KR100589753B1 - 웨이퍼 매핑 시스템 - Google Patents

웨이퍼 매핑 시스템 Download PDF

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Publication number
KR100589753B1
KR100589753B1 KR1020017004782A KR20017004782A KR100589753B1 KR 100589753 B1 KR100589753 B1 KR 100589753B1 KR 1020017004782 A KR1020017004782 A KR 1020017004782A KR 20017004782 A KR20017004782 A KR 20017004782A KR 100589753 B1 KR100589753 B1 KR 100589753B1
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KR
South Korea
Prior art keywords
wafer
receiver
port
pod
transmitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020017004782A
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English (en)
Korean (ko)
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KR20010085928A (ko
Inventor
로센퀴스트프레데릭티.
리챠드손브루스
포스나이트윌리엄제이.
보노라안소니씨.
Original Assignee
어사이스트 테크놀로지스, 인코포레이티드
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Application filed by 어사이스트 테크놀로지스, 인코포레이티드 filed Critical 어사이스트 테크놀로지스, 인코포레이티드
Publication of KR20010085928A publication Critical patent/KR20010085928A/ko
Application granted granted Critical
Publication of KR100589753B1 publication Critical patent/KR100589753B1/ko
Assigned to 크로씽 오토메이션, 인코포레이티드 reassignment 크로씽 오토메이션, 인코포레이티드 권리의 전부이전등록 Assignors: 어사이스트 테크놀로지스, 인코포레이티드
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020017004782A 1998-10-15 1999-10-13 웨이퍼 매핑 시스템 Expired - Lifetime KR100589753B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/173,710 1998-10-15
US09/173,710 US6188323B1 (en) 1998-10-15 1998-10-15 Wafer mapping system

Publications (2)

Publication Number Publication Date
KR20010085928A KR20010085928A (ko) 2001-09-07
KR100589753B1 true KR100589753B1 (ko) 2006-06-15

Family

ID=22633178

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017004782A Expired - Lifetime KR100589753B1 (ko) 1998-10-15 1999-10-13 웨이퍼 매핑 시스템

Country Status (6)

Country Link
US (1) US6188323B1 (https=)
EP (1) EP1121672A4 (https=)
JP (1) JP4616477B2 (https=)
KR (1) KR100589753B1 (https=)
TW (1) TW445496B (https=)
WO (1) WO2000022589A1 (https=)

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JP4740414B2 (ja) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
JP4863985B2 (ja) * 2007-12-20 2012-01-25 大日本スクリーン製造株式会社 基板処理装置
KR101571180B1 (ko) * 2007-12-27 2015-11-23 램 리써치 코포레이션 위치 및 오프셋을 결정하는 장치 및 방법
KR101590655B1 (ko) * 2007-12-27 2016-02-18 램 리써치 코포레이션 동적 정렬 빔 교정의 방법 및 시스템
US8954287B2 (en) * 2007-12-27 2015-02-10 Lam Research Corporation Systems and methods for calibrating end effector alignment using at least a light source
US8751047B2 (en) * 2007-12-27 2014-06-10 Lam Research Corporation Systems and methods for calibrating end effector alignment in a plasma processing system
US20100034621A1 (en) * 2008-04-30 2010-02-11 Martin Raymond S End effector to substrate offset detection and correction
JP4488255B2 (ja) * 2008-05-27 2010-06-23 Ｔｄｋ株式会社 密閉容器の蓋開閉システム、当該蓋開閉システムを含む収容物挿脱システム、及び当該蓋開閉システムを用いた基板処理方法
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JP6309756B2 (ja) * 2013-12-26 2018-04-11 川崎重工業株式会社 エンドエフェクタ装置
JP6248788B2 (ja) * 2014-04-28 2017-12-20 シンフォニアテクノロジー株式会社 ウエハマッピング装置およびそれを備えたロードポート
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JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP6697984B2 (ja) * 2016-08-31 2020-05-27 東京エレクトロン株式会社 基板処理方法及び基板処理システム
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Also Published As

Publication number Publication date
KR20010085928A (ko) 2001-09-07
WO2000022589A9 (en) 2000-09-21
EP1121672A1 (en) 2001-08-08
WO2000022589A1 (en) 2000-04-20
TW445496B (en) 2001-07-11
US6188323B1 (en) 2001-02-13
JP4616477B2 (ja) 2011-01-19
EP1121672A4 (en) 2009-05-06
JP2002527897A (ja) 2002-08-27

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