KR100635436B1 - 프로세스 장치 및 해당 프로세스 장치내의 파티클 제거 방법 - Google Patents

프로세스 장치 및 해당 프로세스 장치내의 파티클 제거 방법 Download PDF

Info

Publication number
KR100635436B1
KR100635436B1 KR1020050015360A KR20050015360A KR100635436B1 KR 100635436 B1 KR100635436 B1 KR 100635436B1 KR 1020050015360 A KR1020050015360 A KR 1020050015360A KR 20050015360 A KR20050015360 A KR 20050015360A KR 100635436 B1 KR100635436 B1 KR 100635436B1
Authority
KR
South Korea
Prior art keywords
temperature
gas
processing chamber
wall
vacuum processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050015360A
Other languages
English (en)
Korean (ko)
Other versions
KR20060042140A (ko
Inventor
츠요시 모리야
히로시 나가이케
히로유키 나카야마
기쿠오 오쿠야마
마나부 시마다
Original Assignee
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR20060042140A publication Critical patent/KR20060042140A/ko
Application granted granted Critical
Publication of KR100635436B1 publication Critical patent/KR100635436B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C17/00—Roller skates; Skate-boards
    • A63C17/18—Roller skates; Skate-boards convertible into ice or snow-running skates
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C1/00—Skates
    • A63C1/04—Skates fastened by means of clamps
    • A63C1/16—Special structure of the clamp fastening devices
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C1/00—Skates
    • A63C1/22—Skates with special foot-plates of the boot
    • A63C1/26—Skates with special foot-plates of the boot divided into two parts permitting adjustment to the size of the foot
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H01J2237/0225—Detecting or monitoring foreign particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020050015360A 2004-02-26 2005-02-24 프로세스 장치 및 해당 프로세스 장치내의 파티클 제거 방법 Expired - Fee Related KR100635436B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00051706 2004-02-26
JP2004051706A JP4330467B2 (ja) 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法

Publications (2)

Publication Number Publication Date
KR20060042140A KR20060042140A (ko) 2006-05-12
KR100635436B1 true KR100635436B1 (ko) 2006-10-18

Family

ID=34879627

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050015360A Expired - Fee Related KR100635436B1 (ko) 2004-02-26 2005-02-24 프로세스 장치 및 해당 프로세스 장치내의 파티클 제거 방법

Country Status (5)

Country Link
US (1) US7347006B2 (enExample)
JP (1) JP4330467B2 (enExample)
KR (1) KR100635436B1 (enExample)
CN (1) CN100349043C (enExample)
TW (1) TW200534334A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
DE102004044176A1 (de) * 2004-09-13 2006-03-30 BSH Bosch und Siemens Hausgeräte GmbH Trocknungsverfahren für ein Haushaltsgerät und Haushaltsgerät zur Durchführung des Trocknungsverfahren
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
JP5064119B2 (ja) * 2007-06-07 2012-10-31 東京エレクトロン株式会社 真空引き方法及び記憶媒体
US7473006B1 (en) * 2007-07-30 2009-01-06 James Bollman Illuminated landscape edging system
US20090086471A1 (en) * 2007-07-30 2009-04-02 Bollman James E Illuminated landscape module for existing edging system
US7837805B2 (en) * 2007-08-29 2010-11-23 Micron Technology, Inc. Methods for treating surfaces
KR100905213B1 (ko) 2007-09-19 2009-07-01 세메스 주식회사 기판 처리 장치
EP2058427A1 (en) * 2007-11-06 2009-05-13 BSH Electrodomésticos España, S.A. Household appliance having a heat pump unit and means for cooling a component thereof
US8361276B2 (en) * 2008-02-11 2013-01-29 Apjet, Inc. Large area, atmospheric pressure plasma for downstream processing
JP4611409B2 (ja) * 2008-09-03 2011-01-12 晃俊 沖野 プラズマ温度制御装置
JP5121684B2 (ja) * 2008-12-11 2013-01-16 株式会社日立ハイテクノロジーズ プラズマ処理装置
US8591755B2 (en) * 2010-09-15 2013-11-26 Lam Research Corporation Methods for controlling plasma constituent flux and deposition during semiconductor fabrication and apparatus for implementing the same
CN102368466B (zh) * 2011-09-20 2013-11-27 天通吉成机器技术有限公司 一种干法刻蚀坚硬无机材料基板等离子体刻蚀机的电极
KR20150046966A (ko) * 2013-10-23 2015-05-04 삼성디스플레이 주식회사 플라즈마 처리 장치 및 플라즈마 처리 방법
CN104716069B (zh) * 2015-03-23 2017-10-17 上海华力微电子有限公司 晶圆可接受性测试机台内部环境的监测方法和监测装置
CN105097408B (zh) * 2015-07-21 2017-09-26 深圳市华星光电技术有限公司 一种干法刻蚀机台及其使用方法
CN105589232A (zh) * 2016-03-11 2016-05-18 京东方科技集团股份有限公司 一种显示面板加工设备
JP2019169635A (ja) * 2018-03-23 2019-10-03 東京エレクトロン株式会社 クリーニング方法及び処理装置
JP7122864B2 (ja) 2018-05-14 2022-08-22 東京エレクトロン株式会社 クリーニング方法及び基板処理装置
JP7462383B2 (ja) 2019-04-15 2024-04-05 東京エレクトロン株式会社 クリーニング方法及びプラズマ処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757297B2 (ja) * 1987-04-22 1995-06-21 日本真空技術株式会社 真空排気系用微粒子トラツプ
US5367139A (en) 1989-10-23 1994-11-22 International Business Machines Corporation Methods and apparatus for contamination control in plasma processing
US5589041A (en) * 1995-06-07 1996-12-31 Sony Corporation Plasma sputter etching system with reduced particle contamination
JP2786144B2 (ja) * 1996-01-30 1998-08-13 九州日本電気株式会社 半導体装置の製造方法
JP3171161B2 (ja) * 1998-03-20 2001-05-28 日本電気株式会社 プラズマエッチング方法及びプラズマエッチング装置
JP2002196367A (ja) * 2000-02-10 2002-07-12 Matsushita Electric Ind Co Ltd 液晶表示装置
JP2001305546A (ja) * 2001-04-09 2001-10-31 Matsushita Electric Ind Co Ltd 液晶表示パネル及びその製造方法
US6811651B2 (en) * 2001-06-22 2004-11-02 Tokyo Electron Limited Gas temperature control for a plasma process

Also Published As

Publication number Publication date
US7347006B2 (en) 2008-03-25
CN1661433A (zh) 2005-08-31
KR20060042140A (ko) 2006-05-12
CN100349043C (zh) 2007-11-14
JP4330467B2 (ja) 2009-09-16
US20050189071A1 (en) 2005-09-01
TW200534334A (en) 2005-10-16
TWI373787B (enExample) 2012-10-01
JP2005243915A (ja) 2005-09-08

Similar Documents

Publication Publication Date Title
KR100635436B1 (ko) 프로세스 장치 및 해당 프로세스 장치내의 파티클 제거 방법
KR100399542B1 (ko) 플라즈마처리방법및장치
WO2000068986A1 (fr) Procédé et appareil de traitement sous vide
TW574406B (en) Method and apparatus for loading substrate in semiconductor manufacturing apparatus
JPS6056431B2 (ja) プラズマエツチング装置
TW200837865A (en) Substrate processing apparatus and focus ring
US9508578B2 (en) Method and apparatus for detecting foreign material on a chuck
US20170004984A1 (en) Substrate transfer apparatus and substrate transfer method
TW200849321A (en) Plasma processing apparatus and plasma processing method
JPH09172001A (ja) 半導体製造装置の温度制御方法および装置
US6238488B1 (en) Method of cleaning film forming apparatus, cleaning system for carrying out the same and film forming system
JP3317781B2 (ja) 半導体ウエハの熱処理用サセプタの製造方法
WO2004003995A1 (ja) 基板処理装置および半導体装置の製造方法
JP2002057107A (ja) ウエハ加熱部材及びこれを用いたウエハの均熱化方法
US20090061539A1 (en) Substrate holding structure and method of producing semiconductor device using the same
JP2011151055A (ja) 温度測定方法及び基板処理装置
JP2011071361A (ja) プラズマエッチング装置用シリコン製部品の再生方法及びプラズマエッチング装置用シリコン製部品
KR100855325B1 (ko) 로드락 챔버, 기판 처리 장치 및 기판 처리 방법
WO1998001894A1 (fr) Procede de fabrication d'un composant de circuit integre a semi-conducteur
JP2009200194A (ja) 加熱処理装置
JPH09181046A (ja) 半導体製造方法および装置
JPH0878339A (ja) 半導体製造装置
JP2002075872A (ja) 真空処理装置
JP2005085935A (ja) 基板処理装置
JPH02215126A (ja) 半導体ウェハのドライプロセス処理方法および処理装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20120924

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20130924

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20141001

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20150917

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20160921

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20170920

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20181004

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

FPAY Annual fee payment

Payment date: 20191001

Year of fee payment: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20211012

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20211012