KR100819226B1 - 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품 - Google Patents

실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품 Download PDF

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KR100819226B1
KR100819226B1 KR1020047019649A KR20047019649A KR100819226B1 KR 100819226 B1 KR100819226 B1 KR 100819226B1 KR 1020047019649 A KR1020047019649 A KR 1020047019649A KR 20047019649 A KR20047019649 A KR 20047019649A KR 100819226 B1 KR100819226 B1 KR 100819226B1
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South Korea
Prior art keywords
film
silica
component
atom
composition
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KR1020047019649A
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English (en)
Korean (ko)
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KR20050008780A (ko
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사쿠라이하루아키
아베코우이치
에노모토카즈히로
노베시게루
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히다치 가세고교 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/02—Polysilicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Silicon Compounds (AREA)
KR1020047019649A 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품 KR100819226B1 (ko)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2002052025 2002-02-27
JPJP-P-2002-00052025 2002-02-27
JP2002060615 2002-03-06
JPJP-P-2002-00060622 2002-03-06
JPJP-P-2002-00060620 2002-03-06
JP2002060620 2002-03-06
JP2002060622 2002-03-06
JPJP-P-2002-00060615 2002-03-06
JPJP-P-2002-00127012 2002-04-26
JP2002127012 2002-04-26
PCT/JP2003/002157 WO2003072668A1 (fr) 2002-02-27 2003-02-26 Composition permettant de former un film de revetement a base de silice, film de revetement a base de silice, procede de preparation associe et parties electroniques

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7013253A Division KR20040094732A (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품

Publications (2)

Publication Number Publication Date
KR20050008780A KR20050008780A (ko) 2005-01-21
KR100819226B1 true KR100819226B1 (ko) 2008-04-02

Family

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Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020047019649A KR100819226B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR10-2004-7013253A KR20040094732A (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR1020077005209A KR100795251B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR1020057015194A KR100820992B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR10-2004-7013253A KR20040094732A (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR1020077005209A KR100795251B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
KR1020057015194A KR100820992B1 (ko) 2002-02-27 2003-02-26 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품

Country Status (7)

Country Link
US (1) US7358300B2 (fr)
JP (3) JP4151579B2 (fr)
KR (4) KR100819226B1 (fr)
CN (2) CN1320073C (fr)
AU (1) AU2003211343A1 (fr)
TW (3) TW200514828A (fr)
WO (1) WO2003072668A1 (fr)

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WO2010065169A1 (fr) * 2008-12-05 2010-06-10 E. I. Du Pont De Nemours And Company Produits de condensation de silice auto-assemblés

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KR101506801B1 (ko) * 2013-08-19 2015-03-30 성균관대학교산학협력단 고강도 저유전 플라즈마 중합체 박막 및 그 제조 방법
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Publication number Publication date
KR20050008780A (ko) 2005-01-21
WO2003072668A1 (fr) 2003-09-04
TW200400237A (en) 2004-01-01
JP2008297550A (ja) 2008-12-11
TWI297718B (fr) 2008-06-11
KR20070038574A (ko) 2007-04-10
CN1320073C (zh) 2007-06-06
JPWO2003072668A1 (ja) 2005-06-23
JP4169088B2 (ja) 2008-10-22
KR20050095788A (ko) 2005-09-30
KR100795251B1 (ko) 2008-01-15
TWI304434B (fr) 2008-12-21
TW200514828A (en) 2005-05-01
KR100820992B1 (ko) 2008-04-10
US20050119394A1 (en) 2005-06-02
CN1639283A (zh) 2005-07-13
JP2008195945A (ja) 2008-08-28
KR20040094732A (ko) 2004-11-10
TW200600557A (en) 2006-01-01
TWI297717B (fr) 2008-06-11
AU2003211343A1 (en) 2003-09-09
CN1637097A (zh) 2005-07-13
JP4151579B2 (ja) 2008-09-17
CN100491486C (zh) 2009-05-27
US7358300B2 (en) 2008-04-15

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