KR100845349B1 - 복수종의 테스터에 대응 가능한 프로브 장치 - Google Patents

복수종의 테스터에 대응 가능한 프로브 장치 Download PDF

Info

Publication number
KR100845349B1
KR100845349B1 KR1020067019266A KR20067019266A KR100845349B1 KR 100845349 B1 KR100845349 B1 KR 100845349B1 KR 1020067019266 A KR1020067019266 A KR 1020067019266A KR 20067019266 A KR20067019266 A KR 20067019266A KR 100845349 B1 KR100845349 B1 KR 100845349B1
Authority
KR
South Korea
Prior art keywords
ring
card holder
probe
card
conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020067019266A
Other languages
English (en)
Korean (ko)
Other versions
KR20060130660A (ko
Inventor
마사유키 노구치
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20060130660A publication Critical patent/KR20060130660A/ko
Application granted granted Critical
Publication of KR100845349B1 publication Critical patent/KR100845349B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020067019266A 2004-03-19 2005-03-16 복수종의 테스터에 대응 가능한 프로브 장치 Expired - Lifetime KR100845349B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004079510A JP2005265658A (ja) 2004-03-19 2004-03-19 複数種のテスタに対応可能なプローブ装置
JPJP-P-2004-00079510 2004-03-19

Publications (2)

Publication Number Publication Date
KR20060130660A KR20060130660A (ko) 2006-12-19
KR100845349B1 true KR100845349B1 (ko) 2008-07-09

Family

ID=34993841

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067019266A Expired - Lifetime KR100845349B1 (ko) 2004-03-19 2005-03-16 복수종의 테스터에 대응 가능한 프로브 장치

Country Status (7)

Country Link
US (1) US7323893B2 (enExample)
EP (1) EP1736787A4 (enExample)
JP (1) JP2005265658A (enExample)
KR (1) KR100845349B1 (enExample)
CN (1) CN100545666C (enExample)
TW (1) TW200533923A (enExample)
WO (1) WO2005091006A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408500B1 (en) * 2000-09-15 2002-06-25 James Orsillo Method of retrofitting a probe station
US7652491B2 (en) * 2006-11-17 2010-01-26 Suss Microtec Test Systems Gmbh Probe support with shield for the examination of test substrates under use of probe supports
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices
JP4514236B2 (ja) * 2008-02-25 2010-07-28 株式会社協同 プローブカード移載装置
KR101101535B1 (ko) * 2008-03-14 2012-01-02 송원호 프로브블록
US20110204913A1 (en) * 2008-09-26 2011-08-25 Satoshi Takeshita Test section unit and test head
CN101738575B (zh) * 2008-11-11 2013-08-21 京元电子股份有限公司 可换用不同探针卡的ic测试机台
JPWO2011013231A1 (ja) * 2009-07-30 2013-01-07 株式会社アドバンテスト プローブカード保持装置及びプローバ
JP2011064659A (ja) * 2009-09-21 2011-03-31 Tokyo Electron Ltd プローブカードのクランプ機構及び検査装置
JP2011089891A (ja) * 2009-10-22 2011-05-06 Micronics Japan Co Ltd 電気的接続装置及びこれを用いる試験装置
TWI415204B (zh) * 2010-04-28 2013-11-11 Wen Chyimr Chen 測試板
KR101101559B1 (ko) * 2010-10-06 2012-01-02 송원호 프로브블록의 실리콘전극기판 제조방법
JP5788767B2 (ja) * 2011-11-07 2015-10-07 株式会社日本マイクロニクス プローブブロックとそれを備えるプローブカード並びにプローブ装置
CN103207290A (zh) * 2012-01-12 2013-07-17 瑞统企业股份有限公司 改良的电路板的测试治具结构
JP2013246153A (ja) * 2012-05-29 2013-12-09 Micronics Japan Co Ltd プローブカード
CN105453244B (zh) * 2013-05-14 2018-04-06 佛姆法克特股份有限公司 可互换探针头的自动附接和拆卸
KR101754175B1 (ko) * 2014-12-27 2017-07-05 싱크-테크 시스템 코포레이션 업그레이드 기능을 구비한 테스트 기기
TWI583963B (zh) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 探針卡
KR102566685B1 (ko) * 2016-07-18 2023-08-14 삼성전자주식회사 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드
TWI620937B (zh) * 2017-04-17 2018-04-11 中華精測科技股份有限公司 微米細針吸取裝置及其使用方法
US11379004B2 (en) * 2018-08-08 2022-07-05 Hewlett-Packard Development Company, L.P. Adjustment control mechanisms of pogo pins
JP7138004B2 (ja) * 2018-09-28 2022-09-15 株式会社日本マイクロニクス プローブカード保持具
KR102689406B1 (ko) * 2018-11-16 2024-07-29 주식회사 기가레인 프로브카드용 공간변환부
TWM580255U (zh) 2019-01-25 2019-07-01 和碩聯合科技股份有限公司 旋鈕裝置
CN116774012B (zh) * 2023-08-15 2023-10-20 深圳市微特精密科技股份有限公司 一种ict测试夹具及测试装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299243A (ja) * 1987-05-29 1988-12-06 Tokyo Electron Ltd プロ−ブカ−ドアダプタ
JP2000349128A (ja) * 1999-06-04 2000-12-15 Tokyo Seimitsu Co Ltd プローバ装置のプローバ側とテスタ側との接続方法及びその構造

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719817B2 (ja) * 1987-05-01 1995-03-06 東京エレクトロン株式会社 プロ−ブカ−ド自動交換方法
JPH0543244Y2 (enExample) 1987-09-30 1993-10-29
US5068601A (en) * 1991-02-11 1991-11-26 Credence Systems Corporation Dual function cam-ring system for DUT board parallel electrical inter-connection and prober/handler docking
TW273635B (enExample) * 1994-09-01 1996-04-01 Aesop
US6118290A (en) * 1997-06-07 2000-09-12 Tokyo Electron Limited Prober and method for cleaning probes provided therein
US6114869A (en) * 1998-05-21 2000-09-05 Cerprobe Corporation Method and apparatus for interfacing between automatic wafer probe machines, automatic testers, and probe cards
US6166553A (en) * 1998-06-29 2000-12-26 Xandex, Inc. Prober-tester electrical interface for semiconductor test
JP2000150596A (ja) * 1998-11-10 2000-05-30 Tokyo Seimitsu Co Ltd プローバ
US6340895B1 (en) * 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
US6408500B1 (en) * 2000-09-15 2002-06-25 James Orsillo Method of retrofitting a probe station
JP4134289B2 (ja) * 2002-05-29 2008-08-20 東京エレクトロン株式会社 プローブカード搬送装置及びアダプタ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299243A (ja) * 1987-05-29 1988-12-06 Tokyo Electron Ltd プロ−ブカ−ドアダプタ
JP2000349128A (ja) * 1999-06-04 2000-12-15 Tokyo Seimitsu Co Ltd プローバ装置のプローバ側とテスタ側との接続方法及びその構造

Also Published As

Publication number Publication date
US7323893B2 (en) 2008-01-29
TW200533923A (en) 2005-10-16
WO2005091006A1 (ja) 2005-09-29
TWI354794B (enExample) 2011-12-21
CN1906496A (zh) 2007-01-31
US20070007979A1 (en) 2007-01-11
EP1736787A1 (en) 2006-12-27
JP2005265658A (ja) 2005-09-29
CN100545666C (zh) 2009-09-30
EP1736787A4 (en) 2014-04-02
KR20060130660A (ko) 2006-12-19

Similar Documents

Publication Publication Date Title
KR100845349B1 (ko) 복수종의 테스터에 대응 가능한 프로브 장치
KR100343252B1 (ko) 검사장치및검사장치에있어서의접속방법
JP4842640B2 (ja) プローブカードおよび検査方法
EP2051293A1 (en) Parallelism adjusting mechanism of probe card
JP2001124833A (ja) ピンブロック・ストラクチャ
JP2009541715A (ja) プローブ・カード基板上のタイル角部のソーイング
KR101181639B1 (ko) 프로브 카드를 평탄화하는 장치 및 상기 장치를 사용하는방법
JP2011141227A (ja) 半導体試験装置
US7449902B2 (en) Probe system
JPH0735777A (ja) 検査装置および検査装置における接続方法
JP3531644B2 (ja) 半導体ソケットおよび該ソケットのプローブ交換方法
US6741072B2 (en) Docking system for connecting a tester to a probe station using an A-type docking configuration
EP1411363A2 (en) Prober
JPH0864646A (ja) プローブ・カード
KR200268667Y1 (ko) 포고핀
JP2007198971A (ja) プローブカード固定装置及びそれを備えた電子部品試験装置
JP2007003433A (ja) 試験装置用テストヘッド
KR200316883Y1 (ko) 칩 검사용 소켓장치
KR20100002988A (ko) 클립 소켓 어셈블리 및 이를 구비하는 평판 디스플레이장치의 검사장치
KR100906344B1 (ko) 프로브 카드
JPH0513521A (ja) 半導体素子検査装置
JPH1145916A (ja) 半導体ウェハ試験装置および半導体ウェハの試験方法
JP2003066095A (ja) デバイスキャリア及びオートハンドラ
WO2007113918A1 (ja) 緊急停止装置及びそれを備えた電子部品試験装置並びに電子部品試験装置の緊急停止方法
JPH08201431A (ja) ウェハプローバ

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20130621

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20140626

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20150618

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20160617

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20170616

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20180618

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20190618

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 17

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20250317

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION