TW533329B - Chip-on-glass liquid crystal display apparatus - Google Patents

Abstract

A chip-on-glass liquid crystal display apparatus includes a liquid crystal driving LSI (9) disposed on a glass substrate. The LSI has dummy terminals (10-13) provided at four corners thereof. The glass substrate has transparent conductive films (15) provided at its portions corresponding to the dummy terminals. Each conductive film carries thereon a metallic film (5-8) with an empty region (17) provided at its portion corresponding to the respective dummy terminal. A plurality of conductive particles (16) is interposed between the dummy terminals and the conductive films. When the dummy terminals are press-bonded to the conductive films with the conductive particles interposed therebetween, the extend of crush, as a result of the press-bonding, of the conductive particles can be seen and verified on a rear side of the glass substrate through the empty regions.

Description

533329 5 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 3937pifl.doc / 008 is a neutral manual No. 871 16705

Description of the invention (丨)----------- S The present invention is to provide a glass liquid crystal display (LCD) device with a carrier chip, in particular to arrange an LSI chip for liquid crystal driving around a liquid crystal cell to be integrated. "Electricians," especially those who can visually confirm the contact state of LSI chip terminals (convex parts). In recent years, liquid crystal display devices have been widely used in AV equipment such as audio equipment, video recorders, and other household appliances such as washing machines, electric cookers, and measuring instruments. ^ If integrated on a glass substrate on which a liquid crystal cell is mounted, and a driving LSI chip for driving the liquid crystal cell is integrated, the liquid crystal display device can achieve low cost, miniaturization and other effects. Fig. 9 is a schematic diagram showing the basic structure of a conventional liquid crystal display device on which a chip is mounted. In the ninth figure, the liquid crystal display device 50 on which the wafer is placed is filled with liquid crystal 54 between two glass substrates 51 and 51, and then sealed with a heat seal 55 such as resin around the two glass substrates. On the opposite surface of the liquid crystal 54 of the substrate 51, transparent conductive films 52 and 53 are formed. A polarizing filter 57 is provided on the surface of the sloped glass substrate 51 in which the liquid crystal 54 is sealed, and the alignment film 56 aligns the liquid crystal molecules in a predetermined direction. The transparent conductive film 53 is extended on the surface of the glass substrate 51 in which the liquid crystal is sealed, and a driving LSI 58 for driving the liquid crystal 54 or a connection pattern such as an electronic component and a connector mounted on the glass substrate 51 is formed. On the surface of the connection pattern, a metal film 59 such as metal plating is formed to form a conductor pattern. The metal film 59 of the conductor pattern enables driving LSI 58 and liquid 4. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) · ϋ aiBl ϋ n 1 an ^ -1 nnna ··· * mm ww snow · (Please read the precautions on the back before filling in this page) · _ 533329 3937pifl .doc / 008 is the 87th Π 6705 _ Neutral instruction plate · A7

Zheng Zheng

5. Explanation of the invention (fly) The resistance 値 between the I crystals 54 or between the driving LSI 58 and the electronic components or connectors is reduced to ensure the excellent conductivity. Figure 10 is a schematic diagram of the substrate on which the driving LSI shown in Figure 9 is mounted on glass (please read the precautions on the back before filling this page). The driving LSI 58 shown in FIG. 10 is mounted on the glass substrate 51 through a non-isotropic conductive film including connection terminals (convex pieces) for the driving LSI 58 and on the surface of the glass substrate 51. The conductive particles 62 of the metal film 59 such as metal plating are generated on the transparent conductive film 53 and are pressed downward. Fig. 11 is a schematic diagram showing the connection between a driving LSI and a conductor pattern of a conventional liquid crystal display device with a chip mounted on the back of a glass substrate. Printed in Figure 11 by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The connection terminals (convex parts) 61 (dashed lines) of the LSI 58 for driving are pressed face-down against the metal film 59. Conductor pattern. In addition, at the four corners of the driving LSI58, there are provided baffle terminals (baffle protrusions) 63 for electronically connecting the outside. The baffle terminals 63 are made of conductive particles 62 (see FIG. 10), Face-down, the conductor pattern is formed by two layers including a transparent conductive film 53 and a metal film 59 provided on a glass substrate 51 as shown in FIG. 9. The conventional glass liquid crystal display device equipped with a chip is connected to the conductive LSI connection terminal and the shield terminal and the conductor pattern formed with a metal film on the surface through conductive particles, so it is as shown in FIG. 11 ' When attempting to observe the broken state of conductive particles from the back of the glass substrate ', 5 paper sizes are applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 533329 κΓ

3937pifl.doc / 008 Modification of IF latch period: 2000 1.5 丄 _ is 871 1 (No. 5705 medium-inch specification amendment V. Description of the invention (}) When the conductive state is visually inspected, the metal film of the conductor pattern is opaque, which results in It is not possible to visually confirm the contact between the driving LSI and the conductor pattern following the broken state of the conductive particles 62. (Please read the precautions on the back before filling out this page.) Although the electrical connection between the driving LSI and the conductor pattern is made exclusively, The LSI measuring device performs electrical conduction, but if the conductive particles are broken due to the pressure, the electric conduction in the initial stage of production will occur due to the suspected contact, which may cause a contact failure after a period of time and cause the chip to be mounted. The production efficiency of the glass liquid crystal display device is reduced, and the problem of reliability is reduced after a period of time. Therefore, the inspection to confirm the broken condition of the conductive particles between the electronic connection driving LSI and the conductor pattern by visual inspection is skipped. Method, by setting the crimping conditions and checking the crimping state, etc., it can be extremely useful in the manufacturing process. If an opaque metal film is generated on the conductor pattern, the connection terminal and the shield terminal of the driving LSI can be visually inspected through the transparent transparent conductive film, and the cracking of the conductive particles can also be visually confirmed.

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the purpose of the present invention is to provide a glass liquid crystal display device with a carrier chip, which can be confirmed by visual inspection of the LSI for driving, and a baffle connected with a conductor pattern. The broken state of the conductive particles on the terminal (block projection) can accurately determine whether the normal contact between the connection terminal of the driving LSI and the conductor pattern is. The glass liquid crystal display device with a carrier chip provided by the present invention is provided with a plurality of baffle terminals on a driving LSI, and the plurality of baffle terminals are in a see-through state from the non-pressing surface direction of the glass substrate. This paper can use 6 paper sizes to comply with Chinese National Standard (CNS) A4 specifications (210 X 297 mm) A7 533329 3937pif2.doc / 〇l * _ 87 笛 87 丨 16705 Chinese manual amendment Li ~ B7 ML · 修 _IF Latching period August 2, 2002 Latching 5. Description of the invention ((f) Month B amendment |; Visual inspection of the connection between the driver LSI and the conductor case with the four leads on the cover terminal's condition. The above-mentioned plurality of baffle terminals' may be installed in at least two corners of the driving LSI so that the broken state of the conductive particles on the baffle terminals at the two corners can be used to visually confirm the driving LSI and the The connection status between the conductor patterns. If the positioning mark of the driving LSI is a pattern with a metal film or a conductive conductive film, you can visually confirm the correctness of the mounting position of the driving LSI. This mark is best As close as possible The shape of a square frame with an equal distance around the sub-frame allows the position of the driving LSI to be confirmed by visually checking the relationship between the blocking terminal and the marked position. The distance between the inside of the frame and the blocking terminal is the mounting of the driving LSI. If the accuracy is set, for example, if it is in the range of 0 to 20 μm, it is easier to confirm the position and the broken condition of the conductive particles inside. Other marks such as the cross shape through the center of the terminal of the baffle In the case of a linear pattern, in this case, the breakage of the energized particles can be confirmed from the area of the shield terminal beyond the cross. Other marking particles, for example, form a pattern corresponding to the four corners of the driving LSI. Hereinafter, the figures of the present invention will be described with reference to the figures. A preferred embodiment will be described in detail. Brief description of the diagram: Figure 1 is a schematic view of the pressing state between the LSI for driving a liquid crystal display device and a conductor pattern according to a preferred embodiment of the present invention (viewed from the back of a glass substrate). ___________________ 7 ____________ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the (Please fill in this page again)

-------- Order ί 1 «n n n an —mm I

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 3937pif 1 .doc / 008 8 7

Revised Bg for the No. 1 specification ^ 'Revised Tf Date: 2000i_.U V. Description of the invention (η — Figure 2 is shown in Figure 1 Π-]] [Schematic diagram of enlarged line section. 3 This is an enlarged schematic view of one of the tab terminals provided at the four corners of the driving LSI shown in Fig. 1. Fig. 4 is a tab terminal excluding the metal film constituting the positioning marks for the driving LSI. Fig. 5 Positioning marks made of rectangular metal film on each side corresponding to the stopper terminal shown in Fig. 4. Fig. 6 shows another embodiment of the positioning mark. Fig. 7 shows another embodiment of the positioning mark. Fig. 8 is a flowchart of the manufacturing steps of the liquid crystal display device provided by the present invention. Fig. 9 is a schematic diagram of a basic structure of a conventional liquid crystal display device on which a wafer is mounted. Fig. 10 is a driver LSI shown in Fig. 9 A schematic view of a glass substrate. Fig. 11 is a schematic view of the connection between a driving LSI and a conductor pattern of a conventional liquid crystal display device with a chip mounted on the rear side of the glass substrate. Reference numerals 1 to 4: conductor patterns 5a to 5d : Rectangular metal film 5 ~ 8: Metal film 9: Driving LSI 10 ~ 13: Block terminal (baffle tab) 14: Connection terminal (convex part) 8 -I, ----- # Mounting -------- Order ------ --- # (Please read the notes on the back before filling in this page) *-11 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 533329 3937pif2.doc / 01 1 A7 B7

Jjb. Supplement V. Description of the invention (15: Transparent conductive film ______ 16: Conductive particles 17: Notched areas 21, 22, 24-27: Metal film 23: Notched area 50: Liquid crystal display device 51: Glass substrates 52, 53: Transparent conductive film 5 4: Liquid crystal 55: Resin 56: Alignment film 57: Polarizing mirror

58: Driving LSI 59. Metal film 61: Connection terminal (convex member) 62: Conductive particles 63: Block terminal D: Distance G ·. Glass substrate The liquid crystal display device provided by the present invention can visually inspect conductive particles It is possible to check the pressure between the driving LSI and the conductor pattern by using the marks formed by the metal film or the transparent conductive film, and visually confirm the mounting position of the driving LSI. The paper size shown in Figure 1 is based on the Chinese paper standard (CNS) A4 (210 X 297 mm) used to form a glass liquid crystal display device with a carrier chip. (Please read the precautions on the back before filling this page) Order --------- line {533329 3937pif2.doc / 01 1 A7 B7

Printed by the Consumer Property Cooperation Bureau of the Intellectual Property Bureau of the Ministry of Economic Affairs

V. Description of the invention (9):: j yfj-Pressed state of the body pattern BU 4 when viewed from the back of the glass substrate. An enlarged cross-sectional view of the 2nd series of terminal blocks. · In Figures 1 and 2, the conductor patterns 1 to 4 formed on the surface of the glass substrate G are formed by forming a metal film on a transparent conductive film by plating or vapor deposition, and corresponding to the connection terminals of the driving LSI9 ( The number of convex pieces) 14 is formed at the same interval as the external terminals, and is connected to a liquid crystal (not shown). As the metal film, for example, gold (An) can be used. In addition, notch regions 17 (formed by openings from which metal films 5 to 8 are removed from the frame) are formed at the relative positions of the shield terminals (shield protrusions) 10 to 13 at the four corners of the driving LSI 9. (See FIG. 2) 'to form the conductive pattern of the remaining transparent conductive film 15. The transparent conductive film 15 can also be removed at positions corresponding to the stopper terminals (the stopper projections) 10 to 13 ', leaving only the glass substrate G. The metal film 8 can be formed in accordance with a necessary width, such as a driving power source, and is connected to the connection terminal to share a frame-shaped pattern of the shutter terminal. Pass the connection terminals (protrusions) 14 and shield terminals (shield protrusions) 10 to 13 of the LSI 9 for driving with the conductor patterns 1 to 4 and the conductor pattern of the transparent hydrogen conductive film _15 provided at the four corners through silver. When conductive particles 16 such as particles (plutonium filler) are pressed face down, the conductor patterns 1 to 4 and the connection terminals (projections) 14 after the pressing are performed in the direction of the non-pressing surface of the glass substrate G. The state of the conductive pattern is opaque metal films 5 to 8, so it cannot be confirmed visually. However, if the notch region 17 is formed in the metal film 5 as shown in FIG. 2, the pressed state of the shield terminals (shield protrusions) 10 to 13 on the four corners and the conductive pattern of the transparent conductive film 15 will be in a pressed state. Can be seen in perspective, and this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) I · · 1 aiHP 1_1 βϋ 1 ·. ΛΜι 1 dJ -· N ϋ n ϋ I an n I · 533329 Revised TF Date: 20001.5.3 393 7pifl .doc / 008 87116705 V. Description of the Invention (P) a & condition. As described above, the glass liquid crystal display device provided with the carrier wafer of the present invention is provided with a plurality of shutter terminals 10 to 13 ′ on the driving LSI 9, and the plurality of shutter terminals 10 to 13 are made of glass substrate G. The direction of the pressing surface can be seen through. Therefore, the broken state of the conductive particles on the shield terminals 10 to 13 can visually confirm the connection between the driving LSI 9 and the conductor pattern. * Figure 3 is a schematic diagram showing the relationship between the pressing conditions between the arbitrary block terminals at the four corners and the conductive pattern of the transparent conductive film shown in Figure 1, and the relationship with the metal film forming the frame-shaped notch area. In FIG. 3, the shield terminals (shield protrusions) 10 arbitrarily provided at at least two corners (four corners of the figure) of the driving LSI 9 as shown in FIG. 1 are transmitted through the conductive particles 16. Face down, pressing on the transparent conductive film 15 formed on the glass substrate, so that the shape change caused by the pressing of the conductive particles 16 (fragmentation condition) can be visually confirmed from the back of the glass substrate through the notch area 17 )status. In the first figure, if the conductive particles 16 are pressed on all the four corner corners of the shield terminals 10 to 13 and the broken state occurs, if it is the same as that shown in the third figure, it can be estimated that the pressure is on The entire surface of the driving LSI 9 is in an even state. Therefore, the pressing state of the conductive particles 16 between the connection terminals (projections) 14 and the conductive patterns 1 to 4 of the driving LSI 9 cannot be confirmed visually, but it is possible. It was judged to be a uniform state. Conversely, if the state in Figure 1 is broken due to the pressure of the conductive particles 16 on all the four corner corners of the terminal blocks 10 ~ 13, as shown in Figure 3, this paper size applies the Chinese National Standard (CNS ) A4 size (210 X 297 mm) ---- ^ ---- J .---- install -------- order --------- ^ 9. (Please first Read the notes on the back and fill out this page) '' ''

533329 393 7pif2.doc / 01% A7 B7 V. If the one shown in the description of the invention does not reduce the distribution of ΙΙΜ ～ τϊ, then it can be judged that the pressing condition is not uniform, and it can be used in the pressing step. , Use feedback to adjust the adjustment of the crimping machine. As described above, since the plurality of shield terminals of the glass liquid crystal display device provided with the present invention are provided at least at two corners of the driving LSI9, the breakage condition of the conductive particles on the shield terminals at the two corners is used, and The connection state between the driving LSI 9 and the conductor pattern can be confirmed by visual inspection. In addition, in FIG. 3, after the cover terminal 10 and the transparent conductive film 15 are pressed, the four sides of the cover terminal 10 can be determined by visual inspection to each of the frame-shaped metal films 5 corresponding to the positioning marks. Distance D (equivalent to the notch area 17), confirm whether the positioning of the driving LSI9 mounting position is correct, and perform feedback control on the loader (mounting machine) of the driving LSI9 to adjust the mounting position. The so-called visual confirmation is that when the distance D from the shutter terminal to the frame-shaped metal film 5 formed on the opposite side mark is the same on all four sides, it can be judged that the loader (loader) of the LSI 9 for driving The positioning is correct. Conversely, when the four sides of the distance D are not equal, it can be determined that the positioning is incorrect, and the position control of the loader (loader) can be adjusted or changed. As described above, the glass liquid crystal display device with a wafer is formed with the positioning mark of the driving LSI9 on the pattern having the metal film 5 or the transparent conductive film 15. Therefore, the driving LSI9 can be judged on the position by visual inspection. Is it in the right place. The notched area 17 of the metal film 5 ~ 8, which is also used as a mark for niches, applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) for this paper size (Please read the precautions on the back before filling this page ) --- 丨 丨!丨 Order ---- 丨 丨! Line 'Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Cooperatives, India

Printed by 533329 Qian'l, 3937pifl.doc / 〇〇8 ^ S71 16705 Chinese Speaking Book Revised Date Revised Date_j_〇_〇〇1.5.3 " .ί Invention Explanation ((°)] One-by-one r series design is a square frame with an equal distance from the transparent guide telt. Therefore, the positional relationship between the shield terminals 10 to 13 and the marks 5 to 8 can be used for the mounting position of the driving LSI9. In addition, when the positioning of the driving LSI 9 is not confirmed by visual inspection, as shown in FIG. 4, the shield terminal 10 can be transmitted through the transparent conductive film 15 from which the metal film 5 forming the positioning mark is removed. The conductive particles 16 are pressed. The metal film 5 constituting the positioning mark may not have a square frame shape, but may be τπ as shown in FIG. 5: 'form a rectangular metal moon 5a corresponding to each side of the stopper terminal 10. 5d 〇 FIG. 6 is another structural diagram of the positioning mark of the glass liquid crystal display device with a wafer of the present invention. In FIG. 6, the positioning mark is a metal film 21 and another metal film. 22 is designed as a cross-shaped cross line pattern When SI9 is pressed against the glass substrate, the center of the ghail blade 10 will be inserted at the center of the ghail cross. Because the cross-shaped metal films 21 and 22 are opaque, the block is visually confirmed. For the terminal 10, if the positioning of the driving LSI 9 is correct, the blank terminal 10 can be visually viewed through the notched area 23 which has been divided into four equal portions by the cross-shaped metal films 21 and 22. When the blank terminal 10 is not crossed When the metal films 21 and 22 are divided into four equal and equal four parts, it can be determined that the positioning of the driving LSI 9 is incorrect, and the loader (loader) can be adjusted. As described above, the glass with a wafer of this invention The mark of the liquid crystal display device, because it is a cross-shaped straight line drawing through the center of the baffle terminal 10. 13 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling in this (Page) _Installation -------- Order ---- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533329 '· --ΐ Α7 Ί 3937pif 1 .doc / 008 87 1 1 6705 Amendment to the Chinese Manual Taste __ Date of revision of TF: 20001 5 3 V. Description of the invention (() .......... Cases 21 and 22, the positional relationship between the shield terminal 10 and the mark can be used to visually confirm the mounting position of the driving LSI9. In Figure 6, it is also possible to The cross-shaped linear pattern of the mark will be formed and rotated 45 degrees. Fig. 7 is a structural diagram of another embodiment of the positioning mark of the glass liquid crystal display device with a wafer of the present invention. ^ The system shown in Fig. 7 The metal films 24 to 27 forming the positioning marks for the driving LSI9 are formed into an L shape corresponding to the four corners of the driving LSI9. When the LSI 9 for driving is mounted on a glass substrate, it can be visually inspected whether the inner lines of the metal films 24 to 27 coincide with the four corners of the LSI 9 for driving and confirm the positioning. When the four corners of the driving LSI 9 are not aligned with the inner lines of the metal films 24 to 27, it can be determined that the positioning is not correct, and the loader (mounted machine) can be adjusted. As described above, since the marks of the glass liquid crystal display device with a carrier chip in this embodiment correspond to the four corners of the driving LSI 9 with patterns 24 to 27, it is possible to visually confirm whether the mounting position of the driving LSI is correct. Although the above-mentioned mark is formed by a metal film pattern, it can also be formed by a transparent conductive film, and the transparent conductive film of the pressing portion of the baffle terminal can be cut off. Only a glass substrate can be used. Next, the manufacturing steps of the glass liquid crystal display device with a carrier wafer will be described in detail using the flowchart shown in FIG. First, step S1 is to form a patterned ITO film transparent conductive film including a display area, wiring and external electrodes mounted on the display section. The display area is formed by indium tin oxide on a glass substrate by electroplating. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) Mounting -------- Order --- Intellectual Property of the Ministry of Economic Affairs Bureau employee consumer cooperative printed 533329 A7 3937pif2.doc / 01 1 I. V. Description of the invention (/ 2) 4 Step S2 is a photolithographic pattern for nickel plating using metal plating on the lower layer (plating bottom layer) for lithographic plating. Metal parts (liquid crystal display areas or protrusions) that do not need to be plated are covered (coated) with photoresist. Step S3 is for the nickel plating of the metal plating lower layer (plating bottom layer), and the metal ions in the solution are reduced and precipitated in a way that no current flows from the outside, so that the electroless layer is deposited on the surface of the ore body to be electrolyzed. Method of nickel plating. Non-photoresistive parts precipitate nickel ore. With selective plating of the ITO film, nickel ore deposits are deposited only on the ITO film without the photoresist portion. The photomask only needs to be attached without a shovel, and may be a transparent inorganic insulating film. Step S4 is a step of removing the photoresist pattern for the electroless nickel plating formed in step S2 with a cleaning agent or a stripper. Step S5 is to further remove the photoresist residue remaining in step S4 by heat, and at the same time, further strengthen the adhesion of the nickel plating layer without distorting the glass substrate. For example, a temperature of 250 degrees is used for aging for 30 minutes. In step S6, the electroless plating method is used again to further perform gold plating on the nickel electro-mineral layer of the bottom layer to form a metal plating composed of the nickel plating and the gold plating layer as a whole. Step S7 is to place the two transparent conductive films of the glass substrate liquid crystal display slice as of step S6 and the glass substrate formed of the corresponding universal display conductive conductive film, etc., and pre-position between the two glass substrates. Leave a gap and seal it with resin or the like around it (however, the liquid crystal injection port is not sealed). The liquid crystal injection device is used to load the glass substrate into the chamber, and then the vacuum pump is used to exhaust the air. After the air is exhausted, the liquid crystal is loaded into the special paper. The size of the paper applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) ------------------- Order --------- line (please read the precautions on the back before filling this page)

533329 3 937pif 1 .doc / 008 — one for the pole 871 l67〇5 Φ handed over the manual to amend the mud: ____ repair JE date: 20001.5.3 · L ...... ... —— V. Description of the invention (Η) Use a liquid crystal dish to soak the glass substrate so that the liquid crystal is poured into the cell. When liquid crystal is poured into the glass substrate cell, the column inlet is sealed with a resin or the like. Above the cell is attached a polarizing film that polarizes the incident light in a certain way (depending on the liquid crystal display method, different from the reflective, transmissive, or polarizing direction of the liquid crystal, such as the rotation of the liquid crystal itself). In step S8, the conductive particles composed of the silver particles having good conductivity are pressed on the projecting member of the completed liquid crystal display element with the resin dispersed, and are pressed face down. At this time, the driving LSI with the chip is in a positional deviation mode with respect to the LSI pressing portion, and a flat plate-shaped pressing machine (such as a bonding machine) is used to apply a certain pressure on a certain amount of conductive particles on the LSI. With various factors such as pressure and resin, various cold pressing, hot pressing (such as room temperature 15 ° C), applied pressure (such as 0.1 ~ lkg), and pressing time (such as 0.1 ~ 60sec) can be changed. . At the same time, the glass substrate and the LSI are bonded with resin. ---------------------- Outfit -------- Order ----- ---- Luxury- (Please read the note on the back first (Please fill in this page again).

Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives. This paper is printed in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 533329 Α5 Β5 Glass LCD with chip wafer 3937pifl.doc / QQ8 IV. Abstract of Chinese Invention (Faye (please read the precautions on the back before filling in this page) The present invention is to provide a glass liquid crystal display device with a carrier chip, which is a LSI for liquid crystal driving on a glass substrate. A corner terminal is provided, and a transparent conductive film is formed on the glass substrate corresponding to the corner terminal position, and a metal film is formed on the transparent conductive β Wu. The metal film forms a notch area at least corresponding to the corner terminal portion. There are a plurality of conductive particles between the baffle terminal and the transparent conductive film. When the baffle terminal is pressed against the transparent conductive film by the conductive particles, the conductive particles may be broken by the pressing, and can be passed through the notch area through the inner surface of the glass substrate. Visual confirmation. Abstract of the invention in English (name of the invention ...)

CHIP-ON-GLASS LIQUID CRYSTAL DISPLAY APPARATUS A chip-on-glass liquid crystal display apparatus includes a liquid crystal driving LSI (9) disposed on a glass substrate. The LSI has dummy terminals ( 10 ~ 13) provided at four corners thereof. The glass substrate has transparent conductive films (15) provided at its portions corresponding to the dummy terminals. Each conductive film carries thereon a metallic film (5 ~ 8) with an empty region (17) provided at its portion corresponding to the respective 2 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) "

Claims (1)

533329 393 7pif2.doc / 0 1 1 is the Chinese Patent Range Amendment No. 87 116705. A8 B8 C8 D8 Revision Date: August 2, 2002 Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. Scope of Patent Application 1. One The domain-glass liquid crystal display device with a carrier wafer is a device in which liquid crystal is sealed between two glass substrates, and a driving LSI for driving the liquid crystal is mounted on the glass substrate, and formed on a transparent conductive film provided on the glass substrate. The conductive pattern of the metal film penetrates the conductive particles and is pressed against the connection terminals of the driving LSI. The liquid crystal and the driving LSI form a current-carrying connection. The driving LSI is provided with a plurality of blocking terminals. A notch area is formed on the metal film corresponding to the terminal portion of the shutter, and the plurality of shutter terminals pass through the notch area, and the non-pressing surface of the glass substrate is transparent. 2. The glass liquid crystal display device with a carrier chip according to item 1 of the scope of the patent application, wherein the plurality of blocking terminals are provided at least at two corners of the driving LSI. 3. The glass liquid crystal display device with a carrier wafer according to item 1 of the scope of the patent application, wherein the positioning mark of the driving LSI is a pattern having the metal film or the transparent conductive film. 4. The glass liquid crystal display device with a carrier chip according to item 3 of the scope of patent application, wherein the mark is a frame-shaped designer equidistant from the periphery of the shutter terminal. 5. The glass liquid crystal display device with a wafer according to item 3 of the patent application scope, wherein the mark is a cross-shaped linear pattern passing through the center of the stopper terminal. 6. The glass liquid crystal display device with a wafer according to item 3 of the scope of patent application, wherein the mark corresponds to a pattern of four corners of the driving LSI. -------------------- Order --------- Line · (Please read the notes on the back before filling this page) _ This paper size applies China National Standard (CNS) A4 Specification (210 x 297 Public Love) 23 533329 9 G Section 7 B