KR100357022B1 - 데이타 입출력시의 동작 주파수 마진이 개선된 동기형 반도체기억 장치 - Google Patents

데이타 입출력시의 동작 주파수 마진이 개선된 동기형 반도체기억 장치 Download PDF

Info

Publication number
KR100357022B1
KR100357022B1 KR1019990017539A KR19990017539A KR100357022B1 KR 100357022 B1 KR100357022 B1 KR 100357022B1 KR 1019990017539 A KR1019990017539 A KR 1019990017539A KR 19990017539 A KR19990017539 A KR 19990017539A KR 100357022 B1 KR100357022 B1 KR 100357022B1
Authority
KR
South Korea
Prior art keywords
data
circuit
output
input
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019990017539A
Other languages
English (en)
Korean (ko)
Other versions
KR20000005666A (ko
Inventor
오오이시츠카사
Original Assignee
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26493088&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100357022(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 미쓰비시덴키 가부시키가이샤 filed Critical 미쓰비시덴키 가부시키가이샤
Publication of KR20000005666A publication Critical patent/KR20000005666A/ko
Application granted granted Critical
Publication of KR100357022B1 publication Critical patent/KR100357022B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1093Input synchronization
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/10Test algorithms, e.g. memory scan [MScan] algorithms; Test patterns, e.g. checkerboard patterns 
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/38Response verification devices
    • G11C29/40Response verification devices using compression techniques
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/48Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • G11C7/106Data output latches
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1072Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers for memories with random access ports synchronised on clock signal pulse trains, e.g. synchronous memories, self timed memories
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1087Data input latches
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2207/00Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
    • G11C2207/10Aspects relating to interfaces of memory device to external buses
    • G11C2207/108Wide data ports

Landscapes

  • Dram (AREA)
  • Static Random-Access Memory (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
KR1019990017539A 1998-06-17 1999-05-17 데이타 입출력시의 동작 주파수 마진이 개선된 동기형 반도체기억 장치 Expired - Fee Related KR100357022B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1998-169881 1998-06-17
JP16988198 1998-06-17
JP10269761A JP2000076853A (ja) 1998-06-17 1998-09-24 同期型半導体記憶装置
JP1998-269761 1998-09-24

Publications (2)

Publication Number Publication Date
KR20000005666A KR20000005666A (ko) 2000-01-25
KR100357022B1 true KR100357022B1 (ko) 2002-10-18

Family

ID=26493088

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990017539A Expired - Fee Related KR100357022B1 (ko) 1998-06-17 1999-05-17 데이타 입출력시의 동작 주파수 마진이 개선된 동기형 반도체기억 장치

Country Status (3)

Country Link
US (3) US6324118B1 (enExample)
JP (1) JP2000076853A (enExample)
KR (1) KR100357022B1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100991308B1 (ko) 2008-05-20 2010-11-01 주식회사 하이닉스반도체 불휘발성 메모리 소자 및 그 테스트 방법
US7881127B2 (en) 2008-05-20 2011-02-01 Hynix Semiconductor Inc. Nonvolatile memory device and method of testing the same

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6295618B1 (en) * 1998-08-25 2001-09-25 Micron Technology, Inc. Method and apparatus for data compression in memory devices
DE10014386A1 (de) * 2000-03-23 2001-09-27 Infineon Technologies Ag Integrierte Schaltung mit Ansteuerschaltung zur Ansteuerung einer Treiberschaltung
JP2001297595A (ja) * 2000-04-13 2001-10-26 Mitsubishi Electric Corp 半導体記憶装置及び半導体集積回路装置
JP4011833B2 (ja) * 2000-06-30 2007-11-21 株式会社東芝 半導体メモリ
JP4600792B2 (ja) * 2000-07-13 2010-12-15 エルピーダメモリ株式会社 半導体装置
DE10034852A1 (de) * 2000-07-18 2002-02-07 Infineon Technologies Ag Verfahren und Vorrichtung zum Einlesen und zur Überprüfung der zeitlichen Lage von aus einem zu testenden Speicherbaustein ausgelesenen Datenantwortsignalen
US6732305B2 (en) * 2000-10-05 2004-05-04 United Memories, Inc. Test interface for verification of high speed embedded synchronous dynamic random access memory (SDRAM) circuitry
JP4592179B2 (ja) * 2000-12-19 2010-12-01 ルネサスエレクトロニクス株式会社 ディレイロックドループ、当該ディレイロックドループを含む半導体装置およびクロック同期により動作するシステムのための制御方法
US6556494B2 (en) 2001-03-14 2003-04-29 Micron Technology, Inc. High frequency range four bit prefetch output data path
JP2003045200A (ja) * 2001-08-02 2003-02-14 Mitsubishi Electric Corp 半導体モジュールおよびそれに用いる半導体記憶装置
DE10146149B4 (de) * 2001-09-19 2004-04-29 Infineon Technologies Ag Schaltungsanordnung zum Empfang eines Datensignals
KR100403635B1 (ko) * 2001-11-06 2003-10-30 삼성전자주식회사 동기식 반도체 메모리 장치의 데이터 입력 회로 및 데이터입력 방법
JP3657234B2 (ja) * 2002-03-08 2005-06-08 Necマイクロシステム株式会社 非同期インタフェース装置及び非同期インタフェース方法
US6728156B2 (en) * 2002-03-11 2004-04-27 International Business Machines Corporation Memory array system
KR100482736B1 (ko) * 2002-09-12 2005-04-14 주식회사 하이닉스반도체 지연고정루프의 지연 모델 및 그의 튜닝 방법
JP2004178729A (ja) * 2002-11-28 2004-06-24 Hitachi Ltd 半導体記憶装置
KR20040067512A (ko) * 2003-01-23 2004-07-30 삼성전자주식회사 데이터 통신 시스템의 클럭 모니터링 장치
US6931479B2 (en) * 2003-03-04 2005-08-16 Micron Technology, Inc. Method and apparatus for multi-functional inputs of a memory device
JP4327482B2 (ja) * 2003-03-18 2009-09-09 富士通マイクロエレクトロニクス株式会社 同期型半導体記憶装置
JP2005078592A (ja) * 2003-09-03 2005-03-24 Brother Ind Ltd メモリ制御装置及び画像形成装置
US7143257B2 (en) * 2003-10-14 2006-11-28 Atmel Corporation Method and apparatus of a smart decoding scheme for fast synchronous read in a memory system
US6995554B2 (en) * 2004-06-16 2006-02-07 Agilent Technologies, Inc. Delay-locked loop and a method of testing a delay-locked loop
US7126874B2 (en) * 2004-08-31 2006-10-24 Micron Technology, Inc. Memory system and method for strobing data, command and address signals
US7212464B2 (en) * 2004-09-17 2007-05-01 Seiko Epson Corporation Semiconductor memory device having a plurality of latch circuits coupled to each read amplifier
KR100608371B1 (ko) * 2004-12-03 2006-08-08 주식회사 하이닉스반도체 메모리 장치의 데이타 출력 제어 방법 및 그 장치
US7461365B1 (en) * 2005-07-09 2008-12-02 Lightspeed Logic, Inc. Increased effective flip-flop density in a structured ASIC
JP2007064648A (ja) * 2005-08-29 2007-03-15 Nec Electronics Corp 半導体集積回路及びテスト方法
US7307913B2 (en) * 2005-09-29 2007-12-11 Hynix Semiconductor Inc. Clock control device for toggling an internal clock of a synchronous DRAM for reduced power consumption
KR100812600B1 (ko) * 2005-09-29 2008-03-13 주식회사 하이닉스반도체 주파수가 다른 복수의 클럭을 사용하는 반도체메모리소자
CN100527267C (zh) * 2006-02-28 2009-08-12 中国科学院计算技术研究所 Ddr和ddr2内存控制器的读数据采样方法及装置
US8332793B2 (en) * 2006-05-18 2012-12-11 Otrsotech, Llc Methods and systems for placement and routing
JP2008009991A (ja) * 2006-06-29 2008-01-17 Hynix Semiconductor Inc テスト用デュアルインラインメモリモジュール及びそのテストシステム
US7554858B2 (en) 2007-08-10 2009-06-30 Micron Technology, Inc. System and method for reducing pin-count of memory devices, and memory device testers for same
KR101529291B1 (ko) 2008-02-27 2015-06-17 삼성전자주식회사 플래시 메모리 장치 및 그것을 포함한 플래시 메모리시스템
US20090296514A1 (en) * 2008-05-29 2009-12-03 Chih-Hui Yeh Method for accessing a memory chip
JP5579972B2 (ja) * 2008-08-01 2014-08-27 ピーエスフォー ルクスコ エスエイアールエル 半導体記憶装置及び半導体記憶装置のテスト方法
JP5687412B2 (ja) 2009-01-16 2015-03-18 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. 半導体記憶装置及びそのリード待ち時間調整方法、メモリシステム、並びに半導体装置
JP5627197B2 (ja) 2009-05-26 2014-11-19 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. 半導体記憶装置及びこれを備える情報処理システム並びにコントローラ
JP2012112788A (ja) * 2010-11-24 2012-06-14 Seiko Instruments Inc テストモード設定回路
KR20130050776A (ko) * 2011-11-08 2013-05-16 에스케이하이닉스 주식회사 반도체 장치와 반도체 장치를 포함하는 반도체 시스템 및 그 동작방법
US8934317B2 (en) * 2012-01-13 2015-01-13 Samsung Electronics Co., Ltd. Semiconductor memory devices having internal clock signals and memory systems including such memory devices
US9350386B2 (en) 2012-04-12 2016-05-24 Samsung Electronics Co., Ltd. Memory device, memory system, and method of operating the same
US9749555B2 (en) * 2014-02-04 2017-08-29 Semiconductor Components Industries, Llc Arithmetic memory with horizontal binning capabilities for imaging systems
KR20160075175A (ko) * 2014-12-19 2016-06-29 에스케이하이닉스 주식회사 반도체 장치
US11487871B2 (en) * 2015-01-31 2022-11-01 San Diego Gas & Electric Company Methods and systems for detecting and defending against invalid time signals
US20160342540A1 (en) * 2015-05-21 2016-11-24 Qualcomm Innovation Center, Inc. Low latency memory and bus frequency scaling based upon hardware monitoring
KR102337044B1 (ko) * 2015-07-27 2021-12-09 에스케이하이닉스 주식회사 반도체장치 및 반도체시스템
US10474779B1 (en) * 2017-09-22 2019-11-12 Juniper Networks, Inc. Bisection methodology for on-chip variation tolerant clock signal distribution in an integrated circuit
US10437514B2 (en) * 2017-10-02 2019-10-08 Micron Technology, Inc. Apparatuses and methods including memory commands for semiconductor memories
KR20190058158A (ko) * 2017-11-21 2019-05-29 삼성전자주식회사 데이터 출력 회로, 데이터 출력 회로를 포함하는 메모리 장치 및 메모리 장치의 동작 방법
US10915474B2 (en) 2017-11-29 2021-02-09 Micron Technology, Inc. Apparatuses and methods including memory commands for semiconductor memories
US10395702B1 (en) * 2018-05-11 2019-08-27 Micron Technology, Inc. Memory device with a clocking mechanism
KR102889555B1 (ko) * 2019-08-26 2025-11-24 에스케이하이닉스 주식회사 테스트 회로, 이를 포함하는 반도체 장치 및 테스트 시스템
JP7385419B2 (ja) * 2019-10-15 2023-11-22 ルネサスエレクトロニクス株式会社 半導体装置
US12334146B1 (en) 2022-09-23 2025-06-17 Apple Inc. Power loss reduction in data storage arrays

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211763A (ja) * 1986-03-13 1987-09-17 Fujitsu Ltd 同期出力回路
JPH08138377A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 半導体記憶装置
JPH09120672A (ja) * 1995-10-20 1997-05-06 Nec Corp 同期式半導体メモリ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413740A (en) * 1977-07-04 1979-02-01 Nippon Telegr & Teleph Corp <Ntt> Memory unit
JP3346827B2 (ja) * 1993-05-25 2002-11-18 三菱電機株式会社 同期型半導体記憶装置
JPH07226100A (ja) * 1994-02-15 1995-08-22 Nec Corp 半導体メモリ装置
JP3577119B2 (ja) 1994-11-01 2004-10-13 株式会社ルネサステクノロジ 半導体記憶装置
JPH09223389A (ja) * 1996-02-15 1997-08-26 Mitsubishi Electric Corp 同期型半導体記憶装置
US6072743A (en) * 1998-01-13 2000-06-06 Mitsubishi Denki Kabushiki Kaisha High speed operable semiconductor memory device with memory blocks arranged about the center

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211763A (ja) * 1986-03-13 1987-09-17 Fujitsu Ltd 同期出力回路
JPH08138377A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 半導体記憶装置
JPH09120672A (ja) * 1995-10-20 1997-05-06 Nec Corp 同期式半導体メモリ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100991308B1 (ko) 2008-05-20 2010-11-01 주식회사 하이닉스반도체 불휘발성 메모리 소자 및 그 테스트 방법
US7881127B2 (en) 2008-05-20 2011-02-01 Hynix Semiconductor Inc. Nonvolatile memory device and method of testing the same

Also Published As

Publication number Publication date
KR20000005666A (ko) 2000-01-25
US6324118B1 (en) 2001-11-27
US20010015927A1 (en) 2001-08-23
US6330200B2 (en) 2001-12-11
US20020039315A1 (en) 2002-04-04
US6522598B2 (en) 2003-02-18
JP2000076853A (ja) 2000-03-14

Similar Documents

Publication Publication Date Title
KR100357022B1 (ko) 데이타 입출력시의 동작 주파수 마진이 개선된 동기형 반도체기억 장치
US6259647B1 (en) Synchronous semiconductor memory device allowing easy and fast test
US6894945B2 (en) Clock synchronous semiconductor memory device
US5835443A (en) High speed semiconductor memory with burst mode
KR100371425B1 (ko) 반도체 기억 장치 및 그의 제어 방법
JP4204685B2 (ja) 同期型半導体記憶装置
US7573778B2 (en) Semiconductor memory device
CN113129958B (zh) 用于宽时钟频率范围命令路径的设备和方法
KR20010014938A (ko) 높은 데이터 입출력 주파수를 가지며, 데이터 입출력에관한 회로의 테스트를 효율적으로 실행하는 것이 가능한반도체 기억 장치
US6807116B2 (en) Semiconductor circuit device capable of accurately testing embedded memory
US7304897B2 (en) Method and system for reading data from a memory
US20040246801A1 (en) Integrated circuit memory devices and operating methods that are configured to output data bits at a lower rate in a test mode of operation
JP4216405B2 (ja) ビルト−インパラレルテスト回路を備えた半導体メモリ装置
US6809975B2 (en) Semiconductor memory device having test mode and memory system using the same
US6732305B2 (en) Test interface for verification of high speed embedded synchronous dynamic random access memory (SDRAM) circuitry
US7406637B2 (en) Semiconductor memory device capable of testing memory cells at high speed
US8050135B2 (en) Semiconductor memory device
JP2000090696A (ja) 同期型半導体記憶装置
JP2000251496A (ja) 半導体集積回路装置
KR100374520B1 (ko) 테스트 기능을 갖는 반도체 집적 회로

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20080925

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20091005

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20091005