KR100584777B1 - 황화아연을 주성분으로 하는 상변화형 광디스크 보호막 및 이 보호막을 이용한 광 기록매체와 황화아연을 주성분으로하는 스퍼터링 타겟트 및 이 타겟트의 제조방법 - Google Patents
황화아연을 주성분으로 하는 상변화형 광디스크 보호막 및 이 보호막을 이용한 광 기록매체와 황화아연을 주성분으로하는 스퍼터링 타겟트 및 이 타겟트의 제조방법 Download PDFInfo
- Publication number
- KR100584777B1 KR100584777B1 KR1020047012324A KR20047012324A KR100584777B1 KR 100584777 B1 KR100584777 B1 KR 100584777B1 KR 1020047012324 A KR1020047012324 A KR 1020047012324A KR 20047012324 A KR20047012324 A KR 20047012324A KR 100584777 B1 KR100584777 B1 KR 100584777B1
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- KR
- South Korea
- Prior art keywords
- oxide
- zinc sulfide
- target
- sputtering target
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000005083 Zinc sulfide Substances 0.000 title claims abstract description 77
- 229910052984 zinc sulfide Inorganic materials 0.000 title claims abstract description 77
- 230000003287 optical effect Effects 0.000 title claims abstract description 65
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 238000005477 sputtering target Methods 0.000 title claims abstract description 46
- 230000008859 change Effects 0.000 title claims abstract description 44
- 230000001681 protective effect Effects 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 title description 2
- 239000000843 powder Substances 0.000 claims description 23
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 14
- 239000011812 mixed powder Substances 0.000 claims description 12
- 229910003437 indium oxide Inorganic materials 0.000 claims description 8
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011787 zinc oxide Substances 0.000 claims description 7
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 6
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 5
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 5
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 5
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 claims description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 5
- 229910001887 tin oxide Inorganic materials 0.000 claims description 5
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 4
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000002706 hydrostatic effect Effects 0.000 claims description 3
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 3
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 3
- -1 cornium oxide Chemical compound 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 44
- 239000002245 particle Substances 0.000 abstract description 13
- 239000010408 film Substances 0.000 description 64
- 229910004298 SiO 2 Inorganic materials 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 11
- 229910052814 silicon oxide Inorganic materials 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 229910002804 graphite Inorganic materials 0.000 description 10
- 239000010439 graphite Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 229910006404 SnO 2 Inorganic materials 0.000 description 4
- 238000007496 glass forming Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910001392 phosphorus oxide Inorganic materials 0.000 description 3
- VSAISIQCTGDGPU-UHFFFAOYSA-N tetraphosphorus hexaoxide Chemical compound O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- GGCHXCZGMDRXPH-UHFFFAOYSA-N [Si+2]=O.[S-2].[Zn+2].[S-2] Chemical compound [Si+2]=O.[S-2].[Zn+2].[S-2] GGCHXCZGMDRXPH-UHFFFAOYSA-N 0.000 description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052810 boron oxide Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002036154A JP4198918B2 (ja) | 2002-02-14 | 2002-02-14 | 硫化亜鉛を主成分とするスパッタリングターゲット及び該スパッタリングターゲットの製造方法 |
| JPJP-P-2002-00036154 | 2002-02-14 | ||
| PCT/JP2002/012964 WO2003069612A1 (fr) | 2002-02-14 | 2002-12-11 | Cible de pulverisation contenant du sulfure de zinc comme composant principal, support d'enregistrement optique sur lequel un film protecteur de disque optique a transitions de phase contenant du sulfure de zinc en tant que composant principal est forme par utilisation de la cible et procede de fabrication d'une telle cible |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040078694A KR20040078694A (ko) | 2004-09-10 |
| KR100584777B1 true KR100584777B1 (ko) | 2006-05-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020047012324A Expired - Lifetime KR100584777B1 (ko) | 2002-02-14 | 2002-12-11 | 황화아연을 주성분으로 하는 상변화형 광디스크 보호막 및 이 보호막을 이용한 광 기록매체와 황화아연을 주성분으로하는 스퍼터링 타겟트 및 이 타겟트의 제조방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7279211B2 (enExample) |
| EP (1) | EP1475795B1 (enExample) |
| JP (1) | JP4198918B2 (enExample) |
| KR (1) | KR100584777B1 (enExample) |
| CN (1) | CN1296924C (enExample) |
| TW (1) | TW200302874A (enExample) |
| WO (1) | WO2003069612A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4611198B2 (ja) * | 2003-03-04 | 2011-01-12 | Ｊｘ日鉱日石金属株式会社 | 光情報記録媒体用の非晶質性保護膜を形成するためのスパッタリングターゲット、光情報記録媒体用の非晶質性保護膜及びその製造方法 |
| EP1602746B1 (en) * | 2003-03-04 | 2008-10-08 | Nippon Mining & Metals Co., Ltd. | Sputtering target and process for producing the same, thin film for optical information recording medium and process for producing the same |
| JP4430014B2 (ja) * | 2003-09-30 | 2010-03-10 | 日鉱金属株式会社 | 高純度酸化亜鉛粉末の製造方法 |
| JP4136980B2 (ja) * | 2004-03-19 | 2008-08-20 | 株式会社リコー | 多層相変化型情報記録媒体及びその記録再生方法 |
| JP4794863B2 (ja) * | 2005-01-21 | 2011-10-19 | Ｊｘ日鉱日石金属株式会社 | スパッタリングターゲット及び光情報記録媒体用薄膜 |
| TW200639848A (en) * | 2005-02-01 | 2006-11-16 | Fuji Photo Film Co Ltd | Optical information recording medium and manufacturing method thereof |
| KR20080021111A (ko) * | 2005-06-23 | 2008-03-06 | 닛코킨조쿠 가부시키가이샤 | 스퍼터링 타겟트 및 광 정보기록매체용 박막 |
| US7686985B2 (en) * | 2005-06-28 | 2010-03-30 | Nippon Mining & Metals Co., Ltd | Gallium oxide-zinc oxide sputtering target, method of forming transparent conductive film, and transparent conductive film |
| KR101004981B1 (ko) * | 2005-06-28 | 2011-01-04 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 산화갈륨-산화아연계 스퍼터링 타겟, 투명 도전막의 형성방법 및 투명 도전막 |
| JP5058469B2 (ja) * | 2005-09-06 | 2012-10-24 | キヤノン株式会社 | スパッタリングターゲットおよび該ターゲットを用いた薄膜の形成方法 |
| CN101326304B (zh) * | 2005-12-08 | 2011-05-04 | Jx日矿日石金属株式会社 | 氧化镓-氧化锌类溅射靶、透明导电膜及其形成方法 |
| CN101405427B (zh) * | 2006-03-17 | 2012-07-18 | Jx日矿日石金属株式会社 | 氧化锌系透明导体以及该透明导体形成用溅射靶 |
| CN101490766B (zh) * | 2006-08-24 | 2011-11-30 | Jx日矿日石金属株式会社 | 氧化锌系透明导体、溅射靶以及该溅射靶的制造方法 |
| US7687990B2 (en) * | 2007-04-12 | 2010-03-30 | Global Oled Technology Llc | OLED device with short reduction |
| US20090220680A1 (en) * | 2008-02-29 | 2009-09-03 | Winters Dustin L | Oled device with short reduction |
| EP2110694B1 (en) * | 2008-04-18 | 2013-08-14 | Sony DADC Austria AG | Method for manufacturing an optical waveguide, optical waveguide, and sensor arrangement |
| JP5160602B2 (ja) * | 2010-09-02 | 2013-03-13 | Ｊｘ日鉱日石金属株式会社 | スパッタリングターゲット及び光情報記録媒体用薄膜 |
| JP2015504479A (ja) | 2011-11-08 | 2015-02-12 | トーソー エスエムディー，インク． | 特別な表面処理及び優れた粒子性能を有するシリコンスパッターターゲット及びその製造方法 |
| JP5896121B2 (ja) * | 2012-01-13 | 2016-03-30 | 三菱マテリアル株式会社 | 酸化物スパッタリングターゲット及び光記録媒体用保護膜 |
| JP5954620B2 (ja) * | 2012-04-04 | 2016-07-20 | 三菱マテリアル株式会社 | 透明酸化物膜形成用スパッタリングターゲット及びその製造方法 |
| JP5883368B2 (ja) | 2012-09-14 | 2016-03-15 | 株式会社コベルコ科研 | 酸化物焼結体およびスパッタリングターゲット |
| JP5883367B2 (ja) | 2012-09-14 | 2016-03-15 | 株式会社コベルコ科研 | 酸化物焼結体およびスパッタリングターゲット、並びにその製造方法 |
| JP6134368B2 (ja) * | 2015-10-19 | 2017-05-24 | Ｊｘ金属株式会社 | 焼結体及び該焼結体からなるスパッタリングターゲット並びに該スパッタリングターゲットを用いて形成した薄膜 |
| CN114890785A (zh) * | 2022-05-31 | 2022-08-12 | 先导薄膜材料（广东）有限公司 | 一种硫氧锌靶材及其制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CS163590A3 (en) * | 1989-04-06 | 1992-06-17 | Mitsui Petrochemical Ind | Optical recording medium and process for producing thereof |
| US5635310A (en) * | 1989-10-20 | 1997-06-03 | Casio Computer Co., Ltd. | ZnS dielectric thin film and magnetic recording medium |
| JP3190274B2 (ja) * | 1996-12-28 | 2001-07-23 | ティーディーケイ株式会社 | 光記録媒体およびその製造方法 |
| JP3636914B2 (ja) * | 1998-02-16 | 2005-04-06 | 株式会社日鉱マテリアルズ | 高抵抗透明導電膜及び高抵抗透明導電膜の製造方法並びに高抵抗透明導電膜形成用スパッタリングターゲット |
| JP3692776B2 (ja) * | 1998-05-21 | 2005-09-07 | 三菱化学株式会社 | 光学的情報記録用媒体およびその製造方法 |
| JP3533333B2 (ja) * | 1998-08-21 | 2004-05-31 | Ｔｄｋ株式会社 | 光記録媒体の干渉膜用スパッタリングターゲットおよびその製造方法 |
| JP4030205B2 (ja) * | 1998-10-26 | 2008-01-09 | 日立マクセル株式会社 | 情報記録媒体及び情報記録装置 |
| JP3894403B2 (ja) * | 1999-07-01 | 2007-03-22 | 日鉱金属株式会社 | 光ディスク保護膜形成スパッタリングターゲット |
| JP3915109B2 (ja) * | 1999-09-28 | 2007-05-16 | 三菱マテリアル株式会社 | 光記録媒体保護層形成用スパッタリングターゲット材 |
| US6656260B2 (en) * | 1999-12-28 | 2003-12-02 | Kyocera Corporation | ZnS-series sintered material and method for producing the same, target using the ZnS-series sintered material, thin film, and optical recording medium using the thin film |
| JP3882186B2 (ja) * | 2000-01-06 | 2007-02-14 | 三菱マテリアル株式会社 | 直流スパッタリング可能な光記録保護膜形成用スパッタリングターゲット |
| JP2001316804A (ja) * | 2000-05-08 | 2001-11-16 | Mitsubishi Materials Corp | 直流スパッタリング可能でかつ異常放電の少ない光記録保護膜形成用スパッタリングターゲット |
| JP2001355065A (ja) * | 2000-06-13 | 2001-12-25 | Mitsubishi Materials Corp | 直流スパッタ条件下で優れた耐割損性を発揮する光記録媒体保護膜形成用スパッタリングターゲット |
| JP4033286B2 (ja) * | 2001-03-19 | 2008-01-16 | 日本板硝子株式会社 | 高屈折率誘電体膜とその製造方法 |
| JP2004071079A (ja) * | 2002-08-08 | 2004-03-04 | Hitachi Ltd | 情報記録媒体 |
| JP2005302261A (ja) * | 2004-03-19 | 2005-10-27 | Ricoh Co Ltd | 光記録媒体 |
-
2002
- 2002-02-14 JP JP2002036154A patent/JP4198918B2/ja not_active Expired - Lifetime
- 2002-12-11 US US10/503,296 patent/US7279211B2/en not_active Expired - Lifetime
- 2002-12-11 WO PCT/JP2002/012964 patent/WO2003069612A1/ja not_active Ceased
- 2002-12-11 KR KR1020047012324A patent/KR100584777B1/ko not_active Expired - Lifetime
- 2002-12-11 EP EP02788788A patent/EP1475795B1/en not_active Expired - Lifetime
- 2002-12-11 CN CNB028280970A patent/CN1296924C/zh not_active Expired - Lifetime
- 2002-12-12 TW TW091135935A patent/TW200302874A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003242684A (ja) | 2003-08-29 |
| JP4198918B2 (ja) | 2008-12-17 |
| EP1475795B1 (en) | 2012-10-10 |
| TW200302874A (en) | 2003-08-16 |
| US20050084799A1 (en) | 2005-04-21 |
| TWI293067B (enExample) | 2008-02-01 |
| CN1620692A (zh) | 2005-05-25 |
| US7279211B2 (en) | 2007-10-09 |
| CN1296924C (zh) | 2007-01-24 |
| EP1475795A1 (en) | 2004-11-10 |
| KR20040078694A (ko) | 2004-09-10 |
| WO2003069612A1 (fr) | 2003-08-21 |
| EP1475795A4 (en) | 2007-07-25 |
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