KR100646160B1 - 순차측면결정화를 위한 마스크 및 이를 이용한 실리콘결정화 방법 - Google Patents
순차측면결정화를 위한 마스크 및 이를 이용한 실리콘결정화 방법 Download PDFInfo
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
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- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
- C30B1/023—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing from solids with amorphous structure
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/16—Heating of the molten zone
- C30B13/22—Heating of the molten zone by irradiation or electric discharge
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B28/00—Production of homogeneous polycrystalline material with defined structure
- C30B28/02—Production of homogeneous polycrystalline material with defined structure directly from the solid state
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
- H01L21/0268—Shape of mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1004—Apparatus with means for measuring, testing, or sensing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1004—Apparatus with means for measuring, testing, or sensing
- Y10T117/1008—Apparatus with means for measuring, testing, or sensing with responsive control means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1004—Apparatus with means for measuring, testing, or sensing
- Y10T117/1012—Apparatus with means for measuring, testing, or sensing with a window or port for visual observation or examination
Abstract
Description
Claims (10)
- 비정질 실리콘이 증착된 기판을 레이저 결정화 장비에 장착하는 단계와,레이저빔을 통과시키는 투과영역과 상기 레이저빔을 차단하는 차단영역으로 구성되고, 상기 투과영역은 가로방향이 장축이고 다수가 세로 및 가로 방향으로 이격되어 구성되며, 가로방향으로 이격된 투과영역은 이전의 투과영역의 사이영역에 대응하여 위치하여 가로 방향으로 갈수록 전체적으로 최상부의 투과영역이 하나씩 아래로 밀려 구성된 형상으로 배열되고 직사각형의 중앙부와, 상기 중앙부의 각 단축을 서로 멀어지도록 연장하며, 갈수록 폭이 좁아지는 테이퍼 형상의 양 에지부를 포함하는 레이저 마스크를 사용하여 1차 레이저 조사를 하여 상기 비정질 실리콘의 일부를 결정화하여 폴리실리콘을 형성하는 단계와,상기 레이저 마스크의 에지부가 중첩되도록 레이저 마스크를 기판에 대하여 이동하고, 2차 레이저 조사하여 상기 1차조사에 의해서 형성된 폴리실리콘을 성장시키는 단계를 포함하는 실리콘 결정화 방법.
- 청구항 1에 있어서,상기 레이저 마스크의 투과영역은 각각 상기 중앙부의 장축이 상기 마스크 이동방향과 나란하도록 배열된 것을 특징으로 하는 실리콘 결정화 방법.
- 청구항 1에 있어서,상기 레이저 마스크의 투과영역은 상기 마스크의 이동방향과 나란한 행, 그 리고 상기 마스크의 이동방향과 수직한 열을 이루며,상기 각 열의 인접한 두 투과영역의 높이차는 상기 각 투과영역의 중앙부 단축길이보다 작고, 단축길이의 반보다 큰 것을 특징으로 하는 실리콘 결정화 방법.
- 청구항 1에 있어서,상기 레이저 마스크의 투과영역은 상기 마스크의 이동방향고 나란한 행, 그 리고 상기 마스크의 이동방향과 수직한 열을 가지며,상기 각 열의 인접한 두 투과영역의 높이차는 상기 각 투과영역의 중앙부 단축길이의 반보다 작거나 같고, 0보다 큰 것을 특징으로 하는 실리콘 결정화 방법.
- 레이저빔을 통과시키는 투과영역과, 상기 레이저빔을 차단하는 차단영역으로 구성되어 일방향으로 이동되는 SLS 마스크로서,상기 투과영역은 다수가 가로방향과 세로 방향으로 이격하여 구성되며, 가로방향으로 이격된 투과영역은 이전의 투과영역의 사이영역에 대응하여 위치하여 가로 방향으로 갈수록 전체적으로 최상부의 투과영역이 하나씩 아래로 밀려 구성된 형상으로 배열되고,상기 투과영역 각각은 직사각형의 중앙부와;상기 중앙부의 각 단축을 서로 멀어지도록 연장하며, 갈수록 폭이 좁아지는 테이퍼 형상의 양 에지부를 포함하는 마스크
- 청구항 5에 있어서,상기 투과영역은 각각 상기 중앙부의 장축이 상기 마스크 이동방향과 나란하도록 배열된 마스크
- 청구항 6에 있어서,상기 각 투과영역은 상기 마스크의 이동방향과 나란한 행, 그리고 상기 마스크의 이동방향과 수직한 열을 이루며,상기 각 열의 인접한 두 투과영역 사이의 높이차는 상기 각 투과영역의 중앙부 단축길이보다 작고, 단축길이의 반보다 큰 것에 해당되는 마스크
- 청구항 6에 있어서,상기 각 투과영역은 상기 마스크의 이동방향과 나란한 행, 그리고 상기 마스크의 이동방향과 수직한 열을 이루며,상기 각 열의 인접한 두 투과영역 사이의 높이차는 상기 각 투과영역의 중앙부 단축길이의 반보다 작거나 같고, 0보다 큰 것에 해당되는 마스크
- 청구항 6에 있어서,상기 각 행의 투과영역은 서로 대향하는 에지부가 교차되는 마스크
- 청구항 5 에 있어서,상기 마스크의 이동거리는 상기 투과영역의 장축길이보다 같거나 작은 것에 해당하는 마스크
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020088532A KR100646160B1 (ko) | 2002-12-31 | 2002-12-31 | 순차측면결정화를 위한 마스크 및 이를 이용한 실리콘결정화 방법 |
US10/454,679 US6867151B2 (en) | 2002-12-31 | 2003-06-05 | Mask for sequential lateral solidification and crystallization method using thereof |
CNB031374743A CN1277155C (zh) | 2002-12-31 | 2003-06-25 | 用于连续横向固化的掩模和采用它的结晶方法 |
TW092117415A TWI223334B (en) | 2002-12-31 | 2003-06-26 | Mask for sequential lateral solidification and crystallization method using thereof |
GB0315076A GB2396962B (en) | 2002-12-31 | 2003-06-27 | Mask for sequential lateral solidification and and crystallization method using thereof |
FR0307823A FR2849530B1 (fr) | 2002-12-31 | 2003-06-27 | Masque pour solidification laterale sequentielle et procede de cristallisation utilisant celui ci |
DE10329332A DE10329332B4 (de) | 2002-12-31 | 2003-06-30 | Kristallisationsverfahren und Maske zum sequentiellen Querverfestigen sowie Vorrichtung diese benutzend |
JP2003362037A JP4099767B2 (ja) | 2002-12-31 | 2003-10-22 | 多結晶シリコン形成方法及び多結晶シリコン形成用レーザー装置のマスク |
US11/029,395 US7329936B2 (en) | 2002-12-31 | 2005-01-06 | Mask for sequential lateral solidification and crystallization method using thereof |
US12/002,759 US7651567B2 (en) | 2002-12-31 | 2007-12-19 | Mask for sequential lateral solidification and crystallization method using thereof |
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KR1020020088532A KR100646160B1 (ko) | 2002-12-31 | 2002-12-31 | 순차측면결정화를 위한 마스크 및 이를 이용한 실리콘결정화 방법 |
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KR20040062203A KR20040062203A (ko) | 2004-07-07 |
KR100646160B1 true KR100646160B1 (ko) | 2006-11-14 |
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US (3) | US6867151B2 (ko) |
JP (1) | JP4099767B2 (ko) |
KR (1) | KR100646160B1 (ko) |
CN (1) | CN1277155C (ko) |
DE (1) | DE10329332B4 (ko) |
FR (1) | FR2849530B1 (ko) |
GB (1) | GB2396962B (ko) |
TW (1) | TWI223334B (ko) |
Cited By (57)
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KR101026796B1 (ko) * | 2003-05-13 | 2011-04-04 | 삼성전자주식회사 | 다결정 규소층 및 다결정 규소용 마스크, 그 다결정규소층을 포함하는 표시 장치용 표시판 및 그 제조 방법 |
US8137466B2 (en) | 2009-08-24 | 2012-03-20 | Samsung Mobile Display Co., Ltd. | Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same |
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US8833294B2 (en) | 2010-07-30 | 2014-09-16 | Samsung Display Co., Ltd. | Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same |
US8846547B2 (en) | 2010-09-16 | 2014-09-30 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method |
US8852687B2 (en) | 2010-12-13 | 2014-10-07 | Samsung Display Co., Ltd. | Organic layer deposition apparatus |
US8859325B2 (en) | 2010-01-14 | 2014-10-14 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
US8859043B2 (en) | 2011-05-25 | 2014-10-14 | Samsung Display Co., Ltd. | Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same |
US8871542B2 (en) | 2010-10-22 | 2014-10-28 | Samsung Display Co., Ltd. | Method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus manufactured by using the method |
US8876975B2 (en) | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
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Also Published As
Publication number | Publication date |
---|---|
US7329936B2 (en) | 2008-02-12 |
GB0315076D0 (en) | 2003-07-30 |
US20050124145A1 (en) | 2005-06-09 |
US20040127066A1 (en) | 2004-07-01 |
KR20040062203A (ko) | 2004-07-07 |
GB2396962A (en) | 2004-07-07 |
FR2849530B1 (fr) | 2011-10-14 |
DE10329332B4 (de) | 2008-01-10 |
FR2849530A1 (fr) | 2004-07-02 |
US20080141935A1 (en) | 2008-06-19 |
CN1514304A (zh) | 2004-07-21 |
TW200411743A (en) | 2004-07-01 |
GB2396962B (en) | 2005-08-31 |
CN1277155C (zh) | 2006-09-27 |
JP4099767B2 (ja) | 2008-06-11 |
DE10329332A1 (de) | 2004-07-15 |
US6867151B2 (en) | 2005-03-15 |
US7651567B2 (en) | 2010-01-26 |
JP2004214614A (ja) | 2004-07-29 |
TWI223334B (en) | 2004-11-01 |
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