KR100756903B1 - 내부분 방전성 와이어 에나멜합성물 및 내부분 방전성 마그넷 와이어 - Google Patents
내부분 방전성 와이어 에나멜합성물 및 내부분 방전성 마그넷 와이어 Download PDFInfo
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Abstract
Description
Claims (5)
- 금속산화물 미세입자졸과 실리콘산화물 미세입자졸의 군에서 선택된 적어도 하나의 미세입자졸이 분산되고, 와이어 에나멜합성물이 에나멜수지의 100 중량부와 금속산화물 미세입자 및 실리콘산화물 미세입자의 군에서 선택된 적어도 하나의 미세입자의 3 내지 100 중량부를 포함하는 내부분 방전성 와이어 에나멜합성물.
- 제 1 항에 있어서,상기 금속산화물 미세입자졸과 실리콘산화물 미세입자졸은, 와이어 에나멜합성물과 우수한 상용성을 갖는 분산매질 중에서 평균입자경 100nm(100×10-9mm) 이하의 금속산화물 미세입자 또는 실리콘산화물 미세입자를 포함한 투명하거나 유백색 콜로이드 액체인 것을 특징으로 하는 내부분 방전성 와이어 에나멜합성물.
- 도체 위에 직접 또는 다른 도포층을 통하여 도포 및 베이킹하여서 얻어지되, 금속산화물 미세입자졸과 실리콘산화물 미세입자졸의 군에서 선택된 적어도 하나의 미세입자졸이 분산된 와이어 에나멜합성물이, 에나멜수지의 100 중량부와 금속산화물 미세입자 및 실리콘산화물 미세입자의 군에서 선택된 적어도 하나의 미세입자의 3 내지 100 중량부를 포함하는 내부분 방전성 마그넷 와이어.
- 제 3 항에 있어서,상기 금속산화물 미세입자졸과 실리콘산화물 미세입자졸은, 와이어 에나멜합성물과 우수한 상용성을 갖는 분산매질 중에서 평균입자경 100nm(100×10-9mm) 이하의 금속산화물 미세입자 또는 실리콘산화물 미세입자를 포함한 투명하거나 유백색 콜로이드 액체인 것을 특징으로 하는 내부분 방전성 마그넷 와이어.
- 도체 위에 와이어 에나멜합성물 도포층이 형성되고,상기 와이어 에나멜합성물 도포층 위에 윤활도포층이 형성되며,상기 와이어 에나멜합성물 도포층은 금속산화물 미세입자졸과 실리콘산화물 미세입자졸의 군에서 선택된 적어도 하나의 미세입자졸이 분산되어 얻어진 내부분 방전성 에나멜 와이어.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2000-43566 | 2000-02-16 | ||
JP2000043566 | 2000-02-16 | ||
JP2000352559A JP3496636B2 (ja) | 2000-02-16 | 2000-11-15 | 耐部分放電性エナメル線用塗料及び耐部分放電性エナメル線 |
JP2000-352559 | 2000-11-15 |
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KR20010082627A KR20010082627A (ko) | 2001-08-30 |
KR100756903B1 true KR100756903B1 (ko) | 2007-09-07 |
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KR1020010007262A KR100756903B1 (ko) | 2000-02-16 | 2001-02-14 | 내부분 방전성 와이어 에나멜합성물 및 내부분 방전성 마그넷 와이어 |
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Country | Link |
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US (1) | US6811875B2 (ko) |
JP (1) | JP3496636B2 (ko) |
KR (1) | KR100756903B1 (ko) |
CN (1) | CN1198889C (ko) |
MY (1) | MY124388A (ko) |
SG (1) | SG99884A1 (ko) |
Cited By (1)
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US8927630B2 (en) | 2011-12-20 | 2015-01-06 | Sejong University Industry Academy Cooperation Foundation | Inorganic nanofiller, partial discharge resistant enameled wire including the same, and preparing method of the enameled wire |
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DE10223354A1 (de) * | 2002-05-25 | 2003-12-04 | Bosch Gmbh Robert | Teilentladungsbeständiger Draht |
JP2004055185A (ja) | 2002-07-17 | 2004-02-19 | Toshiba Aitekku Kk | エナメル線 |
JP4617634B2 (ja) * | 2003-02-20 | 2011-01-26 | ダイキン工業株式会社 | 電気機器の製造方法 |
JP4542463B2 (ja) * | 2005-04-25 | 2010-09-15 | 日立マグネットワイヤ株式会社 | 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法 |
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US20070264527A1 (en) * | 2005-09-26 | 2007-11-15 | Sykes Melvin C | System and method for increasing the bond strength between a structural material and its reinforcement |
DE102006041738A1 (de) * | 2006-09-04 | 2008-03-06 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Zusammensetzung zur Beschichtung elektrischer Leiter und Verfahren zur Herstellung einer solchen Zusammensetzung |
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US20100009185A1 (en) * | 2008-07-14 | 2010-01-14 | Ta Ya Electric Wire & Cable Co., Ltd. | Enameled wire containing a nano-filler |
JP5243880B2 (ja) * | 2008-08-05 | 2013-07-24 | 日立電線株式会社 | 絶縁電線 |
WO2010018762A1 (ja) * | 2008-08-11 | 2010-02-18 | テルモ株式会社 | 医療用具 |
JP2010108843A (ja) | 2008-10-31 | 2010-05-13 | Hitachi Cable Ltd | 絶縁被覆電線 |
US8182880B2 (en) * | 2009-01-28 | 2012-05-22 | Honeywell International Inc. | Methods of manufacturing flexible insulated wires |
JP5438332B2 (ja) * | 2009-02-05 | 2014-03-12 | 昭和電線ケーブルシステム株式会社 | 高電圧電子機器用ケーブル |
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Also Published As
Publication number | Publication date |
---|---|
KR20010082627A (ko) | 2001-08-30 |
SG99884A1 (en) | 2003-11-27 |
MY124388A (en) | 2006-06-30 |
CN1198889C (zh) | 2005-04-27 |
JP3496636B2 (ja) | 2004-02-16 |
CN1310144A (zh) | 2001-08-29 |
US20030232144A1 (en) | 2003-12-18 |
JP2001307557A (ja) | 2001-11-02 |
US6811875B2 (en) | 2004-11-02 |
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