IL143723A0 - Cutting machine - Google Patents

Cutting machine

Info

Publication number
IL143723A0
IL143723A0 IL14372301A IL14372301A IL143723A0 IL 143723 A0 IL143723 A0 IL 143723A0 IL 14372301 A IL14372301 A IL 14372301A IL 14372301 A IL14372301 A IL 14372301A IL 143723 A0 IL143723 A0 IL 143723A0
Authority
IL
Israel
Prior art keywords
cutting machine
cutting
machine
Prior art date
Application number
IL14372301A
Other languages
English (en)
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of IL143723A0 publication Critical patent/IL143723A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
IL14372301A 2000-06-16 2001-06-13 Cutting machine IL143723A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000180940A JP4616969B2 (ja) 2000-06-16 2000-06-16 切断機

Publications (1)

Publication Number Publication Date
IL143723A0 true IL143723A0 (en) 2002-04-21

Family

ID=18681938

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14372301A IL143723A0 (en) 2000-06-16 2001-06-13 Cutting machine

Country Status (3)

Country Link
JP (1) JP4616969B2 (ja)
KR (1) KR100538699B1 (ja)
IL (1) IL143723A0 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG97193A1 (en) * 2000-08-28 2003-07-18 Disco Corp Cutting machine
JP6061529B2 (ja) * 2012-07-24 2017-01-18 株式会社ディスコ 搬送機構
JP6560110B2 (ja) * 2015-11-30 2019-08-14 株式会社ディスコ 切削装置
CN106404800B (zh) * 2016-11-02 2019-08-30 北京中电科电子装备有限公司 一种划片机视觉切换控制系统及划片机
CN112692886A (zh) * 2020-12-10 2021-04-23 深圳市腾盛精密装备股份有限公司 一种全自动精密切割机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2688623B2 (ja) * 1992-05-11 1997-12-10 株式会社ディスコ ダイシング装置
JPH06140504A (ja) * 1992-10-23 1994-05-20 Deisuko Eng Service:Kk ブレーキングマシーン及びそれを装着したダイシング装置
JPH06181257A (ja) * 1992-11-24 1994-06-28 Disco Abrasive Syst Ltd ダイシング装置
JPH07164273A (ja) * 1993-12-16 1995-06-27 Deisuko Eng Service:Kk ２層テーブルを有する搬出入装置
JP3493282B2 (ja) * 1997-07-02 2004-02-03 株式会社ディスコ 切削方法
JPH11204461A (ja) * 1998-01-09 1999-07-30 Disco Abrasive Syst Ltd フレーム位置決め装置及びフレーム位置決め方法
JP4447074B2 (ja) * 1999-06-21 2010-04-07 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
JP4616969B2 (ja) 2011-01-19
KR20020017936A (ko) 2002-03-07
KR100538699B1 (ko) 2005-12-23
JP2001358093A (ja) 2001-12-26

Similar Documents

Publication Publication Date Title
HK1052895A1 (en) Cutting machine
SG107101A1 (en) Cutting machine
HUP0302634A3 (en) Machine tool
SG85193A1 (en) Cutting machine
HUP0400547A2 (en) Cutting tool
EP1334799A4 (en) MACHINE TOOL
EP1329282A4 (en) MACHINE TOOL
TW405468U (en) Cutting saw machine
GB0003258D0 (en) Cutting tool
GB0215333D0 (en) Slicing machine
HK1054122A1 (zh) 切削機
GB2367475B (en) Lawncare machines
SG97193A1 (en) Cutting machine
GB0103650D0 (en) Cutting machine
PL361340A1 (en) Tube-filling machine
IL143723A0 (en) Cutting machine
GB0014725D0 (en) Cutting Machine
AU143114S (en) Cutter
GB2362345B (en) Machine tool arrangements
GB2352616B (en) Cutting machines
GB0021478D0 (en) Grass-cutting machine
TW535711U (en) Cutting machine
TW497537U (en) Cutting machine
TW417427U (en) Chocolate cutting machine
GB0005230D0 (en) Cutting/abrading machines