HK1054122A1 - 切削機 - Google Patents

切削機

Info

Publication number
HK1054122A1
HK1054122A1 HK03106331.2A HK03106331A HK1054122A1 HK 1054122 A1 HK1054122 A1 HK 1054122A1 HK 03106331 A HK03106331 A HK 03106331A HK 1054122 A1 HK1054122 A1 HK 1054122A1
Authority
HK
Hong Kong
Prior art keywords
cutting machine
cutting
machine
Prior art date
Application number
HK03106331.2A
Other languages
English (en)
Inventor
大宮直樹
Original Assignee
株式會社迪思科
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001355598A external-priority patent/JP2003158094A/ja
Priority claimed from JP2001362084A external-priority patent/JP2003163181A/ja
Application filed by 株式會社迪思科 filed Critical 株式會社迪思科
Publication of HK1054122A1 publication Critical patent/HK1054122A1/zh

Links

HK03106331.2A 2001-11-21 2003-09-05 切削機 HK1054122A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001355598A JP2003158094A (ja) 2001-11-21 2001-11-21 切削機
JP2001362084A JP2003163181A (ja) 2001-11-28 2001-11-28 加工機

Publications (1)

Publication Number Publication Date
HK1054122A1 true HK1054122A1 (zh) 2003-11-14

Family

ID=26624629

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03106331.2A HK1054122A1 (zh) 2001-11-21 2003-09-05 切削機

Country Status (3)

Country Link
CN (1) CN1235270C (zh)
HK (1) HK1054122A1 (zh)
TW (1) TWI272673B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005046979A (ja) * 2003-07-31 2005-02-24 Disco Abrasive Syst Ltd 切削装置
JP4377702B2 (ja) * 2004-01-08 2009-12-02 株式会社ディスコ 切削溝の計測方法
JP4502260B2 (ja) * 2004-10-28 2010-07-14 株式会社ディスコ スピンナー洗浄装置及びダイシング装置
JP2006278869A (ja) * 2005-03-30 2006-10-12 Disco Abrasive Syst Ltd ウェーハの切削方法及び切削装置
JP2008112884A (ja) * 2006-10-31 2008-05-15 Disco Abrasive Syst Ltd ウエーハの加工方法
JP5129002B2 (ja) * 2008-04-10 2013-01-23 株式会社ディスコ 加工装置
JP5415184B2 (ja) * 2009-08-21 2014-02-12 株式会社ディスコ 切削装置
JP5373517B2 (ja) * 2009-09-14 2013-12-18 株式会社ディスコ 搬送機構および加工装置
CN102194732A (zh) * 2010-02-02 2011-09-21 株式会社迪思科 工件单元的保持方法和保持机构
CN103681418A (zh) * 2012-09-25 2014-03-26 昆山英博尔电子科技有限公司 一种十二寸晶圆框架
JP6214901B2 (ja) * 2013-04-04 2017-10-18 株式会社ディスコ 切削装置
US9508570B2 (en) * 2013-10-21 2016-11-29 Asm Technology Singapore Pte Ltd Singulation apparatus and method
JP6560110B2 (ja) * 2015-11-30 2019-08-14 株式会社ディスコ 切削装置
CN111976041A (zh) * 2020-07-13 2020-11-24 大同新成新材料股份有限公司 用于半导体石墨晶圆的加工处理装置及其加工方法
TWI803972B (zh) * 2021-09-11 2023-06-01 環球晶圓股份有限公司 晶錠切割方法

Also Published As

Publication number Publication date
CN1420529A (zh) 2003-05-28
TW200300574A (en) 2003-06-01
TWI272673B (en) 2007-02-01
CN1235270C (zh) 2006-01-04

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