HK1054122A1 - Cutting machine - Google Patents
Cutting machineInfo
- Publication number
- HK1054122A1 HK1054122A1 HK03106331.2A HK03106331A HK1054122A1 HK 1054122 A1 HK1054122 A1 HK 1054122A1 HK 03106331 A HK03106331 A HK 03106331A HK 1054122 A1 HK1054122 A1 HK 1054122A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- cutting machine
- cutting
- machine
- Prior art date
Links
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001355598A JP2003158094A (en) | 2001-11-21 | 2001-11-21 | Cutting machine |
JP2001362084A JP2003163181A (en) | 2001-11-28 | 2001-11-28 | Machining apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1054122A1 true HK1054122A1 (en) | 2003-11-14 |
Family
ID=26624629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03106331.2A HK1054122A1 (en) | 2001-11-21 | 2003-09-05 | Cutting machine |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN1235270C (en) |
HK (1) | HK1054122A1 (en) |
TW (1) | TWI272673B (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005046979A (en) * | 2003-07-31 | 2005-02-24 | Disco Abrasive Syst Ltd | Cutting device |
JP4377702B2 (en) * | 2004-01-08 | 2009-12-02 | 株式会社ディスコ | Cutting groove measurement method |
JP4502260B2 (en) * | 2004-10-28 | 2010-07-14 | 株式会社ディスコ | Spinner cleaning device and dicing device |
JP2006278869A (en) * | 2005-03-30 | 2006-10-12 | Disco Abrasive Syst Ltd | Cutting method and cutting device of wafer |
JP2008112884A (en) * | 2006-10-31 | 2008-05-15 | Disco Abrasive Syst Ltd | Processing method of wafer |
JP5129002B2 (en) * | 2008-04-10 | 2013-01-23 | 株式会社ディスコ | Processing equipment |
JP5415184B2 (en) * | 2009-08-21 | 2014-02-12 | 株式会社ディスコ | Cutting equipment |
JP5373517B2 (en) * | 2009-09-14 | 2013-12-18 | 株式会社ディスコ | Conveying mechanism and processing device |
CN102194732A (en) * | 2010-02-02 | 2011-09-21 | 株式会社迪思科 | Holding method and holding mechanism for work piece unit |
CN103681418A (en) * | 2012-09-25 | 2014-03-26 | 昆山英博尔电子科技有限公司 | A twelve-inch wafer framework |
JP6214901B2 (en) * | 2013-04-04 | 2017-10-18 | 株式会社ディスコ | Cutting equipment |
US9508570B2 (en) * | 2013-10-21 | 2016-11-29 | Asm Technology Singapore Pte Ltd | Singulation apparatus and method |
JP6560110B2 (en) * | 2015-11-30 | 2019-08-14 | 株式会社ディスコ | Cutting equipment |
CN111976041A (en) * | 2020-07-13 | 2020-11-24 | 大同新成新材料股份有限公司 | Processing device and processing method for semiconductor graphite wafer |
TWI803972B (en) * | 2021-09-11 | 2023-06-01 | 環球晶圓股份有限公司 | Ingot cutting method |
-
2002
- 2002-11-05 TW TW91132605A patent/TWI272673B/en not_active IP Right Cessation
- 2002-11-21 CN CN 02152868 patent/CN1235270C/en not_active Expired - Lifetime
-
2003
- 2003-09-05 HK HK03106331.2A patent/HK1054122A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1235270C (en) | 2006-01-04 |
CN1420529A (en) | 2003-05-28 |
TW200300574A (en) | 2003-06-01 |
TWI272673B (en) | 2007-02-01 |
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