CN1282037C - 印刷电路板的制造法及用于其中的感光性树脂组合物 - Google Patents

印刷电路板的制造法及用于其中的感光性树脂组合物 Download PDF

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Publication number
CN1282037C
CN1282037C CNB028076621A CN02807662A CN1282037C CN 1282037 C CN1282037 C CN 1282037C CN B028076621 A CNB028076621 A CN B028076621A CN 02807662 A CN02807662 A CN 02807662A CN 1282037 C CN1282037 C CN 1282037C
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CN
China
Prior art keywords
resin composition
photosensitive resin
photosensitive polymer
polymer combination
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB028076621A
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English (en)
Chinese (zh)
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CN1500232A (zh
Inventor
赤堀聪彦
沢边贤
名取美智子
青木知明
梶原卓哉
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN1500232A publication Critical patent/CN1500232A/zh
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Publication of CN1282037C publication Critical patent/CN1282037C/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CNB028076621A 2001-03-29 2002-03-29 印刷电路板的制造法及用于其中的感光性树脂组合物 Expired - Lifetime CN1282037C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001096367 2001-03-29
JP96367/2001 2001-03-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2005101286613A Division CN1828411B (zh) 2001-03-29 2002-03-29 感光性树脂组合物

Publications (2)

Publication Number Publication Date
CN1500232A CN1500232A (zh) 2004-05-26
CN1282037C true CN1282037C (zh) 2006-10-25

Family

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Family Applications (2)

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CNB028076621A Expired - Lifetime CN1282037C (zh) 2001-03-29 2002-03-29 印刷电路板的制造法及用于其中的感光性树脂组合物
CN2005101286613A Expired - Lifetime CN1828411B (zh) 2001-03-29 2002-03-29 感光性树脂组合物

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CN2005101286613A Expired - Lifetime CN1828411B (zh) 2001-03-29 2002-03-29 感光性树脂组合物

Country Status (6)

Country Link
US (1) US7338751B2 (https=)
JP (1) JP4200761B2 (https=)
KR (2) KR100884438B1 (https=)
CN (2) CN1282037C (https=)
TW (1) TWI296738B (https=)
WO (1) WO2002079877A1 (https=)

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GB2417127A (en) * 2004-08-12 2006-02-15 Vetco Gray Controls Ltd Surface metallization of contact pads
JP4815771B2 (ja) * 2004-09-01 2011-11-16 住友電気工業株式会社 電気部品の製造方法
JP4804001B2 (ja) * 2004-12-28 2011-10-26 イビデン株式会社 プリント配線板の製造方法
KR100934046B1 (ko) * 2005-05-23 2009-12-24 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP2007012735A (ja) * 2005-06-29 2007-01-18 Cmk Corp プリント配線板の表面処理方法
JP4747770B2 (ja) * 2005-10-04 2011-08-17 日立化成工業株式会社 プリント配線板の製造方法、及び半導体チップ搭載基板の製造方法
JP4730071B2 (ja) * 2005-11-29 2011-07-20 凸版印刷株式会社 回路基板の製造方法
JP4919921B2 (ja) * 2007-10-02 2012-04-18 東洋アルミニウム株式会社 Ｉｃカード・タグ用アンテナ回路構成体とその製造方法
MY152017A (en) * 2008-06-18 2014-08-15 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board
JP2010217903A (ja) * 2010-04-19 2010-09-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びプリント配線板の製造方法
JP5697461B2 (ja) 2011-01-17 2015-04-08 ユニチカ株式会社 ポリエステルフィルム、および感光性樹脂構造体
CN102413629A (zh) * 2011-07-27 2012-04-11 大唐移动通信设备有限公司 一种印制电路板及其制造方法
KR102025036B1 (ko) * 2011-12-05 2019-09-24 히타치가세이가부시끼가이샤 터치패널용 전극의 보호막의 형성 방법, 감광성 수지 조성물 및 감광성 엘리먼트, 및, 터치패널의 제조 방법
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
JP5787239B2 (ja) * 2012-06-29 2015-09-30 荒川化学工業株式会社 印刷レジスト用活性エネルギー線硬化性樹脂組成物、これを用いたレジストパターンの形成方法、印刷レジスト積層体およびプリント配線基板
KR20140018016A (ko) * 2012-08-03 2014-02-12 삼성전기주식회사 인쇄회로기판의 제조방법
CN104883808B (zh) * 2015-05-05 2017-12-01 华为技术有限公司 一种印刷电路板及印刷电路板的制造方法
WO2017057584A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 静電容量型入力装置の電極保護膜用の組成物、静電容量型入力装置の電極保護膜、転写フィルム、積層体、静電容量型入力装置および画像表示装置。
JP6421161B2 (ja) * 2015-11-27 2018-11-07 株式会社タムラ製作所 感光性樹脂組成物
CN108490737B (zh) * 2018-03-14 2021-11-02 杭州福斯特电子材料有限公司 一种感光性树脂组合物及其用途
CN114127205B (zh) * 2019-06-26 2022-10-25 三菱瓦斯化学株式会社 树脂片、覆金属箔层叠板和印刷电路板
CN116745697A (zh) * 2021-01-29 2023-09-12 富士胶片株式会社 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法

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JP3115449B2 (ja) * 1993-05-07 2000-12-04 イビデン株式会社 配線板用めっきレジスト組成物およびプリント配線板
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JPH09265188A (ja) * 1996-03-28 1997-10-07 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP3055499B2 (ja) 1996-07-30 2000-06-26 日立化成工業株式会社 積層フィルム及びプリント配線板の製造法
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JPH1051107A (ja) * 1996-08-07 1998-02-20 Ibiden Co Ltd プリント配線板の製造方法、感光性組成物、ドライフィルムフォトレジスト
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JPH11284336A (ja) * 1998-03-31 1999-10-15 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
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Also Published As

Publication number Publication date
CN1828411B (zh) 2010-11-24
JP4200761B2 (ja) 2008-12-24
US7338751B2 (en) 2008-03-04
WO2002079877A1 (en) 2002-10-10
CN1828411A (zh) 2006-09-06
KR100884438B1 (ko) 2009-02-19
JPWO2002079877A1 (ja) 2004-07-22
KR20080052681A (ko) 2008-06-11
KR20040030544A (ko) 2004-04-09
TWI296738B (https=) 2008-05-11
US20040086801A1 (en) 2004-05-06
CN1500232A (zh) 2004-05-26
KR100866180B1 (ko) 2008-10-30

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