KR100844242B1 - 레이저 어닐링에 의한 박막 결정 성장 - Google Patents
레이저 어닐링에 의한 박막 결정 성장 Download PDFInfo
- Publication number
- KR100844242B1 KR100844242B1 KR1020010047890A KR20010047890A KR100844242B1 KR 100844242 B1 KR100844242 B1 KR 100844242B1 KR 1020010047890 A KR1020010047890 A KR 1020010047890A KR 20010047890 A KR20010047890 A KR 20010047890A KR 100844242 B1 KR100844242 B1 KR 100844242B1
- Authority
- KR
- South Korea
- Prior art keywords
- energy beam
- period
- energy
- laser
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02683—Continuous wave laser beam
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/637,325 | 2000-08-10 | ||
| US09/637,325 US6451631B1 (en) | 2000-08-10 | 2000-08-10 | Thin film crystal growth by laser annealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020014704A KR20020014704A (ko) | 2002-02-25 |
| KR100844242B1 true KR100844242B1 (ko) | 2008-07-07 |
Family
ID=24555457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020010047890A Expired - Fee Related KR100844242B1 (ko) | 2000-08-10 | 2001-08-09 | 레이저 어닐링에 의한 박막 결정 성장 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6451631B1 (enExample) |
| JP (1) | JP2002110544A (enExample) |
| KR (1) | KR100844242B1 (enExample) |
| TW (1) | TW548748B (enExample) |
Families Citing this family (82)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555449B1 (en) | 1996-05-28 | 2003-04-29 | Trustees Of Columbia University In The City Of New York | Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication |
| TW494444B (en) | 1999-08-18 | 2002-07-11 | Semiconductor Energy Lab | Laser apparatus and laser annealing method |
| US6830993B1 (en) | 2000-03-21 | 2004-12-14 | The Trustees Of Columbia University In The City Of New York | Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method |
| WO2002031869A2 (en) | 2000-10-10 | 2002-04-18 | The Trustees Of Columbia University In The City Of New York | Method and apparatus for processing thin metal layers |
| KR100672628B1 (ko) * | 2000-12-29 | 2007-01-23 | 엘지.필립스 엘시디 주식회사 | 액티브 매트릭스 유기 전계발광 디스플레이 장치 |
| JP4744700B2 (ja) * | 2001-01-29 | 2011-08-10 | 株式会社日立製作所 | 薄膜半導体装置及び薄膜半導体装置を含む画像表示装置 |
| US7009140B2 (en) * | 2001-04-18 | 2006-03-07 | Cymer, Inc. | Laser thin film poly-silicon annealing optical system |
| US6645454B2 (en) * | 2001-06-28 | 2003-11-11 | Sharp Laboratories Of America, Inc. | System and method for regulating lateral growth in laser irradiated silicon films |
| JP2003059858A (ja) * | 2001-08-09 | 2003-02-28 | Sony Corp | レーザアニール装置及び薄膜トランジスタの製造方法 |
| US6847006B2 (en) * | 2001-08-10 | 2005-01-25 | Semiconductor Energy Laboratory Co., Ltd. | Laser annealing apparatus and semiconductor device manufacturing method |
| KR100730808B1 (ko) * | 2001-08-11 | 2007-06-20 | 더 유니버시티 코트 오브 더 유니버시티 오브 던디 | 전계 방출 백플레이트 및 그의 제조방법과 전계 방출 장치 |
| US6590409B1 (en) * | 2001-12-13 | 2003-07-08 | Lsi Logic Corporation | Systems and methods for package defect detection |
| KR100514179B1 (ko) * | 2002-11-19 | 2005-09-13 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 사용하는 유기 전계 발광 소자 |
| US8288239B2 (en) * | 2002-09-30 | 2012-10-16 | Applied Materials, Inc. | Thermal flux annealing influence of buried species |
| KR100493156B1 (ko) * | 2002-06-05 | 2005-06-03 | 삼성전자주식회사 | 나노입자를 이용한 비정질 실리콘의 결정화 방법 |
| KR101131040B1 (ko) | 2002-08-19 | 2012-03-30 | 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 에지 영역을 최소화하도록 기판 상의 박막 영역을 레이저결정화 처리하는 방법 및 시스템, 그리고 그러한 박막 영역의 구조 |
| KR20050047103A (ko) | 2002-08-19 | 2005-05-19 | 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 다양한 조사 패턴을 포함하는 원 샷 반도체 가공 시스템 및방법 |
| TW200414280A (en) * | 2002-09-25 | 2004-08-01 | Adv Lcd Tech Dev Ct Co Ltd | Semiconductor device, annealing method, annealing apparatus and display apparatus |
| JP2004128421A (ja) * | 2002-10-07 | 2004-04-22 | Semiconductor Energy Lab Co Ltd | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
| US7332431B2 (en) * | 2002-10-17 | 2008-02-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| KR100501700B1 (ko) | 2002-12-16 | 2005-07-18 | 삼성에스디아이 주식회사 | 엘디디/오프셋 구조를 구비하고 있는 박막 트랜지스터 |
| JP2004207616A (ja) * | 2002-12-26 | 2004-07-22 | Hitachi Displays Ltd | 表示装置 |
| KR101191837B1 (ko) | 2003-02-19 | 2012-10-18 | 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 순차적 측면 고상화 기술을 이용하여 결정화되는 복수의 반도체 박막을 가공하는 방법 및 장치 |
| EP1468774B1 (en) * | 2003-02-28 | 2009-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device |
| JP2004266022A (ja) * | 2003-02-28 | 2004-09-24 | Sharp Corp | 半導体薄膜の結晶成長装置および結晶成長方法 |
| JP4373115B2 (ja) * | 2003-04-04 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6939754B2 (en) * | 2003-08-13 | 2005-09-06 | Sharp Laboratories Of America, Inc. | Isotropic polycrystalline silicon and method for producing same |
| US7164152B2 (en) | 2003-09-16 | 2007-01-16 | The Trustees Of Columbia University In The City Of New York | Laser-irradiated thin films having variable thickness |
| WO2005029547A2 (en) | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Enhancing the width of polycrystalline grains with mask |
| TWI359441B (en) | 2003-09-16 | 2012-03-01 | Univ Columbia | Processes and systems for laser crystallization pr |
| TWI351713B (en) | 2003-09-16 | 2011-11-01 | Univ Columbia | Method and system for providing a single-scan, con |
| US7318866B2 (en) * | 2003-09-16 | 2008-01-15 | The Trustees Of Columbia University In The City Of New York | Systems and methods for inducing crystallization of thin films using multiple optical paths |
| US7364952B2 (en) | 2003-09-16 | 2008-04-29 | The Trustees Of Columbia University In The City Of New York | Systems and methods for processing thin films |
| WO2005029546A2 (en) | 2003-09-16 | 2005-03-31 | The Trustees Of Columbia University In The City Of New York | Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination |
| KR100971951B1 (ko) * | 2003-09-17 | 2010-07-23 | 엘지디스플레이 주식회사 | 엑시머 레이저를 이용한 비정질 실리콘 박막 결정화 방법 |
| WO2005034193A2 (en) | 2003-09-19 | 2005-04-14 | The Trustees Of Columbia University In The City Ofnew York | Single scan irradiation for crystallization of thin films |
| JP4413569B2 (ja) * | 2003-09-25 | 2010-02-10 | 株式会社 日立ディスプレイズ | 表示パネルの製造方法及び表示パネル |
| US7018468B2 (en) * | 2003-11-13 | 2006-03-28 | Sharp Laboratories Of America, Inc. | Process for long crystal lateral growth in silicon films by UV and IR pulse sequencing |
| US7858450B2 (en) * | 2004-01-06 | 2010-12-28 | Samsung Electronics Co., Ltd. | Optic mask and manufacturing method of thin film transistor array panel using the same |
| KR101041066B1 (ko) * | 2004-02-13 | 2011-06-13 | 삼성전자주식회사 | 실리콘 결정화 방법, 이를 이용한 실리콘 결정화 장치,이를 이용한 박막 트랜지스터, 박막 트랜지스터의 제조방법 및 이를 이용한 표시장치 |
| KR100603330B1 (ko) * | 2004-02-16 | 2006-07-20 | 삼성에스디아이 주식회사 | 레이저 결정화 장치 |
| TWI304897B (en) * | 2004-11-15 | 2009-01-01 | Au Optronics Corp | Method of manufacturing a polysilicon layer and a mask used thereof |
| US7645337B2 (en) | 2004-11-18 | 2010-01-12 | The Trustees Of Columbia University In The City Of New York | Systems and methods for creating crystallographic-orientation controlled poly-silicon films |
| US8221544B2 (en) | 2005-04-06 | 2012-07-17 | The Trustees Of Columbia University In The City Of New York | Line scan sequential lateral solidification of thin films |
| US7674149B2 (en) * | 2005-04-21 | 2010-03-09 | Industrial Technology Research Institute | Method for fabricating field emitters by using laser-induced re-crystallization |
| JP2009518864A (ja) | 2005-12-05 | 2009-05-07 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | 膜を加工するためのシステム及び方法並びに薄膜 |
| WO2008091242A2 (en) * | 2005-12-21 | 2008-07-31 | Uva Patent Foundation | Systems and methods of laser texturing and crystallization of material surfaces |
| US8846551B2 (en) | 2005-12-21 | 2014-09-30 | University Of Virginia Patent Foundation | Systems and methods of laser texturing of material surfaces and their applications |
| KR100740124B1 (ko) * | 2006-10-13 | 2007-07-16 | 삼성에스디아이 주식회사 | 다결정 실리콘 박막 트랜지스터 및 그 제조방법 |
| US20100143744A1 (en) * | 2007-03-09 | 2010-06-10 | University Of Virginia Patent Foundation | Systems and Methods of Laser Texturing of Material Surfaces and their Applications |
| US8614471B2 (en) | 2007-09-21 | 2013-12-24 | The Trustees Of Columbia University In The City Of New York | Collections of laterally crystallized semiconductor islands for use in thin film transistors |
| US8415670B2 (en) | 2007-09-25 | 2013-04-09 | The Trustees Of Columbia University In The City Of New York | Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films |
| GB0722120D0 (en) * | 2007-11-10 | 2007-12-19 | Quantum Filament Technologies | Improved field emission backplate |
| US8012861B2 (en) | 2007-11-21 | 2011-09-06 | The Trustees Of Columbia University In The City Of New York | Systems and methods for preparing epitaxially textured polycrystalline films |
| WO2009067688A1 (en) | 2007-11-21 | 2009-05-28 | The Trustees Of Columbia University In The City Of New York | Systems and methods for preparing epitaxially textured polycrystalline films |
| CN103354204A (zh) | 2007-11-21 | 2013-10-16 | 纽约市哥伦比亚大学理事会 | 用于制备外延纹理厚膜的系统和方法 |
| US8334194B2 (en) * | 2008-02-06 | 2012-12-18 | Motech Americas, Llc | Methods and apparatus for manufacturing semiconductor wafers |
| WO2009111340A2 (en) | 2008-02-29 | 2009-09-11 | The Trustees Of Columbia University In The City Of New York | Flash lamp annealing crystallization for large area thin films |
| US20090280336A1 (en) * | 2008-05-08 | 2009-11-12 | Ralf Jonczyk | Semiconductor sheets and methods of fabricating the same |
| US20100102323A1 (en) * | 2008-10-24 | 2010-04-29 | Sposili Robert S | Directionally Annealed Silicon Film Having a (100)-Normal Crystallographical Orientation |
| EP2351067A4 (en) | 2008-11-14 | 2013-07-03 | Univ Columbia | SYSTEMS AND METHOD FOR CRYSTALLIZING THIN FILMS |
| US8247317B2 (en) * | 2009-09-16 | 2012-08-21 | Applied Materials, Inc. | Methods of solid phase recrystallization of thin film using pulse train annealing method |
| US9646831B2 (en) | 2009-11-03 | 2017-05-09 | The Trustees Of Columbia University In The City Of New York | Advanced excimer laser annealing for thin films |
| US8440581B2 (en) | 2009-11-24 | 2013-05-14 | The Trustees Of Columbia University In The City Of New York | Systems and methods for non-periodic pulse sequential lateral solidification |
| US9087696B2 (en) | 2009-11-03 | 2015-07-21 | The Trustees Of Columbia University In The City Of New York | Systems and methods for non-periodic pulse partial melt film processing |
| TWI459444B (zh) | 2009-11-30 | 2014-11-01 | Applied Materials Inc | 在半導體應用上的結晶處理 |
| US20120074117A1 (en) * | 2010-09-23 | 2012-03-29 | Varian Semiconductor Equipment Associates, Inc. | In-situ heating and co-annealing for laser annealed junction formation |
| WO2012120563A1 (ja) * | 2011-03-08 | 2012-09-13 | パナソニック株式会社 | 薄膜トランジスタアレイ装置、有機el表示装置、及び、薄膜トランジスタアレイ装置の製造方法 |
| US10131086B2 (en) | 2011-06-30 | 2018-11-20 | University Of Virginia Patent Foundation | Micro-structure and nano-structure replication methods and article of manufacture |
| TWI582837B (zh) * | 2012-06-11 | 2017-05-11 | 應用材料股份有限公司 | 在脈衝式雷射退火中使用紅外線干涉技術之熔化深度測定 |
| US9413137B2 (en) | 2013-03-15 | 2016-08-09 | Nlight, Inc. | Pulsed line beam device processing systems using laser diodes |
| US10226837B2 (en) | 2013-03-15 | 2019-03-12 | Nlight, Inc. | Thermal processing with line beams |
| CN104282539A (zh) * | 2013-07-04 | 2015-01-14 | 上海和辉光电有限公司 | 一种多晶硅制作方法 |
| DE102013224693A1 (de) * | 2013-12-02 | 2015-06-03 | Eos Gmbh Electro Optical Systems | Verfahren zur beschleunigten Herstellung von Objekten mittels generativer Fertigung |
| TW201528379A (zh) * | 2013-12-20 | 2015-07-16 | Applied Materials Inc | 雙波長退火方法與設備 |
| EP2899749A1 (en) * | 2014-01-24 | 2015-07-29 | Excico France | Method for forming polycrystalline silicon by laser irradiation |
| WO2015127031A1 (en) * | 2014-02-19 | 2015-08-27 | The Trustees Of Columbia University In The City Of New York | Sequential laser firing for thin film processing |
| US9106887B1 (en) * | 2014-03-13 | 2015-08-11 | Wowza Media Systems, LLC | Adjusting encoding parameters at a mobile device based on a change in available network bandwidth |
| KR102235601B1 (ko) | 2014-05-29 | 2021-04-05 | 삼성디스플레이 주식회사 | 박막트랜지스터의 활성층 결정화 장치 및 그것을 이용한 결정화 방법 |
| JP6471379B2 (ja) * | 2014-11-25 | 2019-02-20 | 株式会社ブイ・テクノロジー | 薄膜トランジスタ、薄膜トランジスタの製造方法及びレーザアニール装置 |
| US10466494B2 (en) | 2015-12-18 | 2019-11-05 | Nlight, Inc. | Reverse interleaving for laser line generators |
| GB201614342D0 (en) * | 2016-08-22 | 2016-10-05 | M-Solv Ltd | An apparatus for annealing a layer of amorphous silicon, a method of annealing a layer of amorphous silicon, and a flat panel display |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997045827A1 (en) * | 1996-05-28 | 1997-12-04 | The Trustees Of Columbia University In The City Of New York | Crystallization processing of semiconductor film regions on a substrate, and devices made therewith |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR960001706B1 (ko) * | 1993-05-27 | 1996-02-03 | 삼성전자주식회사 | 다결정 실리콘의 제조방법 및 장치 |
| JP3388042B2 (ja) * | 1994-11-18 | 2003-03-17 | 三菱電機株式会社 | レーザアニーリング方法 |
| JPH08186268A (ja) * | 1994-12-28 | 1996-07-16 | Sony Corp | 薄膜半導体装置の製造方法 |
| JPH09213651A (ja) * | 1996-02-06 | 1997-08-15 | Sharp Corp | 半導体薄膜の製造装置および半導体薄膜の製造方法 |
| KR100234895B1 (ko) * | 1997-05-12 | 1999-12-15 | 구본준 | 비정질 실리콘의 결정화 방법 |
| JP3586558B2 (ja) * | 1998-04-17 | 2004-11-10 | 日本電気株式会社 | 薄膜の改質方法及びその実施に使用する装置 |
| KR100327087B1 (ko) * | 1999-06-28 | 2002-03-13 | 구본준, 론 위라하디락사 | 레이저 어닐링 방법 |
| JP2001044120A (ja) * | 1999-08-04 | 2001-02-16 | Mitsubishi Electric Corp | レーザ熱処理方法およびレーザ熱処理装置 |
-
2000
- 2000-08-10 US US09/637,325 patent/US6451631B1/en not_active Expired - Fee Related
-
2001
- 2001-08-09 JP JP2001241661A patent/JP2002110544A/ja active Pending
- 2001-08-09 KR KR1020010047890A patent/KR100844242B1/ko not_active Expired - Fee Related
- 2001-08-10 TW TW090119837A patent/TW548748B/zh active
-
2002
- 2002-08-06 US US10/213,698 patent/US6635932B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997045827A1 (en) * | 1996-05-28 | 1997-12-04 | The Trustees Of Columbia University In The City Of New York | Crystallization processing of semiconductor film regions on a substrate, and devices made therewith |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030003636A1 (en) | 2003-01-02 |
| KR20020014704A (ko) | 2002-02-25 |
| US6635932B2 (en) | 2003-10-21 |
| TW548748B (en) | 2003-08-21 |
| US6451631B1 (en) | 2002-09-17 |
| JP2002110544A (ja) | 2002-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100844242B1 (ko) | 레이저 어닐링에 의한 박막 결정 성장 | |
| JP5789011B2 (ja) | 薄膜の直線走査連続横方向凝固 | |
| CN101617069B (zh) | 处理膜的系统和方法以及薄膜 | |
| KR101193585B1 (ko) | 열처리에 의해 얼라인먼트 마크를 형성한 반도체박막을가지는 반도체장치, 반도체박막의 결정화방법, 및반도체박막의 결정화장치 | |
| US6322625B2 (en) | Crystallization processing of semiconductor film regions on a substrate, and devices made therewith | |
| JP5068171B2 (ja) | 結晶方位制御ポリシリコン膜を生成するためのシステム及び方法 | |
| US20040063337A1 (en) | Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus | |
| JP2004311935A (ja) | 単結晶シリコン膜の製造方法 | |
| US7153359B2 (en) | Crystalline semiconductor film and production method thereof, and semiconductor device and production method thereof | |
| TWI575571B (zh) | 部分熔融膜之非週期性脈衝處理系統及方法 | |
| JP2003332346A (ja) | 薄膜トランジスタ及びその製造方法 | |
| JP2005347694A (ja) | 半導体薄膜の製造方法および半導体薄膜製造装置 | |
| CN101111925A (zh) | 用于产生结晶方向受控的多晶硅膜的系统和方法 | |
| JP3859978B2 (ja) | 基板上の半導体材料膜に横方向に延在する結晶領域を形成する装置 | |
| JP2004207691A (ja) | 半導体薄膜の製造方法、その製造方法により得られる半導体薄膜、その半導体薄膜を用いる半導体素子および半導体薄膜の製造装置 | |
| TWI389316B (zh) | 薄膜電晶體、半導體裝置、顯示器、結晶化方法及製造薄膜電晶體方法 | |
| US6255199B1 (en) | Method of producing polycrystalline silicon | |
| JP2009130231A (ja) | 結晶シリコンアレイ、および薄膜トランジスタの製造方法 | |
| KR100674061B1 (ko) | 반도체 소자 및 제조 방법 | |
| TWI452632B (zh) | 製造均勻一致結晶矽膜的微影方法 | |
| JP2002057105A (ja) | 半導体薄膜製造方法、半導体薄膜製造装置、およびマトリクス回路駆動装置 | |
| JP2007281465A (ja) | 多結晶膜の形成方法 | |
| WO2006075569A1 (ja) | 半導体薄膜の製造方法および半導体薄膜の製造装置 | |
| JP2002083769A (ja) | 半導体薄膜及び半導体薄膜の製造方法 | |
| KR100709163B1 (ko) | 다결정 실리콘 박막 형성 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20110701 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20110701 |