KR100669183B1 - 포토애시드 생성제 혼합물을 포함한 포토레지스트 조성물 - Google Patents
포토애시드 생성제 혼합물을 포함한 포토레지스트 조성물 Download PDFInfo
- Publication number
- KR100669183B1 KR100669183B1 KR1020000006750A KR20000006750A KR100669183B1 KR 100669183 B1 KR100669183 B1 KR 100669183B1 KR 1020000006750 A KR1020000006750 A KR 1020000006750A KR 20000006750 A KR20000006750 A KR 20000006750A KR 100669183 B1 KR100669183 B1 KR 100669183B1
- Authority
- KR
- South Korea
- Prior art keywords
- photoacid
- photoresist composition
- photoacid generator
- photoresist
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/122—Sulfur compound containing
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/253,171 | 1999-02-20 | ||
| US9/253,171 | 1999-02-20 | ||
| US09/253,171 US6200728B1 (en) | 1999-02-20 | 1999-02-20 | Photoresist compositions comprising blends of photoacid generators |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000076655A KR20000076655A (ko) | 2000-12-26 |
| KR100669183B1 true KR100669183B1 (ko) | 2007-01-16 |
Family
ID=22959171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000006750A Expired - Lifetime KR100669183B1 (ko) | 1999-02-20 | 2000-02-14 | 포토애시드 생성제 혼합물을 포함한 포토레지스트 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6200728B1 (https=) |
| EP (1) | EP1030221A1 (https=) |
| JP (3) | JP2000241965A (https=) |
| KR (1) | KR100669183B1 (https=) |
| TW (1) | TWI269939B (https=) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3955384B2 (ja) * | 1998-04-08 | 2007-08-08 | Azエレクトロニックマテリアルズ株式会社 | 化学増幅型レジスト組成物 |
| JP4272805B2 (ja) * | 1999-12-27 | 2009-06-03 | 富士フイルム株式会社 | ポジ型感放射線性組成物 |
| JP4253427B2 (ja) * | 2000-09-19 | 2009-04-15 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
| KR20030029053A (ko) * | 2001-04-05 | 2003-04-11 | 아치 스페셜티 케미칼즈, 인코포레이티드 | 포토레지스트용 퍼플루오로알킬설폰산 화합물 |
| JP3912767B2 (ja) * | 2001-06-21 | 2007-05-09 | 富士フイルム株式会社 | ポジ型感光性組成物 |
| US6949329B2 (en) | 2001-06-22 | 2005-09-27 | Matsushita Electric Industrial Co., Ltd. | Pattern formation method |
| TWI300516B (https=) * | 2001-07-24 | 2008-09-01 | Jsr Corp | |
| EP1308781A3 (en) * | 2001-10-05 | 2003-09-03 | Shipley Co. L.L.C. | Cyclic sulfonium and sulfoxonium photoacid generators and photoresists containing them |
| JP3901997B2 (ja) * | 2001-11-27 | 2007-04-04 | 富士通株式会社 | レジスト材料、レジストパターン及びその製造方法、並びに、半導体装置及びその製造方法 |
| US7214465B2 (en) * | 2002-01-10 | 2007-05-08 | Fujifilm Corporation | Positive photosensitive composition |
| US7108951B2 (en) * | 2002-02-26 | 2006-09-19 | Fuji Photo Film Co., Ltd. | Photosensitive resin composition |
| JP4410977B2 (ja) | 2002-07-09 | 2010-02-10 | 富士通株式会社 | 化学増幅レジスト材料及びそれを用いたパターニング方法 |
| US7208249B2 (en) * | 2002-09-30 | 2007-04-24 | Applied Materials, Inc. | Method of producing a patterned photoresist used to prepare high performance photomasks |
| US7314700B2 (en) * | 2002-12-05 | 2008-01-01 | International Business Machines Corporation | High sensitivity resist compositions for electron-based lithography |
| JP2006510066A (ja) * | 2002-12-16 | 2006-03-23 | イー−インク コーポレイション | 電気光学表示装置用バックプレーン |
| KR100561842B1 (ko) * | 2003-08-25 | 2006-03-16 | 삼성전자주식회사 | 단량체 광산발생제 조성물, 상기 조성물로 코팅된 기판,상기 단량체 광산발생제 조성물을 이용하여 기판상에서화합물을 합성하는 방법 및 상기 방법에 의하여 제조된마이크로어레이 |
| US7488565B2 (en) * | 2003-10-01 | 2009-02-10 | Chevron U.S.A. Inc. | Photoresist compositions comprising diamondoid derivatives |
| US7393627B2 (en) * | 2004-03-16 | 2008-07-01 | Cornell Research Foundation, Inc. | Environmentally friendly photoacid generators (PAGs) with no perfluorooctyl sulfonates (PFOS) |
| JP4308051B2 (ja) * | 2004-03-22 | 2009-08-05 | 富士フイルム株式会社 | 感光性組成物及びそれを用いたパターン形成方法 |
| US20050214674A1 (en) * | 2004-03-25 | 2005-09-29 | Yu Sui | Positive-working photoimageable bottom antireflective coating |
| KR100599076B1 (ko) * | 2004-05-31 | 2006-07-13 | 삼성전자주식회사 | 포토레지스트 조성물 및 이를 이용한 패턴 형성 방법 |
| JP2006078760A (ja) * | 2004-09-09 | 2006-03-23 | Tokyo Ohka Kogyo Co Ltd | 電子線またはeuv(極端紫外光)用レジスト組成物及びレジストパターン形成方法 |
| EP1829942B1 (en) * | 2006-02-28 | 2012-09-26 | Rohm and Haas Electronic Materials, L.L.C. | Coating compositions for use with an overcoated photoresist |
| WO2007124092A2 (en) | 2006-04-21 | 2007-11-01 | Cornell Research Foundation, Inc. | Photoacid generator compounds and compositions |
| JP4355725B2 (ja) * | 2006-12-25 | 2009-11-04 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
| US8088548B2 (en) * | 2007-10-23 | 2012-01-03 | Az Electronic Materials Usa Corp. | Bottom antireflective coating compositions |
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| US20090181319A1 (en) * | 2008-01-16 | 2009-07-16 | International Business Machines Corporation | Aromatic fluorine-free photoacid generators and photoresist compositions containing the same |
| JP5216573B2 (ja) | 2008-03-31 | 2013-06-19 | 富士フイルム株式会社 | 感活性光線または感放射線性樹脂組成物及びそれを用いたパターン形成方法 |
| US8163461B2 (en) * | 2008-04-09 | 2012-04-24 | Cornell Research Foundation, Inc. | Photoacid generator compounds and compositions |
| JP5192277B2 (ja) * | 2008-04-14 | 2013-05-08 | シャープ株式会社 | 固体撮像装置の製造方法 |
| JP5746818B2 (ja) | 2008-07-09 | 2015-07-08 | 富士フイルム株式会社 | 感活性光線性または感放射線性樹脂組成物及びそれを用いたパターン形成方法 |
| US8455176B2 (en) * | 2008-11-12 | 2013-06-04 | Az Electronic Materials Usa Corp. | Coating composition |
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| EP2216683B1 (en) | 2009-02-08 | 2018-11-14 | Rohm and Haas Electronic Materials, L.L.C. | Substrates coated with an antireflective composition and a photoresist |
| US20100203450A1 (en) * | 2009-02-11 | 2010-08-12 | International Business Machines Corporation | Photoresist compositions and methods of use |
| US8883407B2 (en) | 2009-06-12 | 2014-11-11 | Rohm And Haas Electronic Materials Llc | Coating compositions suitable for use with an overcoated photoresist |
| US8227307B2 (en) * | 2009-06-24 | 2012-07-24 | International Business Machines Corporation | Method for removing threshold voltage adjusting layer with external acid diffusion process |
| US8632948B2 (en) * | 2009-09-30 | 2014-01-21 | Az Electronic Materials Usa Corp. | Positive-working photoimageable bottom antireflective coating |
| US20110086312A1 (en) * | 2009-10-09 | 2011-04-14 | Dammel Ralph R | Positive-Working Photoimageable Bottom Antireflective Coating |
| US8460851B2 (en) * | 2010-01-14 | 2013-06-11 | Sumitomo Chemical Company, Limited | Salt and photoresist composition containing the same |
| TWI513678B (zh) | 2010-06-29 | 2015-12-21 | Sumitomo Chemical Co | 鹽、酸產生劑及光阻組成物 |
| US20120040288A1 (en) * | 2010-08-11 | 2012-02-16 | Microchem Corp. | Epoxy formulations with controllable photospeed |
| EP2458440A1 (en) | 2010-11-30 | 2012-05-30 | Rohm and Haas Electronic Materials LLC | Photoacid generators |
| JP5906787B2 (ja) | 2011-03-08 | 2016-04-20 | 住友化学株式会社 | 塩、レジスト組成物及びレジストパターンの製造方法 |
| JP5985898B2 (ja) | 2011-07-19 | 2016-09-06 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP5990041B2 (ja) | 2011-07-19 | 2016-09-07 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP5886696B2 (ja) | 2011-07-19 | 2016-03-16 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP2013174660A (ja) * | 2012-02-23 | 2013-09-05 | Fujifilm Corp | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機el表示装置および液晶表示装置 |
| JP5856991B2 (ja) | 2012-05-21 | 2016-02-10 | 富士フイルム株式会社 | 化学増幅型レジスト組成物、ネガ型化学増幅型レジスト組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、フォトマスクの製造方法及びパターン形成方法、並びに、電子デバイスの製造方法 |
| US10248020B2 (en) * | 2012-12-28 | 2019-04-02 | Rohm And Haas Electronic Materials Llc | Acid generators and photoresists comprising same |
| JP5789705B2 (ja) * | 2014-06-16 | 2015-10-07 | 富士フイルム株式会社 | 感活性光線性または感放射線性樹脂組成物、及び該組成物を用いたパターン形成方法 |
| JP2018109701A (ja) | 2017-01-04 | 2018-07-12 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | 化学増幅型ポジ型フォトレジスト組成物およびそれを用いたパターン形成方法 |
| WO2019172054A1 (ja) * | 2018-03-08 | 2019-09-12 | Jsr株式会社 | 感放射線性樹脂組成物及びその製造方法並びにレジストパターン形成方法 |
| US11820735B2 (en) * | 2018-04-12 | 2023-11-21 | Sumitomo Chemical Company, Limited | Salt, acid generator, resist composition and method for producing resist pattern |
| US20210263414A1 (en) * | 2018-06-22 | 2021-08-26 | Merck Patent Gmbh | A photoresist composition, a method for manufacturing a photoresist coating, etched photoresist coating, and etched si containing layer(s), and manufacturing a device using thereof |
| JP7344108B2 (ja) | 2019-01-08 | 2023-09-13 | 信越化学工業株式会社 | レジスト組成物、及びパターン形成方法 |
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| JP3591549B2 (ja) * | 1995-11-02 | 2004-11-24 | 信越化学工業株式会社 | 新規ヨ−ドニウム塩及び化学増幅ポジ型レジスト材料 |
| TW477913B (en) * | 1995-11-02 | 2002-03-01 | Shinetsu Chemical Co | Sulfonium salts and chemically amplified positive resist compositions |
| JP3409619B2 (ja) * | 1995-12-21 | 2003-05-26 | 和光純薬工業株式会社 | ポリマー組成物及びこれを含んで成るレジスト材料 |
| DE69628996T2 (de) | 1995-12-21 | 2004-04-22 | Wako Pure Chemical Industries, Ltd. | Polymerzusammensetzung und Rezistmaterial |
| US5731364A (en) | 1996-01-24 | 1998-03-24 | Shipley Company, L.L.C. | Photoimageable compositions comprising multiple arylsulfonium photoactive compounds |
| US5942367A (en) * | 1996-04-24 | 1999-08-24 | Shin-Etsu Chemical Co., Ltd. | Chemically amplified positive resist composition, pattern forming method, and method for preparing polymer having a crosslinking group |
| JPH1097075A (ja) * | 1996-06-07 | 1998-04-14 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
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| US5939236A (en) * | 1997-02-07 | 1999-08-17 | Shipley Company, L.L.C. | Antireflective coating compositions comprising photoacid generators |
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| US6037107A (en) * | 1997-08-28 | 2000-03-14 | Shipley Company, L.L.C. | Photoresist compositions |
| TW546543B (en) | 1997-10-08 | 2003-08-11 | Shinetsu Chemical Co | Resist material and patterning process |
| KR19990036901A (ko) | 1997-10-08 | 1999-05-25 | 카나가와 치히로 | 폴리스티렌계 고분자 화합물, 화학증폭 포지티브형 레지스트 재료 및 패턴 형성 방법 |
| IT1295307B1 (it) | 1997-10-10 | 1999-05-04 | Niarb S A | Finitrice per la posa in opera dei conglomerati bituminosi munita di un rasatore estensibile perfezionato |
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| JP3743187B2 (ja) | 1998-05-08 | 2006-02-08 | 住友化学株式会社 | フォトレジスト組成物 |
| US6280911B1 (en) | 1998-09-10 | 2001-08-28 | Shipley Company, L.L.C. | Photoresist compositions comprising blends of ionic and non-ionic photoacid generators |
-
1999
- 1999-02-20 US US09/253,171 patent/US6200728B1/en not_active Expired - Lifetime
-
2000
- 2000-02-14 KR KR1020000006750A patent/KR100669183B1/ko not_active Expired - Lifetime
- 2000-02-15 EP EP00301138A patent/EP1030221A1/en not_active Ceased
- 2000-02-19 TW TW089102895A patent/TWI269939B/zh not_active IP Right Cessation
- 2000-02-21 JP JP2000042690A patent/JP2000241965A/ja active Pending
- 2000-04-19 US US09/552,211 patent/US6203965B1/en not_active Expired - Lifetime
-
2001
- 2001-02-17 US US09/788,106 patent/US6803169B2/en not_active Expired - Lifetime
-
2010
- 2010-04-07 JP JP2010089034A patent/JP2010186193A/ja active Pending
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2013
- 2013-08-09 JP JP2013166405A patent/JP5810139B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20010038970A1 (en) | 2001-11-08 |
| JP2013232016A (ja) | 2013-11-14 |
| TWI269939B (en) | 2007-01-01 |
| US6803169B2 (en) | 2004-10-12 |
| JP2000241965A (ja) | 2000-09-08 |
| JP5810139B2 (ja) | 2015-11-11 |
| US6200728B1 (en) | 2001-03-13 |
| US6203965B1 (en) | 2001-03-20 |
| KR20000076655A (ko) | 2000-12-26 |
| EP1030221A1 (en) | 2000-08-23 |
| JP2010186193A (ja) | 2010-08-26 |
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