CN100349043C - 处理装置及该处理装置内的颗粒除去方法 - Google Patents

处理装置及该处理装置内的颗粒除去方法 Download PDF

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Publication number
CN100349043C
CN100349043C CNB2005100529177A CN200510052917A CN100349043C CN 100349043 C CN100349043 C CN 100349043C CN B2005100529177 A CNB2005100529177 A CN B2005100529177A CN 200510052917 A CN200510052917 A CN 200510052917A CN 100349043 C CN100349043 C CN 100349043C
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CN
China
Prior art keywords
temperature
pressure reduction
gas
reduction vessel
inner space
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Expired - Fee Related
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CNB2005100529177A
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English (en)
Chinese (zh)
Other versions
CN1661433A (zh
Inventor
守屋刚
长池宏史
中山博之
奥田喜久夫
岛田学
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN1661433A publication Critical patent/CN1661433A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C17/00—Roller skates; Skate-boards
    • A63C17/18—Roller skates; Skate-boards convertible into ice or snow-running skates
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C1/00—Skates
    • A63C1/04—Skates fastened by means of clamps
    • A63C1/16—Special structure of the clamp fastening devices
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C1/00—Skates
    • A63C1/22—Skates with special foot-plates of the boot
    • A63C1/26—Skates with special foot-plates of the boot divided into two parts permitting adjustment to the size of the foot
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H01J2237/0225—Detecting or monitoring foreign particles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CNB2005100529177A 2004-02-26 2005-02-28 处理装置及该处理装置内的颗粒除去方法 Expired - Fee Related CN100349043C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004051706A JP4330467B2 (ja) 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法
JP200451706 2004-02-26

Publications (2)

Publication Number Publication Date
CN1661433A CN1661433A (zh) 2005-08-31
CN100349043C true CN100349043C (zh) 2007-11-14

Family

ID=34879627

Family Applications (1)

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CNB2005100529177A Expired - Fee Related CN100349043C (zh) 2004-02-26 2005-02-28 处理装置及该处理装置内的颗粒除去方法

Country Status (5)

Country Link
US (1) US7347006B2 (enExample)
JP (1) JP4330467B2 (enExample)
KR (1) KR100635436B1 (enExample)
CN (1) CN100349043C (enExample)
TW (1) TW200534334A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
DE102004044176A1 (de) * 2004-09-13 2006-03-30 BSH Bosch und Siemens Hausgeräte GmbH Trocknungsverfahren für ein Haushaltsgerät und Haushaltsgerät zur Durchführung des Trocknungsverfahren
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
JP5064119B2 (ja) * 2007-06-07 2012-10-31 東京エレクトロン株式会社 真空引き方法及び記憶媒体
US20090086471A1 (en) * 2007-07-30 2009-04-02 Bollman James E Illuminated landscape module for existing edging system
US7473006B1 (en) * 2007-07-30 2009-01-06 James Bollman Illuminated landscape edging system
US7837805B2 (en) * 2007-08-29 2010-11-23 Micron Technology, Inc. Methods for treating surfaces
KR100905213B1 (ko) 2007-09-19 2009-07-01 세메스 주식회사 기판 처리 장치
EP2058427A1 (en) * 2007-11-06 2009-05-13 BSH Electrodomésticos España, S.A. Household appliance having a heat pump unit and means for cooling a component thereof
US8361276B2 (en) * 2008-02-11 2013-01-29 Apjet, Inc. Large area, atmospheric pressure plasma for downstream processing
JP4611409B2 (ja) * 2008-09-03 2011-01-12 晃俊 沖野 プラズマ温度制御装置
JP5121684B2 (ja) * 2008-12-11 2013-01-16 株式会社日立ハイテクノロジーズ プラズマ処理装置
US8591755B2 (en) * 2010-09-15 2013-11-26 Lam Research Corporation Methods for controlling plasma constituent flux and deposition during semiconductor fabrication and apparatus for implementing the same
CN102368466B (zh) * 2011-09-20 2013-11-27 天通吉成机器技术有限公司 一种干法刻蚀坚硬无机材料基板等离子体刻蚀机的电极
KR20150046966A (ko) * 2013-10-23 2015-05-04 삼성디스플레이 주식회사 플라즈마 처리 장치 및 플라즈마 처리 방법
CN104716069B (zh) * 2015-03-23 2017-10-17 上海华力微电子有限公司 晶圆可接受性测试机台内部环境的监测方法和监测装置
CN105097408B (zh) * 2015-07-21 2017-09-26 深圳市华星光电技术有限公司 一种干法刻蚀机台及其使用方法
CN105589232A (zh) * 2016-03-11 2016-05-18 京东方科技集团股份有限公司 一种显示面板加工设备
JP2019169635A (ja) 2018-03-23 2019-10-03 東京エレクトロン株式会社 クリーニング方法及び処理装置
JP7122864B2 (ja) 2018-05-14 2022-08-22 東京エレクトロン株式会社 クリーニング方法及び基板処理装置
JP7462383B2 (ja) 2019-04-15 2024-04-05 東京エレクトロン株式会社 クリーニング方法及びプラズマ処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589041A (en) * 1995-06-07 1996-12-31 Sony Corporation Plasma sputter etching system with reduced particle contamination
JPH09213633A (ja) * 1996-01-30 1997-08-15 Nec Kyushu Ltd 半導体装置の製造方法
US6306770B1 (en) * 1998-03-20 2001-10-23 Nec Corporation Method and apparatus for plasma etching
JP2001305546A (ja) * 2001-04-09 2001-10-31 Matsushita Electric Ind Co Ltd 液晶表示パネル及びその製造方法
JP2002196367A (ja) * 2000-02-10 2002-07-12 Matsushita Electric Ind Co Ltd 液晶表示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757297B2 (ja) * 1987-04-22 1995-06-21 日本真空技術株式会社 真空排気系用微粒子トラツプ
US5367139A (en) 1989-10-23 1994-11-22 International Business Machines Corporation Methods and apparatus for contamination control in plasma processing
US6811651B2 (en) * 2001-06-22 2004-11-02 Tokyo Electron Limited Gas temperature control for a plasma process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589041A (en) * 1995-06-07 1996-12-31 Sony Corporation Plasma sputter etching system with reduced particle contamination
JPH09213633A (ja) * 1996-01-30 1997-08-15 Nec Kyushu Ltd 半導体装置の製造方法
US6306770B1 (en) * 1998-03-20 2001-10-23 Nec Corporation Method and apparatus for plasma etching
JP2002196367A (ja) * 2000-02-10 2002-07-12 Matsushita Electric Ind Co Ltd 液晶表示装置
JP2001305546A (ja) * 2001-04-09 2001-10-31 Matsushita Electric Ind Co Ltd 液晶表示パネル及びその製造方法

Also Published As

Publication number Publication date
KR100635436B1 (ko) 2006-10-18
JP4330467B2 (ja) 2009-09-16
KR20060042140A (ko) 2006-05-12
US20050189071A1 (en) 2005-09-01
TWI373787B (enExample) 2012-10-01
CN1661433A (zh) 2005-08-31
JP2005243915A (ja) 2005-09-08
TW200534334A (en) 2005-10-16
US7347006B2 (en) 2008-03-25

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Granted publication date: 20071114