JPH09312375A - リードフレーム、半導体装置及び半導体装置の製造方法 - Google Patents
リードフレーム、半導体装置及び半導体装置の製造方法Info
- Publication number
- JPH09312375A JPH09312375A JP9008964A JP896497A JPH09312375A JP H09312375 A JPH09312375 A JP H09312375A JP 9008964 A JP9008964 A JP 9008964A JP 896497 A JP896497 A JP 896497A JP H09312375 A JPH09312375 A JP H09312375A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- lead
- support
- semiconductor device
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9008964A JPH09312375A (ja) | 1996-03-18 | 1997-01-21 | リードフレーム、半導体装置及び半導体装置の製造方法 |
| TW086102661A TW347585B (en) | 1996-03-18 | 1997-03-05 | Lead frame, semiconductor device using the same and manufacturing of semiconductor device thereof |
| MYPI97001026A MY121618A (en) | 1996-03-18 | 1997-03-12 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
| KR1019970008685A KR100475265B1 (ko) | 1996-03-18 | 1997-03-14 | 리이드프레임과그것을사용한반도체장치및그제조방법 |
| CNB971033129A CN1156910C (zh) | 1996-03-18 | 1997-03-17 | 引线框、使用该引线框的半导体器件及其制造方法 |
| CNB2004100368185A CN100359678C (zh) | 1996-03-18 | 1997-03-17 | 半导体器件 |
| US08/820,228 US6265762B1 (en) | 1996-03-18 | 1997-03-18 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
| US09/904,839 US6909179B2 (en) | 1996-03-18 | 2001-07-16 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
| KR1020040022788A KR100473261B1 (ko) | 1996-03-18 | 2004-04-02 | 반도체장치 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6042196 | 1996-03-18 | ||
| JP8-60421 | 1996-03-18 | ||
| JP9008964A JPH09312375A (ja) | 1996-03-18 | 1997-01-21 | リードフレーム、半導体装置及び半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004012736A Division JP4015118B2 (ja) | 1996-03-18 | 2004-01-21 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09312375A true JPH09312375A (ja) | 1997-12-02 |
| JPH09312375A5 JPH09312375A5 (enExample) | 2004-12-24 |
Family
ID=26343600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9008964A Pending JPH09312375A (ja) | 1996-03-18 | 1997-01-21 | リードフレーム、半導体装置及び半導体装置の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6265762B1 (enExample) |
| JP (1) | JPH09312375A (enExample) |
| KR (2) | KR100475265B1 (enExample) |
| CN (2) | CN100359678C (enExample) |
| MY (1) | MY121618A (enExample) |
| TW (1) | TW347585B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176131A (ja) * | 2000-12-08 | 2002-06-21 | Hitachi Ltd | 半導体装置の製造方法 |
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|---|---|---|---|---|
| US6692989B2 (en) * | 1999-10-20 | 2004-02-17 | Renesas Technology Corporation | Plastic molded type semiconductor device and fabrication process thereof |
| JPH11274196A (ja) * | 1998-03-26 | 1999-10-08 | Seiko Epson Corp | 半導体装置の製造方法およびモールドシステム並びに半導体装置 |
| KR100350046B1 (ko) * | 1999-04-14 | 2002-08-24 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 방열판이 부착된 반도체패키지 |
| US6975021B1 (en) * | 1999-09-03 | 2005-12-13 | Micron Technology, Inc. | Carrier for substrate film |
| JP2001230360A (ja) * | 2000-02-18 | 2001-08-24 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
| US7199477B1 (en) * | 2000-09-29 | 2007-04-03 | Altera Corporation | Multi-tiered lead package for an integrated circuit |
| JP2002134674A (ja) * | 2000-10-20 | 2002-05-10 | Hitachi Ltd | 半導体装置およびその製造方法 |
| TW462120B (en) * | 2000-11-10 | 2001-11-01 | Siliconware Precision Industries Co Ltd | Tape carrier type semiconductor package structure |
| JP3812447B2 (ja) * | 2002-01-28 | 2006-08-23 | 富士電機デバイステクノロジー株式会社 | 樹脂封止形半導体装置 |
| KR100477020B1 (ko) * | 2002-12-16 | 2005-03-21 | 삼성전자주식회사 | 멀티 칩 패키지 |
| US7239024B2 (en) * | 2003-04-04 | 2007-07-03 | Thomas Joel Massingill | Semiconductor package with recess for die |
| US20050230821A1 (en) * | 2004-04-15 | 2005-10-20 | Kheng Lee T | Semiconductor packages, and methods of forming semiconductor packages |
| US7511364B2 (en) * | 2004-08-31 | 2009-03-31 | Micron Technology, Inc. | Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same |
| US7388283B2 (en) * | 2005-02-04 | 2008-06-17 | Avago Technologies Ecbu Ip Pte Ltd | Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe |
| JP2006278407A (ja) * | 2005-03-28 | 2006-10-12 | Renesas Technology Corp | 半導体装置の製造方法 |
| US8110913B2 (en) * | 2007-06-29 | 2012-02-07 | Stats Chippac Ltd. | Integrated circuit package system with integral inner lead and paddle |
| US7750444B2 (en) * | 2008-05-19 | 2010-07-06 | Powertech Technology Inc. | Lead-on-chip semiconductor package and leadframe for the package |
| US9337240B1 (en) * | 2010-06-18 | 2016-05-10 | Altera Corporation | Integrated circuit package with a universal lead frame |
| CN102332441B (zh) * | 2010-07-12 | 2014-05-14 | 无锡华润安盛科技有限公司 | 一种高线位封装形式的引线框及其封装结构 |
| US8450841B2 (en) * | 2011-08-01 | 2013-05-28 | Freescale Semiconductor, Inc. | Bonded wire semiconductor device |
| US8841758B2 (en) * | 2012-06-29 | 2014-09-23 | Freescale Semiconductor, Inc. | Semiconductor device package and method of manufacture |
| JP6100648B2 (ja) | 2013-08-28 | 2017-03-22 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
| CN108735701B (zh) * | 2017-04-13 | 2021-12-24 | 恩智浦美国有限公司 | 具有用于包封期间的毛刺缓解的虚设引线的引线框架 |
| US12400992B2 (en) * | 2022-06-01 | 2025-08-26 | Nanya Technology Corporation | Semiconductor device with supporter against which bonding wire is disposed and method for preparing the same |
| US20230395558A1 (en) * | 2022-06-01 | 2023-12-07 | Nanya Technology Corporation | Semiconductor device with supporter against which bonding wire is disposed |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59105349A (ja) * | 1982-12-08 | 1984-06-18 | Hitachi Ltd | 集積回路装置 |
| JP2637247B2 (ja) * | 1989-09-12 | 1997-08-06 | 株式会社東芝 | 樹脂封止型半導体装置 |
| US4992628A (en) * | 1990-05-07 | 1991-02-12 | Kyocera America, Inc. | Ceramic-glass integrated circuit package with ground plane |
| JPH04162556A (ja) * | 1990-10-25 | 1992-06-08 | Mitsubishi Electric Corp | リードフレーム及びその製造方法 |
| US5245214A (en) * | 1991-06-06 | 1993-09-14 | Northern Telecom Limited | Method of designing a leadframe and a leadframe created thereby |
| US5510649A (en) * | 1992-05-18 | 1996-04-23 | Motorola, Inc. | Ceramic semiconductor package having varying conductive bonds |
| JPH07231007A (ja) * | 1994-02-15 | 1995-08-29 | Toshiba Corp | 半導体装置 |
| JPH0837252A (ja) * | 1994-07-22 | 1996-02-06 | Nec Corp | 半導体装置 |
| US5818114A (en) * | 1995-05-26 | 1998-10-06 | Hewlett-Packard Company | Radially staggered bond pad arrangements for integrated circuit pad circuitry |
| JPH0945723A (ja) * | 1995-07-31 | 1997-02-14 | Rohm Co Ltd | 半導体チップおよびこの半導体チップを組み込んだ半導体装置ならびにその製造方法 |
| US5691567A (en) * | 1995-09-19 | 1997-11-25 | National Semiconductor Corporation | Structure for attaching a lead frame to a heat spreader/heat slug structure |
| US5905299A (en) * | 1996-01-05 | 1999-05-18 | Texas Instruments, Inc. | Thermally enhanced thin quad flatpack package |
| US5771157A (en) * | 1996-03-08 | 1998-06-23 | Honeywell, Inc. | Chip-on-board printed circuit assembly using aluminum wire bonded to copper pads |
-
1997
- 1997-01-21 JP JP9008964A patent/JPH09312375A/ja active Pending
- 1997-03-05 TW TW086102661A patent/TW347585B/zh not_active IP Right Cessation
- 1997-03-12 MY MYPI97001026A patent/MY121618A/en unknown
- 1997-03-14 KR KR1019970008685A patent/KR100475265B1/ko not_active Expired - Fee Related
- 1997-03-17 CN CNB2004100368185A patent/CN100359678C/zh not_active Expired - Fee Related
- 1997-03-17 CN CNB971033129A patent/CN1156910C/zh not_active Expired - Fee Related
- 1997-03-18 US US08/820,228 patent/US6265762B1/en not_active Expired - Lifetime
-
2004
- 2004-04-02 KR KR1020040022788A patent/KR100473261B1/ko not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176131A (ja) * | 2000-12-08 | 2002-06-21 | Hitachi Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100473261B1 (ko) | 2005-03-14 |
| US6265762B1 (en) | 2001-07-24 |
| KR970067736A (ko) | 1997-10-13 |
| CN1595646A (zh) | 2005-03-16 |
| MY121618A (en) | 2006-02-28 |
| CN100359678C (zh) | 2008-01-02 |
| CN1156910C (zh) | 2004-07-07 |
| TW347585B (en) | 1998-12-11 |
| KR100475265B1 (ko) | 2005-07-01 |
| CN1164127A (zh) | 1997-11-05 |
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