KR100884438B1 - 프린트배선판의 제조에 사용되는 감광성 수지조성물 - Google Patents

프린트배선판의 제조에 사용되는 감광성 수지조성물 Download PDF

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Publication number
KR100884438B1
KR100884438B1 KR1020087009994A KR20087009994A KR100884438B1 KR 100884438 B1 KR100884438 B1 KR 100884438B1 KR 1020087009994 A KR1020087009994 A KR 1020087009994A KR 20087009994 A KR20087009994 A KR 20087009994A KR 100884438 B1 KR100884438 B1 KR 100884438B1
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South Korea
Prior art keywords
resin composition
photosensitive resin
meth
plating
layer
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Expired - Lifetime
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KR1020087009994A
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English (en)
Korean (ko)
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KR20080052681A (ko
Inventor
토시히코 아카호리
켄 사와베
미치코 나토리
토모아키 아오키
타쿠야 카지와라
Original Assignee
히다치 가세고교 가부시끼가이샤
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Publication of KR20080052681A publication Critical patent/KR20080052681A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020087009994A 2001-03-29 2002-03-29 프린트배선판의 제조에 사용되는 감광성 수지조성물 Expired - Lifetime KR100884438B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001096367 2001-03-29
JPJP-P-2001-00096367 2001-03-29

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020037012448A Division KR100866180B1 (ko) 2001-03-29 2002-03-29 프린트배선판의 제조방법 및 그것에 사용되는 감광성수지조성물

Publications (2)

Publication Number Publication Date
KR20080052681A KR20080052681A (ko) 2008-06-11
KR100884438B1 true KR100884438B1 (ko) 2009-02-19

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020087009994A Expired - Lifetime KR100884438B1 (ko) 2001-03-29 2002-03-29 프린트배선판의 제조에 사용되는 감광성 수지조성물
KR1020037012448A Expired - Lifetime KR100866180B1 (ko) 2001-03-29 2002-03-29 프린트배선판의 제조방법 및 그것에 사용되는 감광성수지조성물

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KR1020037012448A Expired - Lifetime KR100866180B1 (ko) 2001-03-29 2002-03-29 프린트배선판의 제조방법 및 그것에 사용되는 감광성수지조성물

Country Status (6)

Country Link
US (1) US7338751B2 (https=)
JP (1) JP4200761B2 (https=)
KR (2) KR100884438B1 (https=)
CN (2) CN1282037C (https=)
TW (1) TWI296738B (https=)
WO (1) WO2002079877A1 (https=)

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GB2417127A (en) * 2004-08-12 2006-02-15 Vetco Gray Controls Ltd Surface metallization of contact pads
JP4815771B2 (ja) * 2004-09-01 2011-11-16 住友電気工業株式会社 電気部品の製造方法
JP4804001B2 (ja) * 2004-12-28 2011-10-26 イビデン株式会社 プリント配線板の製造方法
KR100934046B1 (ko) * 2005-05-23 2009-12-24 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP2007012735A (ja) * 2005-06-29 2007-01-18 Cmk Corp プリント配線板の表面処理方法
JP4747770B2 (ja) * 2005-10-04 2011-08-17 日立化成工業株式会社 プリント配線板の製造方法、及び半導体チップ搭載基板の製造方法
JP4730071B2 (ja) * 2005-11-29 2011-07-20 凸版印刷株式会社 回路基板の製造方法
JP4919921B2 (ja) * 2007-10-02 2012-04-18 東洋アルミニウム株式会社 Ｉｃカード・タグ用アンテナ回路構成体とその製造方法
MY152017A (en) * 2008-06-18 2014-08-15 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board
JP2010217903A (ja) * 2010-04-19 2010-09-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びプリント配線板の製造方法
JP5697461B2 (ja) 2011-01-17 2015-04-08 ユニチカ株式会社 ポリエステルフィルム、および感光性樹脂構造体
CN102413629A (zh) * 2011-07-27 2012-04-11 大唐移动通信设备有限公司 一种印制电路板及其制造方法
KR102025036B1 (ko) * 2011-12-05 2019-09-24 히타치가세이가부시끼가이샤 터치패널용 전극의 보호막의 형성 방법, 감광성 수지 조성물 및 감광성 엘리먼트, 및, 터치패널의 제조 방법
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
JP5787239B2 (ja) * 2012-06-29 2015-09-30 荒川化学工業株式会社 印刷レジスト用活性エネルギー線硬化性樹脂組成物、これを用いたレジストパターンの形成方法、印刷レジスト積層体およびプリント配線基板
KR20140018016A (ko) * 2012-08-03 2014-02-12 삼성전기주식회사 인쇄회로기판의 제조방법
CN104883808B (zh) * 2015-05-05 2017-12-01 华为技术有限公司 一种印刷电路板及印刷电路板的制造方法
WO2017057584A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 静電容量型入力装置の電極保護膜用の組成物、静電容量型入力装置の電極保護膜、転写フィルム、積層体、静電容量型入力装置および画像表示装置。
JP6421161B2 (ja) * 2015-11-27 2018-11-07 株式会社タムラ製作所 感光性樹脂組成物
CN108490737B (zh) * 2018-03-14 2021-11-02 杭州福斯特电子材料有限公司 一种感光性树脂组合物及其用途
CN114127205B (zh) * 2019-06-26 2022-10-25 三菱瓦斯化学株式会社 树脂片、覆金属箔层叠板和印刷电路板
CN116745697A (zh) * 2021-01-29 2023-09-12 富士胶片株式会社 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法

Citations (4)

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JPH06282069A (ja) * 1993-03-25 1994-10-07 Asahi Chem Ind Co Ltd 厚膜回路用感光性樹脂組成物
JPH09265188A (ja) * 1996-03-28 1997-10-07 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH1051107A (ja) * 1996-08-07 1998-02-20 Ibiden Co Ltd プリント配線板の製造方法、感光性組成物、ドライフィルムフォトレジスト
JP2000275831A (ja) * 1999-01-21 2000-10-06 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法

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EP0131824B1 (en) * 1983-07-01 1990-05-09 Fuji Photo Film Co., Ltd. Photopolymerizable composition
US6703181B1 (en) * 1993-03-12 2004-03-09 Kabushiki Kaisha Toshiba Photosensitive composition having uniform concentration distribution of components and pattern formation method using the same
JP3115449B2 (ja) * 1993-05-07 2000-12-04 イビデン株式会社 配線板用めっきレジスト組成物およびプリント配線板
DE69614050T2 (de) * 1995-02-14 2002-03-21 Toray Industries, Inc. Flachdruckplatte
KR0150344B1 (ko) * 1995-12-21 1998-10-01 이웅열 감광성 수지 조성물
JP3055499B2 (ja) 1996-07-30 2000-06-26 日立化成工業株式会社 積層フィルム及びプリント配線板の製造法
EP0916480A4 (en) * 1996-07-30 2001-10-10 Hitachi Chemical Co Ltd PRODUCTION OF A ASSOCIATION FILM AND PCB
US5922509A (en) 1998-03-18 1999-07-13 Morton International, Inc. Photoimageable compositions having improved stripping properties in aqueous alkaline solutions
JPH11284336A (ja) * 1998-03-31 1999-10-15 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06282069A (ja) * 1993-03-25 1994-10-07 Asahi Chem Ind Co Ltd 厚膜回路用感光性樹脂組成物
JPH09265188A (ja) * 1996-03-28 1997-10-07 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH1051107A (ja) * 1996-08-07 1998-02-20 Ibiden Co Ltd プリント配線板の製造方法、感光性組成物、ドライフィルムフォトレジスト
JP2000275831A (ja) * 1999-01-21 2000-10-06 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法

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Publication number Publication date
CN1828411B (zh) 2010-11-24
JP4200761B2 (ja) 2008-12-24
US7338751B2 (en) 2008-03-04
WO2002079877A1 (en) 2002-10-10
CN1282037C (zh) 2006-10-25
CN1828411A (zh) 2006-09-06
JPWO2002079877A1 (ja) 2004-07-22
KR20080052681A (ko) 2008-06-11
KR20040030544A (ko) 2004-04-09
TWI296738B (https=) 2008-05-11
US20040086801A1 (en) 2004-05-06
CN1500232A (zh) 2004-05-26
KR100866180B1 (ko) 2008-10-30

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