KR100475265B1 - 리이드프레임과그것을사용한반도체장치및그제조방법 - Google Patents

리이드프레임과그것을사용한반도체장치및그제조방법 Download PDF

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Publication number
KR100475265B1
KR100475265B1 KR1019970008685A KR19970008685A KR100475265B1 KR 100475265 B1 KR100475265 B1 KR 100475265B1 KR 1019970008685 A KR1019970008685 A KR 1019970008685A KR 19970008685 A KR19970008685 A KR 19970008685A KR 100475265 B1 KR100475265 B1 KR 100475265B1
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South Korea
Prior art keywords
semiconductor chip
support
lead
inner lead
tip
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Expired - Fee Related
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English (en)
Korean (ko)
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KR970067736A (ko
Inventor
시게키 다나카
아츠시 후지사와
소우이치 나가노
츠기히코 히라노
료이치 오타
다카후미 곤노
겐이치 다테베
도시아키 오카모토
Original Assignee
히타치 홋카이 세미콘덕터 가부시키가이샤
가부시끼가이샤 히다치 세이사꾸쇼
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Publication of KR970067736A publication Critical patent/KR970067736A/ko
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Publication of KR100475265B1 publication Critical patent/KR100475265B1/ko
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  • Engineering & Computer Science (AREA)
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  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1019970008685A 1996-03-18 1997-03-14 리이드프레임과그것을사용한반도체장치및그제조방법 Expired - Fee Related KR100475265B1 (ko)

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JP96-60421 1996-03-18
JP9008964A JPH09312375A (ja) 1996-03-18 1997-01-21 リードフレーム、半導体装置及び半導体装置の製造方法
JP97-8964 1997-01-21

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KR100473261B1 (ko) 2005-03-14
US6265762B1 (en) 2001-07-24
KR970067736A (ko) 1997-10-13
JPH09312375A (ja) 1997-12-02
CN1595646A (zh) 2005-03-16
MY121618A (en) 2006-02-28
CN100359678C (zh) 2008-01-02
CN1156910C (zh) 2004-07-07
TW347585B (en) 1998-12-11
CN1164127A (zh) 1997-11-05

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