KR100553480B1 - 단일방향도전성커플러층을가지는정전척및그제조방법 - Google Patents
단일방향도전성커플러층을가지는정전척및그제조방법 Download PDFInfo
- Publication number
- KR100553480B1 KR100553480B1 KR1019980010679A KR19980010679A KR100553480B1 KR 100553480 B1 KR100553480 B1 KR 100553480B1 KR 1019980010679 A KR1019980010679 A KR 1019980010679A KR 19980010679 A KR19980010679 A KR 19980010679A KR 100553480 B1 KR100553480 B1 KR 100553480B1
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- contact surface
- electrical contact
- electrode
- unidirectional conductive
- chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
- C23C16/45521—Inert gas curtains the gas, other than thermal contact gas, being introduced the rear of the substrate to flow around its periphery
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
Claims (10)
- 처리 챔버 내에 기판을 고정시키기 위한 정전척으로서, 상기 정전척을 충전시키기 위한 전압 공급 단자를 상기 처리 챔버가 가지며, 전하를 전극으로 흐르게 하기 위한 전기 접촉면과 전기적으로 절연된 고정면에 의해 덮인 전극을 가지는 정전부재를 포함하는 정전척에 있어서,단일 방향 도전성 커플러가 전기 접촉면에 전기적으로 결합되어, 전압 공급 단자부터 전기 접촉면까지 한 방향으로만 전하를 도전시킴으로써 전극을 충전시키는 것을 특징으로 하는, 정전척.
- 제 1항에 있어서,전기 접촉면에 직교하는 주 도전 축(primary conduction axis)을 가지는 이방성 도전 층(anisotropic conductive layer)을 상기 단일 방향 도전성 커플러가 포함하는 것을 특징으로 하는, 정전척.
- 제 2항에 있어서,전기 접촉면에 수직인 방향으로는 0.1 밀리오옴 이상인 제 1 도전율, 및 전기 접촉면에 평행한 평면 내에는 1× 108 밀리오옴 이상인 제 2 도전율을 상기 단일 방향 도전성 커플러가 포함하는 것을 특징으로 하는, 정전척.
- 제 3항에 있어서,상기 단일 방향 도전성 커플러가 25 암페어 이상의 전류 운반 용량을 포함하는 것을 특징으로 하는, 정전척.
- 제 1항에 있어서, 상기 단일 방향 도전성 커플러가 전기 접촉면에 접합되는 것을 특징으로 하는 정전척.
- 처리 챔버 내에서 기판을 고정하는 정전척을 제조하는 방법으로서, 상기 챔버는 정전척을 충전시키기 위한 전압 공급 단자를 가지며,(a) 전기 접촉면을 가지며 전기적으로 절연된 고정면에 의해 덮이는 전극을 포함하는 정전부재를 형성하는 단계; 및(b) 단일 방향 도전성 커플러를 상기 전기 접촉면에 전기적으로 결합시켜, 전압 공급 단자부터 전기 접촉면을 향해 한 방향으로만 전하를 도전시킴으로써 전극을 충전시키는 단계를 포함하는 것을 특징으로 하는, 정전척 제조방법.
- 제 6항에 있어서,상기 전기 접촉면에 이방성 도전 재료층을 도포하여, 전기 접촉면과 직교하는 주 도전 축을 가지는 단일 방향 도전성 커플러를 형성하는 단계를 상기 단계(b)가 포함하는 것을 특징으로 하는, 정전척 제조방법.
- 제 7항에 있어서,상기 단계(b)에서 전기 접촉면에 직교하는 방향으로 적어도 약 0.1밀리오옴인 제 1 도전율, 및 전기 접촉면의 평면에 평행한 적어도 약 1× 108 밀리오옴의 제 2 도전율을 상기 단일 방향 도전성 커플러가 포함하는 것을 특징으로 하는, 정전척 제조방법.
- 제 6항에 있어서, 단일 방향 도전성 커플러를 전기 접촉면에 접합시키는 단계를 상기 단계(b)가 포함하는 것을 특징으로 하는, 정전척 제조방법.
- 제 6 항에 있어서, 상기 단계(b)가,(ⅰ) 상기 전기 접촉면에 단일 방향 도전성 재료의 층을 도포하는 단계;(ⅱ) 상기 단일 방향 도전 층에 접속기의 계면을 위치시키는 단계; 및(ⅲ) 상기 단일 방향 도전 층에 압력을 인가면서, 상기 단일 방향 도전성 커플러가 상기 전기 접촉면 및 계면 양쪽에 접합 가능한 온도로, 상기 단일 방향 도전 층을 가열하는 단계를 포함하는 것을 특징으로 하는, 정전척 제조방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8/829,711 | 1997-03-28 | ||
US08/829,711 US5801915A (en) | 1994-01-31 | 1997-03-28 | Electrostatic chuck having a unidirectionally conducting coupler layer |
US08/829,711 | 1997-03-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19980080766A KR19980080766A (ko) | 1998-11-25 |
KR100553480B1 true KR100553480B1 (ko) | 2006-08-30 |
Family
ID=25255336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019980010679A KR100553480B1 (ko) | 1997-03-28 | 1998-03-27 | 단일방향도전성커플러층을가지는정전척및그제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5801915A (ko) |
EP (1) | EP0867933A3 (ko) |
JP (1) | JP4150099B2 (ko) |
KR (1) | KR100553480B1 (ko) |
TW (1) | TW399281B (ko) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
JP3790000B2 (ja) * | 1997-01-27 | 2006-06-28 | 日本碍子株式会社 | セラミックス部材と電力供給用コネクターとの接合構造 |
US6104596A (en) * | 1998-04-21 | 2000-08-15 | Applied Materials, Inc. | Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same |
US6072685A (en) * | 1998-05-22 | 2000-06-06 | Applied Materials, Inc. | Electrostatic chuck having an electrical connector with housing |
US6151203A (en) * | 1998-12-14 | 2000-11-21 | Applied Materials, Inc. | Connectors for an electrostatic chuck and combination thereof |
TW574412B (en) * | 1999-09-09 | 2004-02-01 | Ishikawajima Harima Heavy Ind | Internal electrode type plasma processing apparatus and plasma processing method |
US6490144B1 (en) * | 1999-11-29 | 2002-12-03 | Applied Materials, Inc. | Support for supporting a substrate in a process chamber |
US6494958B1 (en) * | 2000-06-29 | 2002-12-17 | Applied Materials Inc. | Plasma chamber support with coupled electrode |
WO2002070142A1 (en) * | 2000-12-06 | 2002-09-12 | Angstron Systems, Inc. | Method and apparatus for improved temperature control in atomic layer deposition |
US20020144786A1 (en) * | 2001-04-05 | 2002-10-10 | Angstron Systems, Inc. | Substrate temperature control in an ALD reactor |
US6483690B1 (en) * | 2001-06-28 | 2002-11-19 | Lam Research Corporation | Ceramic electrostatic chuck assembly and method of making |
JP4625204B2 (ja) * | 2001-07-02 | 2011-02-02 | ウチヤ・サーモスタット株式会社 | 安全装置付き電源コード |
JP3962661B2 (ja) * | 2002-08-30 | 2007-08-22 | 三菱重工業株式会社 | 静電チャック支持機構及び支持台装置及びプラズマ処理装置 |
US7691958B2 (en) * | 2004-11-25 | 2010-04-06 | Prime Polymer Co., Ltd. | Polypropylene and application of said polypropylene to electric material |
KR100716455B1 (ko) * | 2005-02-24 | 2007-05-10 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
KR100940549B1 (ko) * | 2005-04-28 | 2010-02-10 | 신에츠 엔지니어링 가부시키가이샤 | 정전척 장치 |
KR101553423B1 (ko) | 2007-12-19 | 2015-09-15 | 램 리써치 코포레이션 | 반도체 진공 프로세싱 장치용 필름 점착제 |
MY166000A (en) | 2007-12-19 | 2018-05-21 | Lam Res Corp | A composite showerhead electrode assembly for a plasma processing apparatus |
US9105705B2 (en) * | 2011-03-14 | 2015-08-11 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
US9076831B2 (en) * | 2011-11-04 | 2015-07-07 | Lam Research Corporation | Substrate clamping system and method for operating the same |
JP2014138164A (ja) * | 2013-01-18 | 2014-07-28 | Sumitomo Osaka Cement Co Ltd | 静電チャック装置 |
JP6277015B2 (ja) * | 2014-02-28 | 2018-02-07 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
JP6424049B2 (ja) * | 2014-09-12 | 2018-11-14 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
TWI787702B (zh) * | 2016-10-03 | 2022-12-21 | 美商應用材料股份有限公司 | 使用pvd釕的方法與裝置 |
CN118412315A (zh) * | 2017-06-16 | 2024-07-30 | 周星工程股份有限公司 | 基板处理装置和用于真空的旋转电连接器 |
FR3073322B1 (fr) * | 2017-11-07 | 2021-12-03 | Commissariat Energie Atomique | Procede de realisation d'au moins un circuit electronique courbe |
CN110914971B (zh) * | 2018-04-05 | 2023-04-28 | 朗姆研究公司 | 有冷却气体区域和相应槽及单极静电夹持电极模式的静电卡盘 |
US20190371577A1 (en) * | 2018-05-31 | 2019-12-05 | Applied Materials, Inc. | Extreme uniformity heated substrate support assembly |
JP6587223B1 (ja) * | 2018-07-30 | 2019-10-09 | Toto株式会社 | 静電チャック |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3983401A (en) * | 1975-03-13 | 1976-09-28 | Electron Beam Microfabrication Corporation | Method and apparatus for target support in electron projection systems |
US4184188A (en) * | 1978-01-16 | 1980-01-15 | Veeco Instruments Inc. | Substrate clamping technique in IC fabrication processes |
US4384918A (en) * | 1980-09-30 | 1983-05-24 | Fujitsu Limited | Method and apparatus for dry etching and electrostatic chucking device used therein |
JPS57149734A (en) * | 1981-03-12 | 1982-09-16 | Anelva Corp | Plasma applying working device |
GB2106325A (en) * | 1981-09-14 | 1983-04-07 | Philips Electronic Associated | Electrostatic chuck |
JPS6059104B2 (ja) * | 1982-02-03 | 1985-12-23 | 株式会社東芝 | 静電チヤツク板 |
JPS5929435A (ja) * | 1982-08-11 | 1984-02-16 | Hitachi Ltd | 試料支持装置 |
US4778326A (en) * | 1983-05-24 | 1988-10-18 | Vichem Corporation | Method and means for handling semiconductor and similar electronic devices |
JPS6060060A (ja) * | 1983-09-12 | 1985-04-06 | 株式会社日立製作所 | 鉄道車両の扉開閉装置 |
GB2147459A (en) * | 1983-09-30 | 1985-05-09 | Philips Electronic Associated | Electrostatic chuck for semiconductor wafers |
JPS6131636U (ja) * | 1984-07-31 | 1986-02-26 | 株式会社 徳田製作所 | 静電チヤツク |
JPS6156842A (ja) * | 1984-08-27 | 1986-03-22 | Kokusai Electric Co Ltd | 静電吸着板 |
JPS61192435A (ja) * | 1985-02-21 | 1986-08-27 | Canon Inc | 静電吸着保持装置 |
JPS6331732A (ja) * | 1986-07-26 | 1988-02-10 | Idemitsu Petrochem Co Ltd | 容器類の熱成形方法 |
JPS6372877A (ja) * | 1986-09-12 | 1988-04-02 | Tokuda Seisakusho Ltd | 真空処理装置 |
US4724510A (en) * | 1986-12-12 | 1988-02-09 | Tegal Corporation | Electrostatic wafer clamp |
US4832781A (en) * | 1988-01-07 | 1989-05-23 | Varian Associates, Inc. | Methods and apparatus for thermal transfer with a semiconductor wafer in vacuum |
KR900701042A (ko) * | 1988-02-05 | 1990-08-17 | 원본미기재 | 단축 도전 물품의 이용 |
ATE95513T1 (de) * | 1988-04-26 | 1993-10-15 | Toto Ltd | Verfahren zur herstellung dielektrischer keramik fuer elektrostatische haltevorrichtungen. |
JPH01298721A (ja) * | 1988-05-27 | 1989-12-01 | Tokuda Seisakusho Ltd | 真空処理装置 |
JPH0227748A (ja) * | 1988-07-16 | 1990-01-30 | Tomoegawa Paper Co Ltd | 静電チャック装置及びその作成方法 |
JP2665242B2 (ja) * | 1988-09-19 | 1997-10-22 | 東陶機器株式会社 | 静電チャック |
US5049421A (en) * | 1989-01-30 | 1991-09-17 | Dresser Industries, Inc. | Transducer glass bonding technique |
US5338827A (en) * | 1990-01-30 | 1994-08-16 | Trw Inc. | Polyimide resins useful at high temperatures |
JP3129452B2 (ja) * | 1990-03-13 | 2001-01-29 | 富士電機株式会社 | 静電チャック |
JPH03286834A (ja) * | 1990-04-03 | 1991-12-17 | Nippon Plast Co Ltd | 芯材に表皮体を貼着する方法 |
JPH03286835A (ja) * | 1990-04-03 | 1991-12-17 | Nippon Plast Co Ltd | 成形品の加飾方法 |
FR2661039B1 (fr) * | 1990-04-12 | 1997-04-30 | Commissariat Energie Atomique | Porte-substrat electrostatique. |
US4999507A (en) * | 1990-05-10 | 1991-03-12 | At&T Bell Laboratories | Apparatus comprising an electrostatic wafer cassette |
US5452177A (en) * | 1990-06-08 | 1995-09-19 | Varian Associates, Inc. | Electrostatic wafer clamp |
US5255153A (en) * | 1990-07-20 | 1993-10-19 | Tokyo Electron Limited | Electrostatic chuck and plasma apparatus equipped therewith |
JP3101354B2 (ja) * | 1990-07-20 | 2000-10-23 | 東京エレクトロン株式会社 | 静電チャック及びこの静電チャックを備えたプラズマ装置 |
JPH0478133A (ja) * | 1990-07-20 | 1992-03-12 | Tokyo Electron Ltd | プラズマ処理装置 |
US5055964A (en) * | 1990-09-07 | 1991-10-08 | International Business Machines Corporation | Electrostatic chuck having tapered electrodes |
JPH04163878A (ja) * | 1990-10-29 | 1992-06-09 | Yokogawa Medical Syst Ltd | 多芯ケーブルの接続方法 |
US5280156A (en) * | 1990-12-25 | 1994-01-18 | Ngk Insulators, Ltd. | Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means |
US5166856A (en) * | 1991-01-31 | 1992-11-24 | International Business Machines Corporation | Electrostatic chuck with diamond coating |
US5155652A (en) * | 1991-05-02 | 1992-10-13 | International Business Machines Corporation | Temperature cycling ceramic electrostatic chuck |
US5191506A (en) * | 1991-05-02 | 1993-03-02 | International Business Machines Corporation | Ceramic electrostatic chuck |
US5184398A (en) * | 1991-08-30 | 1993-02-09 | Texas Instruments Incorporated | In-situ real-time sheet resistance measurement method |
JPH0569489A (ja) * | 1991-09-11 | 1993-03-23 | Araco Corp | 凹面シートカバー構造 |
US5275683A (en) * | 1991-10-24 | 1994-01-04 | Tokyo Electron Limited | Mount for supporting substrates and plasma processing apparatus using the same |
US5207437A (en) * | 1991-10-29 | 1993-05-04 | International Business Machines Corporation | Ceramic electrostatic wafer chuck |
JPH05166757A (ja) * | 1991-12-13 | 1993-07-02 | Tokyo Electron Ltd | 被処理体の温調装置 |
US5213349A (en) * | 1991-12-18 | 1993-05-25 | Elliott Joe C | Electrostatic chuck |
US5315473A (en) * | 1992-01-21 | 1994-05-24 | Applied Materials, Inc. | Isolated electrostatic chuck and excitation method |
JP2865472B2 (ja) * | 1992-02-20 | 1999-03-08 | 信越化学工業株式会社 | 静電チャック |
JPH0634283A (ja) * | 1992-06-16 | 1994-02-08 | Ishikawajima Harima Heavy Ind Co Ltd | 宇宙用熱交換器の製作方法 |
US5348497A (en) * | 1992-08-14 | 1994-09-20 | Applied Materials, Inc. | High voltage vaccum feed-through electrical connector |
US5460684A (en) * | 1992-12-04 | 1995-10-24 | Tokyo Electron Limited | Stage having electrostatic chuck and plasma processing apparatus using same |
KR100238629B1 (ko) * | 1992-12-17 | 2000-01-15 | 히가시 데쓰로 | 정전척을 가지는 재치대 및 이것을 이용한 플라즈마 처리장치 |
KR100260587B1 (ko) * | 1993-06-01 | 2000-08-01 | 히가시 데쓰로 | 정전척 및 그의 제조방법 |
JPH07161803A (ja) * | 1993-12-08 | 1995-06-23 | Tokyo Electron Ltd | アルミニウム部材とポリベンズイミダゾール部材との接合方法、静電チャックの電極構造およびその製造方法 |
US5646814A (en) * | 1994-07-15 | 1997-07-08 | Applied Materials, Inc. | Multi-electrode electrostatic chuck |
US5548470A (en) * | 1994-07-19 | 1996-08-20 | International Business Machines Corporation | Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity |
US5528451A (en) * | 1994-11-02 | 1996-06-18 | Applied Materials, Inc | Erosion resistant electrostatic chuck |
US5691876A (en) * | 1995-01-31 | 1997-11-25 | Applied Materials, Inc. | High temperature polyimide electrostatic chuck |
US5671116A (en) * | 1995-03-10 | 1997-09-23 | Lam Research Corporation | Multilayered electrostatic chuck and method of manufacture thereof |
-
1997
- 1997-03-28 US US08/829,711 patent/US5801915A/en not_active Expired - Lifetime
-
1998
- 1998-02-23 EP EP98301298A patent/EP0867933A3/en not_active Withdrawn
- 1998-03-04 TW TW087103170A patent/TW399281B/zh not_active IP Right Cessation
- 1998-03-27 KR KR1019980010679A patent/KR100553480B1/ko not_active IP Right Cessation
- 1998-03-30 JP JP08421398A patent/JP4150099B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4150099B2 (ja) | 2008-09-17 |
TW399281B (en) | 2000-07-21 |
US5801915A (en) | 1998-09-01 |
KR19980080766A (ko) | 1998-11-25 |
JPH10313048A (ja) | 1998-11-24 |
EP0867933A3 (en) | 2000-03-15 |
EP0867933A2 (en) | 1998-09-30 |
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