KR100944058B1 - 반도체 기억 장치 - Google Patents
반도체 기억 장치 Download PDFInfo
- Publication number
- KR100944058B1 KR100944058B1 KR1020080067061A KR20080067061A KR100944058B1 KR 100944058 B1 KR100944058 B1 KR 100944058B1 KR 1020080067061 A KR1020080067061 A KR 1020080067061A KR 20080067061 A KR20080067061 A KR 20080067061A KR 100944058 B1 KR100944058 B1 KR 100944058B1
- Authority
- KR
- South Korea
- Prior art keywords
- memory cell
- circuit
- line driver
- bit line
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0064—Verifying circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0011—RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3436—Arrangements for verifying correct programming or erasure
- G11C16/3468—Prevention of overerasure or overprogramming, e.g. by verifying whilst erasing or writing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0064—Verifying circuits or methods
- G11C2013/0066—Verify correct writing whilst writing is in progress, e.g. by detecting onset or cessation of current flow in cell and using the detector output to terminate writing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
- G11C2013/009—Write using potential difference applied between cell electrodes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/52—Structure characterized by the electrode material, shape, etc.
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
Landscapes
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007188328A JP2009026382A (ja) | 2007-07-19 | 2007-07-19 | 半導体記憶装置 |
| JPJP-P-2007-00188328 | 2007-07-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090009111A KR20090009111A (ko) | 2009-01-22 |
| KR100944058B1 true KR100944058B1 (ko) | 2010-02-24 |
Family
ID=40398066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080067061A Expired - Fee Related KR100944058B1 (ko) | 2007-07-19 | 2008-07-10 | 반도체 기억 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7835171B2 (enExample) |
| JP (1) | JP2009026382A (enExample) |
| KR (1) | KR100944058B1 (enExample) |
| TW (1) | TW200917246A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10482959B2 (en) | 2016-10-28 | 2019-11-19 | SK Hynix Inc. | Electronic device with a reference resistance adjustment block |
| US10566045B2 (en) | 2016-10-24 | 2020-02-18 | SK Hynix Inc. | Electronic device includes resistive storage cells and reference resistance transistor, a resistance adjustment block to adjust the resistance value depending on a temperature and a data sensing block to sense the resistive value of the resistive storage cell and the reference transistor resistance value |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009026382A (ja) * | 2007-07-19 | 2009-02-05 | Hitachi Ltd | 半導体記憶装置 |
| US8189365B2 (en) * | 2007-11-21 | 2012-05-29 | Nec Corporation | Semiconductor device configuration method |
| JP5161697B2 (ja) * | 2008-08-08 | 2013-03-13 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| CN102171764B (zh) * | 2008-10-06 | 2014-08-27 | 株式会社日立制作所 | 半导体器件 |
| IT1392578B1 (it) * | 2008-12-30 | 2012-03-09 | St Microelectronics Rousset | Metodo di programmazione multilivello di celle di memoria a cambiamento di fase utilizzante impulsi di reset adattativi |
| US8270199B2 (en) * | 2009-04-03 | 2012-09-18 | Sandisk 3D Llc | Cross point non-volatile memory cell |
| WO2010125852A1 (ja) * | 2009-04-27 | 2010-11-04 | 株式会社日立製作所 | 半導体装置 |
| JP4705204B1 (ja) | 2009-10-15 | 2011-06-22 | パナソニック株式会社 | 抵抗変化型不揮発性記憶装置 |
| US8878153B2 (en) * | 2009-12-08 | 2014-11-04 | Nec Corporation | Variable resistance element having gradient of diffusion coefficient of ion conducting layer |
| JP2011253595A (ja) * | 2010-06-03 | 2011-12-15 | Toshiba Corp | 不揮発性半導体記憶装置 |
| JP2011258288A (ja) * | 2010-06-10 | 2011-12-22 | Toshiba Corp | 半導体記憶装置 |
| US8274812B2 (en) * | 2010-06-14 | 2012-09-25 | Crossbar, Inc. | Write and erase scheme for resistive memory device |
| JP5521850B2 (ja) * | 2010-07-21 | 2014-06-18 | ソニー株式会社 | 抵抗変化型メモリデバイスおよびその駆動方法 |
| US8259485B2 (en) * | 2010-08-31 | 2012-09-04 | Hewlett-Packard Development Company, L.P. | Multilayer structures having memory elements with varied resistance of switching layers |
| JP5626529B2 (ja) * | 2011-02-08 | 2014-11-19 | ソニー株式会社 | 記憶装置およびその動作方法 |
| JP5490961B2 (ja) * | 2011-03-14 | 2014-05-14 | パナソニック株式会社 | 不揮発性記憶素子の駆動方法及び不揮発性記憶装置 |
| JP5694053B2 (ja) * | 2011-05-26 | 2015-04-01 | 株式会社東芝 | 半導体記憶装置 |
| US8619471B2 (en) | 2011-07-27 | 2013-12-31 | Micron Technology, Inc. | Apparatuses and methods including memory array data line selection |
| CN103177761A (zh) * | 2011-12-23 | 2013-06-26 | 北京大学 | 阻变存储设备及其操作方法 |
| US9275731B1 (en) * | 2012-10-05 | 2016-03-01 | Marvell International Ltd. | Systems and methods for increasing the read sensitivity of a resistive random access memory (RRAM) |
| US9042159B2 (en) | 2012-10-15 | 2015-05-26 | Marvell World Trade Ltd. | Configuring resistive random access memory (RRAM) array for write operations |
| US9047945B2 (en) | 2012-10-15 | 2015-06-02 | Marvell World Trade Ltd. | Systems and methods for reading resistive random access memory (RRAM) cells |
| US8885388B2 (en) | 2012-10-24 | 2014-11-11 | Marvell World Trade Ltd. | Apparatus and method for reforming resistive memory cells |
| US9042162B2 (en) | 2012-10-31 | 2015-05-26 | Marvell World Trade Ltd. | SRAM cells suitable for Fin field-effect transistor (FinFET) process |
| WO2014074362A1 (en) | 2012-11-12 | 2014-05-15 | Marvell World Trade Ltd. | Concurrent use of sram cells with both nmos and pmos pass gates in a memory system |
| AT514477B1 (de) * | 2013-07-05 | 2015-03-15 | Nano Tecct Weiz Forschungsgmbh | Speicher-Sensoranordnung mit einem Sensorelement und einem Speicher |
| KR102284643B1 (ko) * | 2014-03-24 | 2021-07-30 | 고쿠리츠 다이가쿠 호진 도호쿠 다이가쿠 | 저항 변화형 기억 소자의 데이터 기록 장치 |
| JP6372203B2 (ja) | 2014-07-07 | 2018-08-15 | 株式会社ソシオネクスト | データ保持回路および保持データ復元方法 |
| WO2016157719A1 (ja) * | 2015-03-27 | 2016-10-06 | パナソニックIpマネジメント株式会社 | 半導体記憶装置の書き換え方法及び半導体記憶装置 |
| KR102401581B1 (ko) * | 2015-10-26 | 2022-05-24 | 삼성전자주식회사 | 저항식 메모리 소자 |
| CN112292727B (zh) * | 2018-06-27 | 2024-05-24 | 北京时代全芯存储技术股份有限公司 | 记忆体驱动装置 |
| JP2020205003A (ja) * | 2019-06-19 | 2020-12-24 | キオクシア株式会社 | メモリシステム、メモリコントローラ、及び半導体記憶装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000076873A (ja) | 1998-08-26 | 2000-03-14 | Oki Micro Design:Kk | メモリセルのしきい値電圧制御方法及び半導体記憶装置 |
| JP2002329397A (ja) | 2001-04-27 | 2002-11-15 | Semiconductor Energy Lab Co Ltd | 不揮発性メモリとそのベリファイ方法、及び半導体装置 |
| JP2004234707A (ja) | 2002-12-04 | 2004-08-19 | Sharp Corp | 半導体記憶装置及びメモリセルの書き込み並びに消去方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7184301B2 (en) * | 2002-11-27 | 2007-02-27 | Nec Corporation | Magnetic memory cell and magnetic random access memory using the same |
| JP4804133B2 (ja) * | 2005-12-06 | 2011-11-02 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
| JP2009026382A (ja) * | 2007-07-19 | 2009-02-05 | Hitachi Ltd | 半導体記憶装置 |
-
2007
- 2007-07-19 JP JP2007188328A patent/JP2009026382A/ja not_active Withdrawn
-
2008
- 2008-06-25 TW TW097123709A patent/TW200917246A/zh unknown
- 2008-07-10 KR KR1020080067061A patent/KR100944058B1/ko not_active Expired - Fee Related
- 2008-07-11 US US12/172,198 patent/US7835171B2/en not_active Expired - Fee Related
-
2010
- 2010-10-30 US US12/916,499 patent/US20110044092A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000076873A (ja) | 1998-08-26 | 2000-03-14 | Oki Micro Design:Kk | メモリセルのしきい値電圧制御方法及び半導体記憶装置 |
| JP2002329397A (ja) | 2001-04-27 | 2002-11-15 | Semiconductor Energy Lab Co Ltd | 不揮発性メモリとそのベリファイ方法、及び半導体装置 |
| JP2004234707A (ja) | 2002-12-04 | 2004-08-19 | Sharp Corp | 半導体記憶装置及びメモリセルの書き込み並びに消去方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10566045B2 (en) | 2016-10-24 | 2020-02-18 | SK Hynix Inc. | Electronic device includes resistive storage cells and reference resistance transistor, a resistance adjustment block to adjust the resistance value depending on a temperature and a data sensing block to sense the resistive value of the resistive storage cell and the reference transistor resistance value |
| US10482959B2 (en) | 2016-10-28 | 2019-11-19 | SK Hynix Inc. | Electronic device with a reference resistance adjustment block |
| US11211121B2 (en) | 2016-10-28 | 2021-12-28 | SK Hynix Inc. | Resistive storage electronic device for adjusting voltage depending on temeperature |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110044092A1 (en) | 2011-02-24 |
| TW200917246A (en) | 2009-04-16 |
| US20090262568A1 (en) | 2009-10-22 |
| US7835171B2 (en) | 2010-11-16 |
| JP2009026382A (ja) | 2009-02-05 |
| KR20090009111A (ko) | 2009-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100944058B1 (ko) | 반도체 기억 장치 | |
| JP5222619B2 (ja) | 半導体装置 | |
| JP4445398B2 (ja) | 相変化メモリ装置 | |
| KR101115756B1 (ko) | 고집적 프로그램이 가능한 비휘발성 메모리 및 그 제조 방법 | |
| KR101144440B1 (ko) | 비휘발성 메모리 및 그 제조방법 | |
| US8125817B2 (en) | Nonvolatile storage device and method for writing into the same | |
| JP5043357B2 (ja) | プログラム可能メモリセル | |
| JP5359804B2 (ja) | 不揮発性半導体メモリデバイス | |
| KR101088954B1 (ko) | 프로그램이 가능한 비휘발성 메모리 | |
| JP6810725B2 (ja) | 抵抗変化型ランダムアクセスメモリ | |
| EP1755165A1 (en) | Semiconductor device | |
| EP1965391A1 (en) | Non-volatile semiconductor memory device | |
| CN108431979A (zh) | 空位调制导电氧化物区域切换单元到vbl架构的实现方式 | |
| KR101144443B1 (ko) | 다층 메모리 셀들을 포함하는 비휘발성 메모리 및 그 제조방법 | |
| JPWO2008068867A1 (ja) | 半導体記憶装置 | |
| CN102347064A (zh) | 可变电阻存储器件 | |
| KR20100113768A (ko) | 불휘발성 소자의 독출 동작 방법 | |
| JP7181419B2 (ja) | 不揮発性メモリデバイスおよび制御方法 | |
| CN101123120A (zh) | 一种采用电阻存储介质的一次编程存储器及其操作方法 | |
| US10192616B2 (en) | Ovonic threshold switch (OTS) driver/selector uses unselect bias to pre-charge memory chip circuit and reduces unacceptable false selects | |
| TW202219958A (zh) | 記憶體電路及其操作方法 | |
| KR100723569B1 (ko) | 상 변화 메모리 장치 | |
| JP2013140667A (ja) | 半導体装置 | |
| KR100449953B1 (ko) | 강유전체 메모리 장치의 셀어레이 | |
| JP4668668B2 (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20130118 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20140120 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20150218 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20150218 |