KR100338534B1 - 기판건조장치및기판건조방법 - Google Patents

기판건조장치및기판건조방법 Download PDF

Info

Publication number
KR100338534B1
KR100338534B1 KR1019940028107A KR19940028107A KR100338534B1 KR 100338534 B1 KR100338534 B1 KR 100338534B1 KR 1019940028107 A KR1019940028107 A KR 1019940028107A KR 19940028107 A KR19940028107 A KR 19940028107A KR 100338534 B1 KR100338534 B1 KR 100338534B1
Authority
KR
South Korea
Prior art keywords
liquid
processing
treatment
tank
processing liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940028107A
Other languages
English (en)
Korean (ko)
Other versions
KR950012610A (ko
Inventor
다나카히로시
모쿠오쇼리
요코미조겐지
미나미데루오미
Original Assignee
도오교오에레구토론큐우슈우가부시끼가이샤
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1697994A external-priority patent/JP3127073B2/ja
Priority claimed from JP04039694A external-priority patent/JP3273282B2/ja
Priority claimed from JP22116194A external-priority patent/JP3298037B2/ja
Application filed by 도오교오에레구토론큐우슈우가부시끼가이샤, 동경 엘렉트론 주식회사 filed Critical 도오교오에레구토론큐우슈우가부시끼가이샤
Publication of KR950012610A publication Critical patent/KR950012610A/ko
Application granted granted Critical
Publication of KR100338534B1 publication Critical patent/KR100338534B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • F26B21/145—Condensing the vapour onto the surface of the materials to be dried

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1019940028107A 1993-10-29 1994-10-29 기판건조장치및기판건조방법 Expired - Fee Related KR100338534B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP29433393 1993-10-29
JP93-294333 1993-10-29
JP94-16979 1994-01-17
JP1697994A JP3127073B2 (ja) 1994-01-17 1994-01-17 洗浄装置及び洗浄方法
JP94-40396 1994-02-15
JP04039694A JP3273282B2 (ja) 1994-02-15 1994-02-15 処理装置
JP94-221161 1994-08-23
JP22116194A JP3298037B2 (ja) 1994-08-23 1994-08-23 乾燥処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020010051301A Division KR100357316B1 (ko) 1993-10-29 2001-08-24 기판 건조장치 및 기판 건조방법

Publications (2)

Publication Number Publication Date
KR950012610A KR950012610A (ko) 1995-05-16
KR100338534B1 true KR100338534B1 (ko) 2002-09-27

Family

ID=27456687

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019940028107A Expired - Fee Related KR100338534B1 (ko) 1993-10-29 1994-10-29 기판건조장치및기판건조방법
KR1020010051301A Expired - Fee Related KR100357316B1 (ko) 1993-10-29 2001-08-24 기판 건조장치 및 기판 건조방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020010051301A Expired - Fee Related KR100357316B1 (ko) 1993-10-29 2001-08-24 기판 건조장치 및 기판 건조방법

Country Status (3)

Country Link
US (2) US5575079A (enExample)
KR (2) KR100338534B1 (enExample)
TW (1) TW294823B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140044135A (ko) * 2012-10-04 2014-04-14 세메스 주식회사 기판처리장치

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08189768A (ja) * 1994-11-07 1996-07-23 Ryoden Semiconductor Syst Eng Kk 蒸気乾燥装置、それを組込んだ洗浄装置および蒸気乾燥方法
US5730162A (en) * 1995-01-12 1998-03-24 Tokyo Electron Limited Apparatus and method for washing substrates
US5735962A (en) * 1996-01-11 1998-04-07 S3 Service Support Specialties, Inc. Silicon substrate cleaning method and apparatus
JPH10144650A (ja) * 1996-11-11 1998-05-29 Mitsubishi Electric Corp 半導体材料の洗浄装置
JP3230051B2 (ja) * 1997-05-16 2001-11-19 東京エレクトロン株式会社 乾燥処理方法及びその装置
JPH10321585A (ja) * 1997-05-22 1998-12-04 Mitsubishi Electric Corp 乾燥装置および乾燥方法
US6695926B1 (en) * 1997-07-09 2004-02-24 Ses Co., Ltd. Treatment method of semiconductor wafers and the like and treatment system for the same
JPH1126423A (ja) * 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
US5884640A (en) * 1997-08-07 1999-03-23 Applied Materials, Inc. Method and apparatus for drying substrates
US5807439A (en) * 1997-09-29 1998-09-15 Siemens Aktiengesellschaft Apparatus and method for improved washing and drying of semiconductor wafers
US6108932A (en) * 1998-05-05 2000-08-29 Steag Microtech Gmbh Method and apparatus for thermocapillary drying
US6158141A (en) * 1998-05-07 2000-12-12 Sony Corporation Apparatus and method for drying semiconductor substrate
US6368183B1 (en) 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
US6328814B1 (en) 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
US6192600B1 (en) 1999-09-09 2001-02-27 Semitool, Inc. Thermocapillary dryer
US7364625B2 (en) * 2000-05-30 2008-04-29 Fsi International, Inc. Rinsing processes and equipment
GB2368358B (en) * 2000-10-23 2004-10-13 Mastenbroek Ltd Trenching method and apparatus
KR100441790B1 (ko) * 2001-03-22 2004-07-27 에이에스엠 어쌤블리 오토메이션 리미티드 픽업 및 재치 장치와 그 방법
JP3958539B2 (ja) * 2001-08-02 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
KR100939596B1 (ko) * 2001-11-02 2010-02-01 어플라이드 머티어리얼스, 인코포레이티드 단일 웨이퍼 건조기 및 건조 방법
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
KR100599435B1 (ko) * 2004-05-17 2006-07-14 주식회사 하이닉스반도체 기판을 세정하기 위한 장치
US8028438B2 (en) * 2004-07-02 2011-10-04 Aqualizer, Llc Moisture condensation control system
KR20070112397A (ko) * 2005-05-12 2007-11-23 어플라이드 머티어리얼스, 인코포레이티드 클리닝 모듈 내로의 반도체 기판의 수직 이송 방법 및 장치
KR100928495B1 (ko) * 2005-06-20 2009-11-26 엘지디스플레이 주식회사 배향막 인쇄 마스크용 지그 장치와, 이를 적용한 배향막인쇄 마스크용 세정 장비 및 이를 이용한 마스크 세정 방법
KR101133394B1 (ko) 2005-06-22 2012-04-09 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법과 컴퓨터 판독 가능한 기억 매체
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP4527670B2 (ja) * 2006-01-25 2010-08-18 東京エレクトロン株式会社 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体
US20080066339A1 (en) * 2006-09-14 2008-03-20 Mike Wallis Apparatus and method for drying a substrate
US8474468B2 (en) * 2006-09-30 2013-07-02 Tokyo Electron Limited Apparatus and method for thermally processing a substrate with a heated liquid
KR100875790B1 (ko) 2006-12-22 2008-12-26 동부일렉트로닉스 주식회사 반도체 제조설비용 액조
JP4805862B2 (ja) * 2007-02-21 2011-11-02 富士通セミコンダクター株式会社 基板処理装置、基板処理方法、及び半導体装置の製造方法
US7479463B2 (en) * 2007-03-09 2009-01-20 Tokyo Electron Limited Method for heating a chemically amplified resist layer carried on a rotating substrate
US9383138B2 (en) * 2007-03-30 2016-07-05 Tokyo Electron Limited Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
US20080241400A1 (en) * 2007-03-31 2008-10-02 Tokyo Electron Limited Vacuum assist method and system for reducing intermixing of lithography layers
US8002901B1 (en) 2009-01-15 2011-08-23 Wd Media, Inc. Temperature dependent pull speeds for drying of a wet cleaned workpiece
US8171949B1 (en) 2009-03-06 2012-05-08 Wd Media, Inc. Fluid flow management
JP5318670B2 (ja) * 2009-06-09 2013-10-16 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラムおよび記憶媒体
US20110186088A1 (en) * 2010-01-31 2011-08-04 Miller Kenneth C Substrate nest with drip remover
JP5477131B2 (ja) * 2010-04-08 2014-04-23 東京エレクトロン株式会社 基板処理装置
US8790531B2 (en) * 2011-07-08 2014-07-29 Alvin Gabriel Stern High purity, environmentally clean method and apparatus, for high rate, liquid anisotropic etching of single crystal silicon or etching of polycrystalline silicon, using an overpressure of ammonia gas above aqueous ammonium hydroxide
US9829249B2 (en) * 2015-03-10 2017-11-28 Mei, Llc Wafer dryer apparatus and method
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
KR101860631B1 (ko) * 2015-04-30 2018-05-23 시바우라 메카트로닉스 가부시끼가이샤 기판 처리 장치 및 기판 처리 방법
JP6367763B2 (ja) * 2015-06-22 2018-08-01 株式会社荏原製作所 ウェーハ乾燥装置およびウェーハ乾燥方法
DE102015214711A1 (de) 2015-07-31 2017-02-02 Dürr Systems Ag Behandlungsanlage und Verfahren zum Behandeln von Werkstücken
DE102015214706A1 (de) * 2015-07-31 2017-02-02 Dürr Systems Ag Behandlungsanlage und Verfahren zum Behandeln von Werkstücken
JP6659368B2 (ja) * 2016-01-15 2020-03-04 株式会社荏原製作所 洗浄装置、基板処理装置、および基板処理方法
JP6568838B2 (ja) * 2016-10-18 2019-08-28 上村工業株式会社 乾燥装置
US10775057B2 (en) 2018-08-20 2020-09-15 Therma-Stor, Llc Dehumidification drainage system with mist eliminator
JP7660446B2 (ja) * 2021-06-29 2025-04-11 株式会社荏原製作所 基板乾燥装置
CN115881578A (zh) * 2021-09-29 2023-03-31 盛美半导体设备(上海)股份有限公司 基板处理装置
KR102776612B1 (ko) * 2022-12-29 2025-03-07 세메스 주식회사 기판 처리 장치 및 그 제어 방법
KR102715178B1 (ko) * 2024-04-08 2024-10-11 주식회사 에이아이로보틱스 탈이온수 수조가 결합된 웨이퍼 이송용 자율주행 차량
US20250357099A1 (en) * 2024-05-16 2025-11-20 Tokyo Electron Limited Wafer cleaning method and system

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123324A (ja) * 1984-07-11 1986-01-31 Hitachi Ltd 乾燥装置
US4601115A (en) * 1985-04-26 1986-07-22 Westinghouse Electric Corp. Method and apparatus for steam drying of low-rank coals using a rotary cylindrical vessel
JPS62106630A (ja) * 1985-11-05 1987-05-18 Hitachi Ltd 処理装置
US5142873A (en) * 1990-02-15 1992-09-01 E. I. Du Pont De Nemours And Company Vapor control system for vapor degreasing/defluxing equipment
US5371950A (en) * 1990-02-23 1994-12-13 S & K Products International, Inc. Isopropyl alcohol vapor dryer system
US5054210A (en) * 1990-02-23 1991-10-08 S&K Products International, Inc. Isopropyl alcohol vapor dryer system
US5246023A (en) * 1990-04-24 1993-09-21 Electronic Controls Design, Inc. Method and apparatus to clean and cleanliness test printed circuit boards
US5456022A (en) * 1992-01-13 1995-10-10 Jwi, Inc. Batch-type sludge drier
US5243769A (en) * 1992-06-26 1993-09-14 Yazaki Corporation Process for rapidly drying a wet, porous gel monolith
JP2902222B2 (ja) * 1992-08-24 1999-06-07 東京エレクトロン株式会社 乾燥処理装置
JP3003016B2 (ja) * 1992-12-25 2000-01-24 東京エレクトロン株式会社 処理装置及び処理方法
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140044135A (ko) * 2012-10-04 2014-04-14 세메스 주식회사 기판처리장치
KR102081709B1 (ko) 2012-10-04 2020-02-27 세메스 주식회사 기판처리장치 및 약액냉각방법

Also Published As

Publication number Publication date
KR100357316B1 (ko) 2002-10-19
KR950012610A (ko) 1995-05-16
TW294823B (enExample) 1997-01-01
US5671544A (en) 1997-09-30
US5575079A (en) 1996-11-19

Similar Documents

Publication Publication Date Title
KR100338534B1 (ko) 기판건조장치및기판건조방법
KR100417271B1 (ko) 건조처리방법 및 건조처리장치
US5371950A (en) Isopropyl alcohol vapor dryer system
KR100406337B1 (ko) 기판이송및처리시스템
KR100236411B1 (ko) 기판 건조장치
US4979464A (en) Apparatus for treating wafers in the manufacture of semiconductor elements
JP3110218B2 (ja) 半導体洗浄装置及び方法、ウエハカセット、専用グローブ並びにウエハ受け治具
KR100376036B1 (ko) 기판세정방법및장치,기판세정/건조방법및장치
KR100887360B1 (ko) 기판처리장치 및 기판처리방법
US7171973B2 (en) Substrate processing apparatus
KR19980025067A (ko) 세정장치 및 세정방법
KR100407868B1 (ko) 세정장치
KR100360015B1 (ko) 세정장치
JP3543995B2 (ja) 処理装置
JP3200291B2 (ja) 洗浄装置
JP3892687B2 (ja) 基板処理装置及び基板処理方法
US6658764B2 (en) Apparatus and method for preventing droplets on wafers during solvent drying process
JP3172023B2 (ja) 洗浄装置
KR0118207B1 (ko) 반도체 세정장치 및 웨이퍼카세트
JP2008147303A (ja) 基板処理装置
KR100306087B1 (ko) 세정장치
KR102713118B1 (ko) 기판처리장치
CN114695190B (zh) 用于处理基板的设备和方法
KR20230101633A (ko) 기판 처리 장치 및 방법
JPH0861853A (ja) 乾燥処理装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

A107 Divisional application of patent
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20080508

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20090518

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20090518