KR100593709B1 - 기판처리장치 - Google Patents

기판처리장치 Download PDF

Info

Publication number
KR100593709B1
KR100593709B1 KR1020030016824A KR20030016824A KR100593709B1 KR 100593709 B1 KR100593709 B1 KR 100593709B1 KR 1020030016824 A KR1020030016824 A KR 1020030016824A KR 20030016824 A KR20030016824 A KR 20030016824A KR 100593709 B1 KR100593709 B1 KR 100593709B1
Authority
KR
South Korea
Prior art keywords
substrate
liquid
tank
processing
processing liquid
Prior art date
Application number
KR1020030016824A
Other languages
English (en)
Korean (ko)
Other versions
KR20030077980A (ko
Inventor
요시타니미츠아키
야나기사와노부오
도요타코지
야마시타에이지
스즈키사토시
Original Assignee
다이닛뽕스크린 세이조오 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002092463A external-priority patent/JP4050538B2/ja
Priority claimed from JP2003005897A external-priority patent/JP4138504B2/ja
Application filed by 다이닛뽕스크린 세이조오 가부시키가이샤 filed Critical 다이닛뽕스크린 세이조오 가부시키가이샤
Publication of KR20030077980A publication Critical patent/KR20030077980A/ko
Application granted granted Critical
Publication of KR100593709B1 publication Critical patent/KR100593709B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020030016824A 2002-03-27 2003-03-18 기판처리장치 KR100593709B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002087609 2002-03-27
JPJP-P-2002-00087609 2002-03-27
JPJP-P-2002-00092463 2002-03-28
JP2002092463A JP4050538B2 (ja) 2002-03-28 2002-03-28 基板処理装置
JP2003005897A JP4138504B2 (ja) 2002-03-27 2003-01-14 基板処理装置
JPJP-P-2003-00005897 2003-01-14

Publications (2)

Publication Number Publication Date
KR20030077980A KR20030077980A (ko) 2003-10-04
KR100593709B1 true KR100593709B1 (ko) 2006-06-28

Family

ID=28457588

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030016824A KR100593709B1 (ko) 2002-03-27 2003-03-18 기판처리장치

Country Status (3)

Country Link
KR (1) KR100593709B1 (zh)
CN (1) CN1280876C (zh)
TW (1) TWI224369B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1913982B (zh) * 2004-02-18 2012-06-13 川崎重工业株式会社 板材的洗涤设备
CN100397155C (zh) * 2004-06-11 2008-06-25 鸿富锦精密工业（深圳）有限公司 基板处理装置及处理方法
KR100613658B1 (ko) * 2005-04-28 2006-08-22 (주)피스코엔지니어링 페트병용 지지기구
TWI319213B (en) * 2005-11-28 2010-01-01 Hitachi High Tech Corp A substrate processing device, a substrate processing method and a production method for a substrate
KR100923686B1 (ko) * 2007-10-08 2009-10-28 세메스 주식회사 기판 세정 장치
KR100854981B1 (ko) * 2007-10-10 2008-08-28 홍경표 인쇄회로기판 제조공정상의 습식공정 처리장치
CN102184841A (zh) * 2010-12-17 2011-09-14 无锡华润上华半导体有限公司 晶圆代工机台超纯水回收方法及系统
KR101405668B1 (ko) * 2011-12-22 2014-06-10 다이니폰 스크린 세이조우 가부시키가이샤 도포 장치
JP2013191779A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 処理装置および処理方法
CN104282598A (zh) * 2014-09-23 2015-01-14 安徽省大富光电科技有限公司 蚀刻、显影、清洗以及褪膜设备、喷淋处理设备及方法
CN104399701A (zh) * 2014-10-31 2015-03-11 镇江华印电路板有限公司 一种用于电路板印制的抗蚀刻油墨分离系统
CN105914167B (zh) * 2015-02-25 2018-09-04 株式会社思可林集团 基板处理装置
CN105093259B (zh) * 2015-08-14 2018-12-18 京东方科技集团股份有限公司 射线探测器
CN107179654B (zh) * 2016-03-11 2020-12-01 上海和辉光电股份有限公司 Oled面板的显影方法、oled面板以及制造设备
JP7089703B2 (ja) * 2017-12-22 2022-06-23 日本電気硝子株式会社 ガラス板の製造方法
JP7060415B2 (ja) * 2018-03-12 2022-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN108526097A (zh) * 2018-04-28 2018-09-14 武汉华星光电技术有限公司 基板清洗设备

Also Published As

Publication number Publication date
CN1280876C (zh) 2006-10-18
TWI224369B (en) 2004-11-21
CN1447395A (zh) 2003-10-08
KR20030077980A (ko) 2003-10-04
TW200404337A (en) 2004-03-16

Similar Documents

Publication Publication Date Title
KR100593709B1 (ko) 기판처리장치
KR100556626B1 (ko) 기판 처리방법 및 기판 처리장치
US10037901B2 (en) Substrate liquid treatment apparatus, method of cleaning substrate liquid treatment apparatus and non-transitory storage medium
JP6924846B2 (ja) 液供給装置及び液供給方法
JP2013146727A (ja) 塗布装置
JP4138504B2 (ja) 基板処理装置
TW201513189A (zh) 使用改良化學品移除光阻用方法及設備
JPH0799177A (ja) 基板の浸漬処理装置
JP4050538B2 (ja) 基板処理装置
JP2000500242A (ja) フィルム剥離方法
JP2008227195A (ja) 液処理装置
JP3863086B2 (ja) 基板処理装置
TW200540978A (en) Apparatus and method for process substrate
JP2005064312A (ja) 基板処理方法および基板処理装置
JP2004016997A (ja) 基板の処理装置及び処理方法
JP4481865B2 (ja) 現像機におけるスカム除去方法およびその装置
JP6723000B2 (ja) 基板処理装置
TWI681454B (zh) 基板處理裝置及基板處理方法
CN116794941B (zh) 显影装置
KR20080021227A (ko) 세정수 공급장치
JPH11305449A (ja) 基板処理装置
JPH0429054B2 (zh)
JP2001156035A (ja) 基板処理装置及びその隣接処理槽への飛沫の浸入防止方法
JPH09270408A (ja) 基板処理装置
JP2004281597A (ja) 基板処理方法および基板処理装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130531

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20140603

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20150518

Year of fee payment: 10

FPAY Annual fee payment

Payment date: 20160517

Year of fee payment: 11

FPAY Annual fee payment

Payment date: 20170522

Year of fee payment: 12

FPAY Annual fee payment

Payment date: 20180530

Year of fee payment: 13

FPAY Annual fee payment

Payment date: 20190530

Year of fee payment: 14