JP2001070896A - 基板洗浄装置 - Google Patents

基板洗浄装置

Info

Publication number
JP2001070896A
JP2001070896A JP2000196683A JP2000196683A JP2001070896A JP 2001070896 A JP2001070896 A JP 2001070896A JP 2000196683 A JP2000196683 A JP 2000196683A JP 2000196683 A JP2000196683 A JP 2000196683A JP 2001070896 A JP2001070896 A JP 2001070896A
Authority
JP
Japan
Prior art keywords
substrate
cleaning member
cleaning
scrub
scrub cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000196683A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001070896A5 (https=
Inventor
Koji Ato
浩司 阿藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000196683A priority Critical patent/JP2001070896A/ja
Priority to US09/610,989 priority patent/US6560809B1/en
Priority to KR1020000038558A priority patent/KR100695980B1/ko
Publication of JP2001070896A publication Critical patent/JP2001070896A/ja
Publication of JP2001070896A5 publication Critical patent/JP2001070896A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2000196683A 1999-07-06 2000-06-29 基板洗浄装置 Pending JP2001070896A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000196683A JP2001070896A (ja) 1999-07-06 2000-06-29 基板洗浄装置
US09/610,989 US6560809B1 (en) 1999-07-06 2000-07-06 Substrate cleaning apparatus
KR1020000038558A KR100695980B1 (ko) 1999-07-06 2000-07-06 기판세정장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP19232199 1999-07-06
JP11-192321 1999-07-06
JP2000196683A JP2001070896A (ja) 1999-07-06 2000-06-29 基板洗浄装置

Publications (2)

Publication Number Publication Date
JP2001070896A true JP2001070896A (ja) 2001-03-21
JP2001070896A5 JP2001070896A5 (https=) 2005-07-14

Family

ID=26507249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000196683A Pending JP2001070896A (ja) 1999-07-06 2000-06-29 基板洗浄装置

Country Status (3)

Country Link
US (1) US6560809B1 (https=)
JP (1) JP2001070896A (https=)
KR (1) KR100695980B1 (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100892809B1 (ko) * 2006-03-30 2009-04-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
JP2013126751A (ja) * 2011-12-19 2013-06-27 Sumitomo Chemical Co Ltd 封口用マスクの洗浄方法及び洗浄装置、並びにハニカム構造体の製造方法
JP2013162044A (ja) * 2012-02-07 2013-08-19 Ebara Corp 基板洗浄装置及び洗浄方法
JP2014212237A (ja) * 2013-04-19 2014-11-13 株式会社荏原製作所 基板処理装置
JP2017123397A (ja) * 2016-01-07 2017-07-13 株式会社ディスコ 洗浄スポンジ
JP2019145687A (ja) * 2018-02-21 2019-08-29 東京エレクトロン株式会社 洗浄具、基板洗浄装置及び基板洗浄方法
JP2019534160A (ja) * 2016-11-08 2019-11-28 コーニング インコーポレイテッド ガラスシートをクリーニングするための方法、装置、およびアセンブリ
TWI759727B (zh) * 2020-04-24 2022-04-01 弘塑科技股份有限公司 批次式基板浸泡洗邊設備
JP2023009162A (ja) * 2017-12-13 2023-01-19 東京エレクトロン株式会社 基板処理装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6827633B2 (en) * 2001-12-28 2004-12-07 Ebara Corporation Polishing method
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
US7007333B1 (en) * 2002-06-28 2006-03-07 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
US20050048768A1 (en) * 2003-08-26 2005-03-03 Hiroaki Inoue Apparatus and method for forming interconnects
KR20080005974A (ko) * 2005-04-25 2008-01-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 에지를 세정하기 위한 방법 및 장치
JP4719051B2 (ja) * 2006-03-30 2011-07-06 ソニー株式会社 基板処理装置および基板処理方法
US8844546B2 (en) * 2008-10-01 2014-09-30 Applied Materials, Inc. Apparatus and method for cleaning semiconductor substrate using pressurized fluid
CN106216274A (zh) * 2016-07-27 2016-12-14 陕西彩虹电子玻璃有限公司 一种玻璃基板边部刷洗装置及其控制方法
JP7300433B2 (ja) * 2020-10-28 2023-06-29 信越半導体株式会社 エピタキシャルウェーハの洗浄方法
CN116153803B (zh) * 2023-04-23 2023-07-14 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0175278B1 (ko) 1996-02-13 1999-04-01 김광호 웨이퍼 세정장치
US5937469A (en) * 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
US5901399A (en) * 1996-12-30 1999-05-11 Intel Corporation Flexible-leaf substrate edge cleaning apparatus
JP4271267B2 (ja) * 1997-02-14 2009-06-03 大日本スクリーン製造株式会社 基板処理方法
JPH10229040A (ja) 1997-02-17 1998-08-25 Dainippon Screen Mfg Co Ltd 基板処理装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100892809B1 (ko) * 2006-03-30 2009-04-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
US7979942B2 (en) 2006-03-30 2011-07-19 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus and substrate treatment method
JP2013126751A (ja) * 2011-12-19 2013-06-27 Sumitomo Chemical Co Ltd 封口用マスクの洗浄方法及び洗浄装置、並びにハニカム構造体の製造方法
JP2013162044A (ja) * 2012-02-07 2013-08-19 Ebara Corp 基板洗浄装置及び洗浄方法
JP2017195416A (ja) * 2013-04-19 2017-10-26 株式会社荏原製作所 基板処理装置
JP2014212237A (ja) * 2013-04-19 2014-11-13 株式会社荏原製作所 基板処理装置
JP2017123397A (ja) * 2016-01-07 2017-07-13 株式会社ディスコ 洗浄スポンジ
JP2019534160A (ja) * 2016-11-08 2019-11-28 コーニング インコーポレイテッド ガラスシートをクリーニングするための方法、装置、およびアセンブリ
JP2023009162A (ja) * 2017-12-13 2023-01-19 東京エレクトロン株式会社 基板処理装置
JP7422844B2 (ja) 2017-12-13 2024-01-26 東京エレクトロン株式会社 基板処理装置
KR20240011849A (ko) * 2017-12-13 2024-01-26 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
KR102840363B1 (ko) * 2017-12-13 2025-07-29 도쿄엘렉트론가부시키가이샤 기판 처리 장치
KR102935989B1 (ko) * 2017-12-13 2026-03-06 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP2019145687A (ja) * 2018-02-21 2019-08-29 東京エレクトロン株式会社 洗浄具、基板洗浄装置及び基板洗浄方法
TWI759727B (zh) * 2020-04-24 2022-04-01 弘塑科技股份有限公司 批次式基板浸泡洗邊設備

Also Published As

Publication number Publication date
KR100695980B1 (ko) 2007-03-15
US6560809B1 (en) 2003-05-13
KR20010015205A (ko) 2001-02-26

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