KR100504220B1 - 칩온 유리액정 표시장치 - Google Patents

칩온 유리액정 표시장치 Download PDF

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Publication number
KR100504220B1
KR100504220B1 KR10-1998-0043800A KR19980043800A KR100504220B1 KR 100504220 B1 KR100504220 B1 KR 100504220B1 KR 19980043800 A KR19980043800 A KR 19980043800A KR 100504220 B1 KR100504220 B1 KR 100504220B1
Authority
KR
South Korea
Prior art keywords
liquid crystal
chip
crystal display
lsi
dummy
Prior art date
Application number
KR10-1998-0043800A
Other languages
English (en)
Korean (ko)
Other versions
KR19990037217A (ko
Inventor
카즈오 후쿠다
야수유키 시라토
마나부 타카미
Original Assignee
나녹스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나녹스 가부시키가이샤 filed Critical 나녹스 가부시키가이샤
Publication of KR19990037217A publication Critical patent/KR19990037217A/ko
Application granted granted Critical
Publication of KR100504220B1 publication Critical patent/KR100504220B1/ko

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
KR10-1998-0043800A 1997-10-22 1998-10-20 칩온 유리액정 표시장치 KR100504220B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9289937A JPH11125837A (ja) 1997-10-22 1997-10-22 チップオンガラス液晶表示装置
JP97-289937 1997-10-22

Publications (2)

Publication Number Publication Date
KR19990037217A KR19990037217A (ko) 1999-05-25
KR100504220B1 true KR100504220B1 (ko) 2005-11-16

Family

ID=17749681

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1998-0043800A KR100504220B1 (ko) 1997-10-22 1998-10-20 칩온 유리액정 표시장치

Country Status (4)

Country Link
JP (1) JPH11125837A (ja)
KR (1) KR100504220B1 (ja)
CN (1) CN1108535C (ja)
TW (1) TW533329B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000040355A (ko) * 1998-12-18 2000-07-05 가나자와 요쿠 유기기(遊技機) 제어용 ic 패키지
JP4627843B2 (ja) 1999-07-22 2011-02-09 株式会社半導体エネルギー研究所 半導体装置
JP3708467B2 (ja) * 2001-09-26 2005-10-19 株式会社日立製作所 表示装置
KR100771949B1 (ko) * 2001-11-07 2007-10-31 엘지.필립스 엘시디 주식회사 초박형 액정표시장치용 씰패턴
KR100806910B1 (ko) * 2002-01-31 2008-02-22 삼성전자주식회사 액정 표시 장치 및 이의 제조시의 본딩 상태 측정 방법
KR100531590B1 (ko) * 2002-06-06 2005-11-28 알프스 덴키 가부시키가이샤 액정표시장치 및 액정표시장치의 제조방법
US7361027B2 (en) 2002-12-25 2008-04-22 Semiconductor Energy Laboratory Co., Ltd. Contact structure, display device and electronic device
KR100724479B1 (ko) * 2003-11-07 2007-06-04 엘지.필립스 엘시디 주식회사 액정표시소자 및 구동회로와의 본딩상태 검사방법
JP4779399B2 (ja) * 2005-03-29 2011-09-28 エプソンイメージングデバイス株式会社 電気光学装置、電気光学装置の製造方法、実装構造体及び電子機器
KR100726529B1 (ko) * 2005-04-07 2007-06-11 엘에스전선 주식회사 접속상태의 확인이 용이한 인쇄회로기판 및 이를 이용한액정표시장치
JP2007322591A (ja) * 2006-05-31 2007-12-13 Rohm Co Ltd 表示装置
JP4992774B2 (ja) * 2008-03-14 2012-08-08 セイコーエプソン株式会社 電気光学装置及び電子機器
CN103676235A (zh) * 2013-12-13 2014-03-26 句容骏成电子有限公司 一种液晶显示器及其制备方法
CN104200767B (zh) * 2014-09-18 2017-10-31 南京中电熊猫液晶显示科技有限公司 阵列基板、显示装置及其检测方法
KR102340938B1 (ko) * 2015-09-17 2021-12-20 엘지디스플레이 주식회사 표시장치와 그 접촉 저항 측정 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629296A (ja) * 1992-07-09 1994-02-04 Toshiba Corp バンプパッドを備える半導体装置
JPH07263488A (ja) * 1994-03-24 1995-10-13 Nec Corp 半導体チップ、ｔａｂテープ及びインナーリードボンダ ー並びに半導体装置の製造方法
JPH08304462A (ja) * 1995-03-07 1996-11-22 Nitto Denko Corp バーンイン試験用プローブ構造
JPH1154560A (ja) * 1997-08-01 1999-02-26 Seiko Epson Corp Ｉｃ実装方法、液晶表示装置及び電子機器
JP2000031202A (ja) * 1996-06-13 2000-01-28 Toshiba Electronic Engineering Corp 半導体装置の実装体及び半導体装置の実装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629296A (ja) * 1992-07-09 1994-02-04 Toshiba Corp バンプパッドを備える半導体装置
JPH07263488A (ja) * 1994-03-24 1995-10-13 Nec Corp 半導体チップ、ｔａｂテープ及びインナーリードボンダ ー並びに半導体装置の製造方法
JPH08304462A (ja) * 1995-03-07 1996-11-22 Nitto Denko Corp バーンイン試験用プローブ構造
JP2000031202A (ja) * 1996-06-13 2000-01-28 Toshiba Electronic Engineering Corp 半導体装置の実装体及び半導体装置の実装方法
JPH1154560A (ja) * 1997-08-01 1999-02-26 Seiko Epson Corp Ｉｃ実装方法、液晶表示装置及び電子機器

Also Published As

Publication number Publication date
CN1108535C (zh) 2003-05-14
KR19990037217A (ko) 1999-05-25
CN1222684A (zh) 1999-07-14
JPH11125837A (ja) 1999-05-11
TW533329B (en) 2003-05-21

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