシングテープ貼付システム
JP4318471B2 (ja) 2003-03-05 2009-08-26 日東電工株式会社 保護テープの貼付・剥離方法
JP2004311576A (ja) * 2003-04-03 2004-11-04 Toshiba Corp 半導体装置の製造方法
JP4519413B2 (ja) 2003-04-09 2010-08-04 リンテック株式会社 テープの貼付方法および貼付装置
JP2005045023A (ja) * 2003-07-22 2005-02-17 Toshiba Corp 半導体装置の製造方法および半導体製造装置
JP2006100413A (ja) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd フィルム貼付方法およびフィルム貼付装置
JP4565977B2 (ja) * 2004-11-25 2010-10-20 株式会社東京精密 フィルム剥離方法およびフィルム剥離装置
JP4442410B2 (ja) * 2004-12-15 2010-03-31 セイコーエプソン株式会社 異常診断システム
US8137417B2 (en) * 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device

Also Published As

Publication number Publication date
KR100983910B1 (ko) 2010-09-28
EP1947688A1 (en) 2008-07-23
US20090107634A1 (en) 2009-04-30
US8052824B2 (en) 2011-11-08
EP1947688A4 (en) 2010-10-27
TW200719394A (en) 2007-05-16
WO2007052387A1 (ja) 2007-05-10
KR20080066759A (ko) 2008-07-16

Similar Documents

Publication Publication Date Title
TWI309848B (https=)
TWI269379B (en) Back-grinding/dicing tape applying system
CN105428220B (zh) 太鼓减薄工艺的环切工艺方法
JP6713212B2 (ja) 半導体デバイスチップの製造方法
JP4817805B2 (ja) フィルム剥離方法およびフィルム剥離装置
TWI459452B (zh) A method of breaking the film attached to the back of the wafer, and a subsequent film
JP2003209080A (ja) 半導体ウェーハ保護部材及び半導体ウェーハの研削方法
JP2020181890A (ja) ウエーハの加工方法
JP2007096229A (ja) ウエーハの加工方法
JP4324788B2 (ja) ウェーハマウンタ
JP4565977B2 (ja) フィルム剥離方法およびフィルム剥離装置
KR20170085949A (ko) 웨이퍼의 가공 방법
JP2005260154A (ja) チップ製造方法
JP2008166459A (ja) 保護テープ貼付方法と装置
JP7663454B2 (ja) シート貼着装置
JP2017199780A (ja) ウエーハの加工方法
CN111564367A (zh) 一种晶圆研磨前裂片异常的处理方法
KR20210142584A (ko) 반도체 장치의 제조 방법 및 적층체
TW201126586A (en) Wafer processing method
CN117637459A (zh) 一种晶圆混合切割方法
JP7719633B2 (ja) ウェーハの加工方法
JP2004335909A (ja) 板状部材の分割方法及び分割装置
JP2004025402A (ja) 半導体ウェハの保護テープの切断方法および切断装置
JP7534192B2 (ja) 加工方法
JP7684050B2 (ja) ウエーハの加工方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees