TWI354794B - - Google Patents

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Publication number
TWI354794B
TWI354794B TW094106464A TW94106464A TWI354794B TW I354794 B TWI354794 B TW I354794B TW 094106464 A TW094106464 A TW 094106464A TW 94106464 A TW94106464 A TW 94106464A TW I354794 B TWI354794 B TW I354794B
Authority
TW
Taiwan
Prior art keywords
ring
card holder
probe
card
pressing member
Prior art date
Application number
TW094106464A
Other languages
English (en)
Chinese (zh)
Other versions
TW200533923A (en
Inventor
Masayuki Noguchi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200533923A publication Critical patent/TW200533923A/zh
Application granted granted Critical
Publication of TWI354794B publication Critical patent/TWI354794B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW094106464A 2004-03-19 2005-03-03 Probe device capable of being used for plural kinds of testers TW200533923A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004079510A JP2005265658A (ja) 2004-03-19 2004-03-19 複数種のテスタに対応可能なプローブ装置

Publications (2)

Publication Number Publication Date
TW200533923A TW200533923A (en) 2005-10-16
TWI354794B true TWI354794B (enExample) 2011-12-21

Family

ID=34993841

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106464A TW200533923A (en) 2004-03-19 2005-03-03 Probe device capable of being used for plural kinds of testers

Country Status (7)

Country Link
US (1) US7323893B2 (enExample)
EP (1) EP1736787A4 (enExample)
JP (1) JP2005265658A (enExample)
KR (1) KR100845349B1 (enExample)
CN (1) CN100545666C (enExample)
TW (1) TW200533923A (enExample)
WO (1) WO2005091006A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465728B (zh) * 2012-05-29 2014-12-21 Nihon Micronics Kk 探針卡
TWI713263B (zh) * 2018-08-08 2020-12-11 美商惠普發展公司有限責任合夥企業 彈簧針的調整控制機構

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408500B1 (en) * 2000-09-15 2002-06-25 James Orsillo Method of retrofitting a probe station
US7652491B2 (en) * 2006-11-17 2010-01-26 Suss Microtec Test Systems Gmbh Probe support with shield for the examination of test substrates under use of probe supports
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices
JP4514236B2 (ja) * 2008-02-25 2010-07-28 株式会社協同 プローブカード移載装置
KR101101535B1 (ko) * 2008-03-14 2012-01-02 송원호 프로브블록
WO2010035335A1 (ja) * 2008-09-26 2010-04-01 株式会社アドバンテスト テスト部ユニットおよびテストヘッド
CN101738575B (zh) * 2008-11-11 2013-08-21 京元电子股份有限公司 可换用不同探针卡的ic测试机台
KR101278890B1 (ko) * 2009-07-30 2013-06-26 가부시키가이샤 아드반테스트 프로브카드 홀딩장치 및 프로버
JP2011064659A (ja) * 2009-09-21 2011-03-31 Tokyo Electron Ltd プローブカードのクランプ機構及び検査装置
JP2011089891A (ja) * 2009-10-22 2011-05-06 Micronics Japan Co Ltd 電気的接続装置及びこれを用いる試験装置
TWI415204B (zh) * 2010-04-28 2013-11-11 Wen Chyimr Chen 測試板
KR101101559B1 (ko) * 2010-10-06 2012-01-02 송원호 프로브블록의 실리콘전극기판 제조방법
JP5788767B2 (ja) * 2011-11-07 2015-10-07 株式会社日本マイクロニクス プローブブロックとそれを備えるプローブカード並びにプローブ装置
CN103207290A (zh) * 2012-01-12 2013-07-17 瑞统企业股份有限公司 改良的电路板的测试治具结构
SG11201510025QA (en) * 2013-05-14 2016-01-28 Formfactor Inc Automated attaching and detaching of an interchangeable probe head
KR101754175B1 (ko) * 2014-12-27 2017-07-05 싱크-테크 시스템 코포레이션 업그레이드 기능을 구비한 테스트 기기
TWI583963B (zh) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 探針卡
KR102566685B1 (ko) * 2016-07-18 2023-08-14 삼성전자주식회사 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드
TWI620937B (zh) * 2017-04-17 2018-04-11 中華精測科技股份有限公司 微米細針吸取裝置及其使用方法
JP7138004B2 (ja) * 2018-09-28 2022-09-15 株式会社日本マイクロニクス プローブカード保持具
KR102689406B1 (ko) * 2018-11-16 2024-07-29 주식회사 기가레인 프로브카드용 공간변환부
TWM580255U (zh) 2019-01-25 2019-07-01 和碩聯合科技股份有限公司 旋鈕裝置
CN116774012B (zh) * 2023-08-15 2023-10-20 深圳市微特精密科技股份有限公司 一种ict测试夹具及测试装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719817B2 (ja) * 1987-05-01 1995-03-06 東京エレクトロン株式会社 プロ−ブカ−ド自動交換方法
JPS63299243A (ja) * 1987-05-29 1988-12-06 Tokyo Electron Ltd プロ−ブカ−ドアダプタ
JPH0543244Y2 (enExample) 1987-09-30 1993-10-29
US5068601A (en) * 1991-02-11 1991-11-26 Credence Systems Corporation Dual function cam-ring system for DUT board parallel electrical inter-connection and prober/handler docking
TW273635B (enExample) * 1994-09-01 1996-04-01 Aesop
US6118290A (en) * 1997-06-07 2000-09-12 Tokyo Electron Limited Prober and method for cleaning probes provided therein
US6114869A (en) * 1998-05-21 2000-09-05 Cerprobe Corporation Method and apparatus for interfacing between automatic wafer probe machines, automatic testers, and probe cards
US6166553A (en) * 1998-06-29 2000-12-26 Xandex, Inc. Prober-tester electrical interface for semiconductor test
JP2000150596A (ja) * 1998-11-10 2000-05-30 Tokyo Seimitsu Co Ltd プローバ
JP2000349128A (ja) * 1999-06-04 2000-12-15 Tokyo Seimitsu Co Ltd プローバ装置のプローバ側とテスタ側との接続方法及びその構造
US6340895B1 (en) * 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
US6408500B1 (en) * 2000-09-15 2002-06-25 James Orsillo Method of retrofitting a probe station
JP4134289B2 (ja) * 2002-05-29 2008-08-20 東京エレクトロン株式会社 プローブカード搬送装置及びアダプタ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465728B (zh) * 2012-05-29 2014-12-21 Nihon Micronics Kk 探針卡
TWI713263B (zh) * 2018-08-08 2020-12-11 美商惠普發展公司有限責任合夥企業 彈簧針的調整控制機構
US11379004B2 (en) 2018-08-08 2022-07-05 Hewlett-Packard Development Company, L.P. Adjustment control mechanisms of pogo pins

Also Published As

Publication number Publication date
JP2005265658A (ja) 2005-09-29
US20070007979A1 (en) 2007-01-11
WO2005091006A1 (ja) 2005-09-29
EP1736787A1 (en) 2006-12-27
US7323893B2 (en) 2008-01-29
KR100845349B1 (ko) 2008-07-09
CN100545666C (zh) 2009-09-30
KR20060130660A (ko) 2006-12-19
TW200533923A (en) 2005-10-16
EP1736787A4 (en) 2014-04-02
CN1906496A (zh) 2007-01-31

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MK4A Expiration of patent term of an invention patent