KR100538699B1 - 절단기 - Google Patents

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Publication number
KR100538699B1
KR100538699B1 KR10-2001-0033254A KR20010033254A KR100538699B1 KR 100538699 B1 KR100538699 B1 KR 100538699B1 KR 20010033254 A KR20010033254 A KR 20010033254A KR 100538699 B1 KR100538699 B1 KR 100538699B1
Authority
KR
South Korea
Prior art keywords
cutting
workpiece
area
cassette
cleaning
Prior art date
Application number
KR10-2001-0033254A
Other languages
English (en)
Korean (ko)
Other versions
KR20020017936A (ko
Inventor
우마하시타카유키
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20020017936A publication Critical patent/KR20020017936A/ko
Application granted granted Critical
Publication of KR100538699B1 publication Critical patent/KR100538699B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
KR10-2001-0033254A 2000-06-16 2001-06-13 절단기 KR100538699B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000180940A JP4616969B2 (ja) 2000-06-16 2000-06-16 切断機
JP2000-180940 2000-06-16

Publications (2)

Publication Number Publication Date
KR20020017936A KR20020017936A (ko) 2002-03-07
KR100538699B1 true KR100538699B1 (ko) 2005-12-23

Family

ID=18681938

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-0033254A KR100538699B1 (ko) 2000-06-16 2001-06-13 절단기

Country Status (3)

Country Link
JP (1) JP4616969B2 (ja)
KR (1) KR100538699B1 (ja)
IL (1) IL143723A0 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG97193A1 (en) * 2000-08-28 2003-07-18 Disco Corp Cutting machine
JP6061529B2 (ja) * 2012-07-24 2017-01-18 株式会社ディスコ 搬送機構
JP6560110B2 (ja) * 2015-11-30 2019-08-14 株式会社ディスコ 切削装置
CN106404800B (zh) * 2016-11-02 2019-08-30 北京中电科电子装备有限公司 一种划片机视觉切换控制系统及划片机
CN112692886A (zh) * 2020-12-10 2021-04-23 深圳市腾盛精密装备股份有限公司 一种全自动精密切割机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2688623B2 (ja) * 1992-05-11 1997-12-10 株式会社ディスコ ダイシング装置
JPH06140504A (ja) * 1992-10-23 1994-05-20 Deisuko Eng Service:Kk ブレーキングマシーン及びそれを装着したダイシング装置
JPH06181257A (ja) * 1992-11-24 1994-06-28 Disco Abrasive Syst Ltd ダイシング装置
JPH07164273A (ja) * 1993-12-16 1995-06-27 Deisuko Eng Service:Kk ２層テーブルを有する搬出入装置
JP3493282B2 (ja) * 1997-07-02 2004-02-03 株式会社ディスコ 切削方法
JPH11204461A (ja) * 1998-01-09 1999-07-30 Disco Abrasive Syst Ltd フレーム位置決め装置及びフレーム位置決め方法
JP4447074B2 (ja) * 1999-06-21 2010-04-07 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
JP4616969B2 (ja) 2011-01-19
IL143723A0 (en) 2002-04-21
KR20020017936A (ko) 2002-03-07
JP2001358093A (ja) 2001-12-26

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