JP4330467B2 - プロセス装置及び該プロセス装置内のパーティクル除去方法 - Google Patents

プロセス装置及び該プロセス装置内のパーティクル除去方法 Download PDF

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Publication number
JP4330467B2
JP4330467B2 JP2004051706A JP2004051706A JP4330467B2 JP 4330467 B2 JP4330467 B2 JP 4330467B2 JP 2004051706 A JP2004051706 A JP 2004051706A JP 2004051706 A JP2004051706 A JP 2004051706A JP 4330467 B2 JP4330467 B2 JP 4330467B2
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JP
Japan
Prior art keywords
temperature
gas
wall
processing chamber
vacuum processing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2004051706A
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English (en)
Japanese (ja)
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JP2005243915A (ja
Inventor
剛 守屋
宏史 長池
博之 中山
喜久夫 奥山
学 島田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004051706A priority Critical patent/JP4330467B2/ja
Priority to TW094105654A priority patent/TW200534334A/zh
Priority to KR1020050015360A priority patent/KR100635436B1/ko
Priority to US11/065,359 priority patent/US7347006B2/en
Priority to CNB2005100529177A priority patent/CN100349043C/zh
Publication of JP2005243915A publication Critical patent/JP2005243915A/ja
Application granted granted Critical
Publication of JP4330467B2 publication Critical patent/JP4330467B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C17/00—Roller skates; Skate-boards
    • A63C17/18—Roller skates; Skate-boards convertible into ice or snow-running skates
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C1/00—Skates
    • A63C1/04—Skates fastened by means of clamps
    • A63C1/16—Special structure of the clamp fastening devices
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C1/00—Skates
    • A63C1/22—Skates with special foot-plates of the boot
    • A63C1/26—Skates with special foot-plates of the boot divided into two parts permitting adjustment to the size of the foot
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H01J2237/0225—Detecting or monitoring foreign particles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP2004051706A 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法 Expired - Fee Related JP4330467B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004051706A JP4330467B2 (ja) 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法
TW094105654A TW200534334A (en) 2004-02-26 2005-02-24 Processing apparatus and method for removing particles therefrom
KR1020050015360A KR100635436B1 (ko) 2004-02-26 2005-02-24 프로세스 장치 및 해당 프로세스 장치내의 파티클 제거 방법
US11/065,359 US7347006B2 (en) 2004-02-26 2005-02-25 Processing apparatus and method for removing particles therefrom
CNB2005100529177A CN100349043C (zh) 2004-02-26 2005-02-28 处理装置及该处理装置内的颗粒除去方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004051706A JP4330467B2 (ja) 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法

Publications (2)

Publication Number Publication Date
JP2005243915A JP2005243915A (ja) 2005-09-08
JP4330467B2 true JP4330467B2 (ja) 2009-09-16

Family

ID=34879627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004051706A Expired - Fee Related JP4330467B2 (ja) 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法

Country Status (5)

Country Link
US (1) US7347006B2 (enExample)
JP (1) JP4330467B2 (enExample)
KR (1) KR100635436B1 (enExample)
CN (1) CN100349043C (enExample)
TW (1) TW200534334A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
DE102004044176A1 (de) * 2004-09-13 2006-03-30 BSH Bosch und Siemens Hausgeräte GmbH Trocknungsverfahren für ein Haushaltsgerät und Haushaltsgerät zur Durchführung des Trocknungsverfahren
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
JP5064119B2 (ja) * 2007-06-07 2012-10-31 東京エレクトロン株式会社 真空引き方法及び記憶媒体
US20090086471A1 (en) * 2007-07-30 2009-04-02 Bollman James E Illuminated landscape module for existing edging system
US7473006B1 (en) * 2007-07-30 2009-01-06 James Bollman Illuminated landscape edging system
US7837805B2 (en) * 2007-08-29 2010-11-23 Micron Technology, Inc. Methods for treating surfaces
KR100905213B1 (ko) 2007-09-19 2009-07-01 세메스 주식회사 기판 처리 장치
EP2058427A1 (en) * 2007-11-06 2009-05-13 BSH Electrodomésticos España, S.A. Household appliance having a heat pump unit and means for cooling a component thereof
US8361276B2 (en) * 2008-02-11 2013-01-29 Apjet, Inc. Large area, atmospheric pressure plasma for downstream processing
JP4611409B2 (ja) * 2008-09-03 2011-01-12 晃俊 沖野 プラズマ温度制御装置
JP5121684B2 (ja) * 2008-12-11 2013-01-16 株式会社日立ハイテクノロジーズ プラズマ処理装置
US8591755B2 (en) * 2010-09-15 2013-11-26 Lam Research Corporation Methods for controlling plasma constituent flux and deposition during semiconductor fabrication and apparatus for implementing the same
CN102368466B (zh) * 2011-09-20 2013-11-27 天通吉成机器技术有限公司 一种干法刻蚀坚硬无机材料基板等离子体刻蚀机的电极
KR20150046966A (ko) * 2013-10-23 2015-05-04 삼성디스플레이 주식회사 플라즈마 처리 장치 및 플라즈마 처리 방법
CN104716069B (zh) * 2015-03-23 2017-10-17 上海华力微电子有限公司 晶圆可接受性测试机台内部环境的监测方法和监测装置
CN105097408B (zh) * 2015-07-21 2017-09-26 深圳市华星光电技术有限公司 一种干法刻蚀机台及其使用方法
CN105589232A (zh) * 2016-03-11 2016-05-18 京东方科技集团股份有限公司 一种显示面板加工设备
JP2019169635A (ja) 2018-03-23 2019-10-03 東京エレクトロン株式会社 クリーニング方法及び処理装置
JP7122864B2 (ja) 2018-05-14 2022-08-22 東京エレクトロン株式会社 クリーニング方法及び基板処理装置
JP7462383B2 (ja) 2019-04-15 2024-04-05 東京エレクトロン株式会社 クリーニング方法及びプラズマ処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757297B2 (ja) * 1987-04-22 1995-06-21 日本真空技術株式会社 真空排気系用微粒子トラツプ
US5367139A (en) 1989-10-23 1994-11-22 International Business Machines Corporation Methods and apparatus for contamination control in plasma processing
US5589041A (en) * 1995-06-07 1996-12-31 Sony Corporation Plasma sputter etching system with reduced particle contamination
JP2786144B2 (ja) * 1996-01-30 1998-08-13 九州日本電気株式会社 半導体装置の製造方法
JP3171161B2 (ja) * 1998-03-20 2001-05-28 日本電気株式会社 プラズマエッチング方法及びプラズマエッチング装置
JP2002196367A (ja) * 2000-02-10 2002-07-12 Matsushita Electric Ind Co Ltd 液晶表示装置
JP2001305546A (ja) * 2001-04-09 2001-10-31 Matsushita Electric Ind Co Ltd 液晶表示パネル及びその製造方法
US6811651B2 (en) * 2001-06-22 2004-11-02 Tokyo Electron Limited Gas temperature control for a plasma process

Also Published As

Publication number Publication date
KR100635436B1 (ko) 2006-10-18
KR20060042140A (ko) 2006-05-12
US20050189071A1 (en) 2005-09-01
TWI373787B (enExample) 2012-10-01
CN1661433A (zh) 2005-08-31
JP2005243915A (ja) 2005-09-08
TW200534334A (en) 2005-10-16
US7347006B2 (en) 2008-03-25
CN100349043C (zh) 2007-11-14

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