KR100695980B1 - 기판세정장치 - Google Patents

기판세정장치 Download PDF

Info

Publication number
KR100695980B1
KR100695980B1 KR1020000038558A KR20000038558A KR100695980B1 KR 100695980 B1 KR100695980 B1 KR 100695980B1 KR 1020000038558 A KR1020000038558 A KR 1020000038558A KR 20000038558 A KR20000038558 A KR 20000038558A KR 100695980 B1 KR100695980 B1 KR 100695980B1
Authority
KR
South Korea
Prior art keywords
substrate
cleaning
cylindrical
scrubbing
outer circumferential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020000038558A
Other languages
English (en)
Korean (ko)
Other versions
KR20010015205A (ko
Inventor
아토고지
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20010015205A publication Critical patent/KR20010015205A/ko
Application granted granted Critical
Publication of KR100695980B1 publication Critical patent/KR100695980B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020000038558A 1999-07-06 2000-07-06 기판세정장치 Expired - Lifetime KR100695980B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP19232199 1999-07-06
JP11-192321 1999-07-06
JP2000196683A JP2001070896A (ja) 1999-07-06 2000-06-29 基板洗浄装置
JP2000-196683 2000-06-29

Publications (2)

Publication Number Publication Date
KR20010015205A KR20010015205A (ko) 2001-02-26
KR100695980B1 true KR100695980B1 (ko) 2007-03-15

Family

ID=26507249

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000038558A Expired - Lifetime KR100695980B1 (ko) 1999-07-06 2000-07-06 기판세정장치

Country Status (3)

Country Link
US (1) US6560809B1 (https=)
JP (1) JP2001070896A (https=)
KR (1) KR100695980B1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6827633B2 (en) * 2001-12-28 2004-12-07 Ebara Corporation Polishing method
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
US7007333B1 (en) * 2002-06-28 2006-03-07 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
US20050048768A1 (en) * 2003-08-26 2005-03-03 Hiroaki Inoue Apparatus and method for forming interconnects
KR20080005974A (ko) * 2005-04-25 2008-01-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 에지를 세정하기 위한 방법 및 장치
KR100892809B1 (ko) 2006-03-30 2009-04-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
JP4719051B2 (ja) * 2006-03-30 2011-07-06 ソニー株式会社 基板処理装置および基板処理方法
US8844546B2 (en) * 2008-10-01 2014-09-30 Applied Materials, Inc. Apparatus and method for cleaning semiconductor substrate using pressurized fluid
JP5901273B2 (ja) * 2011-12-19 2016-04-06 住友化学株式会社 封口用マスクの洗浄方法及び洗浄装置、並びにハニカム構造体の製造方法
JP5940824B2 (ja) * 2012-02-07 2016-06-29 株式会社荏原製作所 基板洗浄方法
JP6182347B2 (ja) * 2013-04-19 2017-08-16 株式会社荏原製作所 基板処理装置
JP6700043B2 (ja) * 2016-01-07 2020-05-27 株式会社ディスコ 洗浄スポンジ
CN106216274A (zh) * 2016-07-27 2016-12-14 陕西彩虹电子玻璃有限公司 一种玻璃基板边部刷洗装置及其控制方法
TWI744410B (zh) * 2016-11-08 2021-11-01 美商康寧公司 用於清潔玻璃板的方法、設備及組合件
TWI834489B (zh) * 2017-12-13 2024-03-01 日商東京威力科創股份有限公司 基板處理裝置
JP6969434B2 (ja) * 2018-02-21 2021-11-24 東京エレクトロン株式会社 洗浄具、基板洗浄装置及び基板洗浄方法
TWI759727B (zh) * 2020-04-24 2022-04-01 弘塑科技股份有限公司 批次式基板浸泡洗邊設備
JP7300433B2 (ja) * 2020-10-28 2023-06-29 信越半導体株式会社 エピタキシャルウェーハの洗浄方法
CN116153803B (zh) * 2023-04-23 2023-07-14 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10229062A (ja) * 1997-02-14 1998-08-25 Dainippon Screen Mfg Co Ltd 基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0175278B1 (ko) 1996-02-13 1999-04-01 김광호 웨이퍼 세정장치
US5937469A (en) * 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
US5901399A (en) * 1996-12-30 1999-05-11 Intel Corporation Flexible-leaf substrate edge cleaning apparatus
JPH10229040A (ja) 1997-02-17 1998-08-25 Dainippon Screen Mfg Co Ltd 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10229062A (ja) * 1997-02-14 1998-08-25 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
JP2001070896A (ja) 2001-03-21
US6560809B1 (en) 2003-05-13
KR20010015205A (ko) 2001-02-26

Similar Documents

Publication Publication Date Title
KR100695980B1 (ko) 기판세정장치
KR101277614B1 (ko) 기판처리장치 및 기판처리방법
KR100632412B1 (ko) 세정장치
US6558239B2 (en) Polishing apparatus
TWI788454B (zh) 基板處理裝置及基板處理方法
KR100487589B1 (ko) 평면 피가공물의 폴리싱과 세정방법 및 장치
TW202212004A (zh) 清洗構件安裝機構及基板清洗裝置
JPH10180198A (ja) 洗浄装置
JP3892635B2 (ja) 洗浄装置
EP3272459B1 (en) Apparatus and method for polishing a surface of a substrate
JP2017147334A (ja) 基板の裏面を洗浄する装置および方法
JP2002079190A (ja) 基板洗浄部材、ならびにこれを用いた基板洗浄装置および基板洗浄方法
JP4283068B2 (ja) 基板洗浄装置の洗浄部材の初期化方法、基板洗浄装置並びに基板研磨及び洗浄システム
JP4451429B2 (ja) 洗浄装置
JP7166132B2 (ja) 基板洗浄部材および基板洗浄装置
JP2015015284A (ja) 基板洗浄装置および基板洗浄方法
JP2017162889A (ja) 基板洗浄装置、基板洗浄方法、基板処理装置および基板乾燥装置
JP2000040684A (ja) 洗浄装置
JP7336967B2 (ja) 基板処理装置、および基板処理方法
KR102483002B1 (ko) 기판 처리 장치
JP3762176B2 (ja) 洗浄装置
KR102135060B1 (ko) 기판의 이면을 세정하는 장치 및 방법
JP2003031541A (ja) 洗浄装置
KR20190054965A (ko) 기판 처리 장치 및 기판 처리 방법
US20250319570A1 (en) Contact cleaning units in cmp polisher

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20130227

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20140220

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20150224

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20160218

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20170220

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20180219

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20200218

Year of fee payment: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20200707

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000